公开(公告)号：US11164748B2

公开(公告)日：2021-11-02

申请号：US16256194

申请日：2019-01-24

Applicant: Semsysco GmbH

Inventor： Franz Markut ,  Thomas Wirnsberger ,  Oliver Knoll ,  Andreas Gleissner ,  Harald Okorn-Schmidt ,  Philipp Engesser

IPC: H01L21/288 ,  C25D17/00 ,  C25D21/12 ,  C25D5/02 ,  C25D7/12 ,  C25D5/34 ,  C25D21/04 ,  C25D5/00 ,  H01L21/768 ,  H05K3/42 ,  B05C3/00 ,  B05C3/02 ,  B05C9/14

Abstract: The invention relates to a method for plating a recess in a substrate, a device for plating a recess in a substrate and a system for plating a recess in a substrate comprising the device. The method for plating a recess in a substrate comprises the following steps: a) Providing a substrate with a substrate surface comprising at least one recess, b) applying a replacement gas to the recess to replace an amount of ambient gas in the recess to at least partially clear the recess from the ambient gas, c) applying a processing fluid to the recess, wherein the replacement gas dissolves in the processing fluid to at least partially clear the recess from the replacement gas, and d) plating the recess.

公开(公告)号：US11965263B2

公开(公告)日：2024-04-23

申请号：US17794517

申请日：2020-09-02

Applicant: SEMSYSCO GMBH

Inventor： Herbert Ötzlinger ,  Oliver Knoll ,  Raoul Schröder ,  Markus Gersdorff ,  Thomas Wirnsberger ,  Georg Hofer ,  Andreas Gleissner

IPC: C25D17/06 ,  C25D17/00

CPC classification number: C25D17/06 ,  C25D17/004

Abstract: The invention relates to a substrate holding and locking system for chemical and/or electrolytic surface treatment of a substrate in a process fluid and a corresponding method. The system comprises a first element, a second element, a reduced pressure holding unit and a magnetic locking unit. The first element and the second element are configured to hold the substrate between each other. The reduced pressure holding unit comprises a pump to reduce an interior pressure inside the substrate holding and locking system below atmospheric pressure. The magnetic locking unit is configured to lock the first element and the second element with each other. The magnetic locking unit comprises a magnet control and at least a magnet. The magnet is arranged at one of the first element and the second element. The magnet control is configured to control a magnetic force between the first element and the second element.

公开(公告)号：US20190228975A1

公开(公告)日：2019-07-25

申请号：US16256194

申请日：2019-01-24

Applicant: Semsysco GmbH

Inventor： Franz Markut ,  Thomas Wirnsberger ,  Oliver Knoll ,  Andreas Gleissner ,  Harald Okorn-Schmidt ,  Philipp Engesser

IPC: H01L21/288 ,  C25D7/12 ,  C25D17/00 ,  C25D5/02 ,  C25D21/12

Abstract: The invention relates to a method for plating a recess in a substrate, a device for plating a recess in a substrate and a system for plating a recess in a substrate comprising the device. The method for plating a recess in a substrate comprises the following steps: a) Providing a substrate with a substrate surface comprising at least one recess, b) applying a replacement gas to the recess to replace an amount of ambient gas in the recess to at least partially clear the recess from the ambient gas, c) applying a processing fluid to the recess, wherein the replacement gas dissolves in the processing fluid to at least partially clear the recess from the replacement gas, and d) plating the recess.

公开(公告)号：US11938522B2

公开(公告)日：2024-03-26

申请号：US17787876

申请日：2020-12-01

Applicant: SEMSYSCO GMBH

Inventor： Andreas Gleissner ,  Herbert Ötzlinger ,  Raoul Schröder ,  Oliver Knoll

IPC: B08B3/02 ,  B08B3/08 ,  B08B3/12 ,  H01L21/67

CPC classification number: B08B3/02 ,  B08B3/08 ,  B08B3/12 ,  B08B2203/02 ,  H01L21/67057 ,  H01L21/67086

Abstract: The invention relates to a module for chemically processing a substrate, a method for chemically processing a substrate and a use of a module for chemically processing a substrate and in particular a large substrate. The module for chemically processing a substrate comprises: an immersion chamber, a spray unit, and a motion unit (14). The immersion chamber is configured to receive a first liquid and the substrate, so that the substrate is immersed in the liquid. The spray unit comprises a plurality of spray nozzles, which are configured to spray a second liquid within the immersion chamber. The motion unit is configured to provide a relative motion between the substrate and the spray unit.

公开(公告)号：US11908698B2

公开(公告)日：2024-02-20

申请号：US17491692

申请日：2021-10-01

Applicant: SEMSYSCO GMBH

Inventor： Franz Markut ,  Thomas Wirnsberger ,  Oliver Knoll ,  Andreas Gleissner ,  Harald Okorn-Schmidt ,  Philipp Engesser

IPC: C25D5/34 ,  H01L21/288 ,  C25D7/12 ,  C25D5/02 ,  C25D17/00 ,  C25D21/04 ,  C25D5/00 ,  H01L21/768 ,  H05K3/42 ,  B05C3/00 ,  B05C3/02 ,  B05C9/14 ,  C25D21/12

CPC classification number: H01L21/2885 ,  B05C3/005 ,  B05C3/02 ,  B05C9/14 ,  C25D5/003 ,  C25D5/02 ,  C25D5/34 ,  C25D7/123 ,  C25D17/001 ,  C25D21/04 ,  C25D21/12 ,  H01L21/76877 ,  H05K3/42

Abstract: The invention relates to a method for plating a recess in a substrate, a device for plating a recess in a substrate and a system for plating a recess in a substrate comprising the device. The method for plating a recess in a substrate comprises the following steps:



Providing a substrate with a substrate surface comprising at least one recess,
applying a replacement gas to the recess to replace an amount of ambient gas in the recess to at least partially clear the recess from the ambient gas,
applying a processing fluid to the recess, wherein the replacement gas dissolves in the processing fluid to at least partially clear the recess from the replacement gas, and
plating the recess.

公开(公告)号：US20220020591A1

公开(公告)日：2022-01-20

申请号：US17491692

申请日：2021-10-01

Applicant: SEMSYSCO GMBH

Inventor： Franz Markut ,  Thomas Wirnsberger ,  Oliver Knoll ,  Andreas Gleissner ,  Harald Okom-Schmidt ,  Philipp Engesser

IPC: H01L21/288 ,  C25D7/12 ,  C25D5/02 ,  C25D17/00 ,  C25D5/34 ,  C25D21/04 ,  C25D5/00 ,  H01L21/768 ,  H05K3/42 ,  B05C3/00 ,  B05C3/02 ,  B05C9/14 ,  C25D21/12

Abstract: The teaching relates to a method for plating a recess in a substrate, a device for plating a recess in a substrate and a system for plating a recess in a substrate comprising the device. The method for plating a recess in a substrate includes the following:
a) Providing a substrate with a substrate surface comprising at least one recess, b) applying a replacement gas to the recess to replace an amount of ambient gas in the recess to at least partially clear the recess from the ambient gas, c) applying a processing fluid to the recess, wherein the replacement gas dissolves in the processing fluid to at least partially clear the recess from the replacement gas, and d) plating the recess.