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8 条记录 (耗时 0.021 秒)

    Stem
    2.
    发明授权
    Stem 有权

    公开(公告)号：US10945337B2

    公开(公告)日：2021-03-09

    申请号：US16702705

    申请日：2019-12-04

    申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.

    发明人： Takumi Ikeda ,  Yasuyuki Kimura ,  HanSu Kim ,  HaeRyong Ahn

    IPC分类号： H05K1/18 ,  H05K1/02 ,  H05K1/11

    摘要： A stem has a stem body that has a first surface to be placed on a flexible substrate, a second surface opposite to the first surface, and a through hole passing through the first surface and the second surface, a cylindrical body that is fitted into the through hole of the stem body, and a lead that is inserted into the cylindrical body and fixed to the cylindrical body with a fixing member and that has an end portion protruding from the first surface of the stem body. The cylindrical body has a protrusion that protrudes toward the flexible substrate from the first surface of the stem body and surrounds an outer circumferential surface of the end portion of the lead.

    Header for semiconductor package, and semiconductor package
    3.
    发明授权
    Header for semiconductor package, and semiconductor package 有权

    公开(公告)号：US11923652B2

    公开(公告)日：2024-03-05

    申请号：US17197434

    申请日：2021-03-10

    申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.

    发明人： Yasuyuki Kimura ,  Takumi Ikeda

    IPC分类号： H01S5/02315 ,  H01S5/024

    CPC分类号： H01S5/02315 ,  H01S5/02415

    摘要： A header for a semiconductor package, includes an eyelet having an upper surface, and a lower surface on an opposite side from the upper surface, a metal block having a side surface, and configured to protrude from the upper surface of the eyelet, a lead sealed in a through hole which penetrates the eyelet from the upper surface to the lower surface of the eyelet, and a substrate having a front surface formed with a signal pattern electrically connected to the lead, and a back surface on an opposite side from the front surface. The back surface of the substrate is fixed to the side surface of the metal block. A portion of the back surface of the substrate is exposed from the metal block, and this portion of the substrate is formed with a ground pattern.

    STEM
    4.
    发明申请
    STEM 审中-公开

    公开(公告)号：US20200187361A1

    公开(公告)日：2020-06-11

    申请号：US16702705

    申请日：2019-12-04

    申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.

    发明人： Takumi Ikeda ,  Yasuyuki Kimura ,  HanSu Kim ,  HaeRyong Ahn

    IPC分类号： H05K1/18 ,  H05K1/11 ,  H05K1/02

    摘要： A stem has a stem body that has a first surface to be placed on a flexible substrate, a second surface opposite to the first surface, and a through hole passing through the first surface and the second surface, a cylindrical body that is fitted into the through hole of the stem body, and a lead that is inserted into the cylindrical body and fixed to the cylindrical body with a fixing member and that has an end portion protruding from the first surface of the stem body. The cylindrical body has a protrusion that protrudes toward the flexible substrate from the first surface of the stem body and surrounds an outer circumferential surface of the end portion of the lead.

    SEMICONDUCTOR DEVICE HEADER AND SEMICONDUCTOR DEVICE
    5.
    发明申请
    SEMICONDUCTOR DEVICE HEADER AND SEMICONDUCTOR DEVICE 审中-公开
    半导体器件头和半导体器件

    公开(公告)号：US20160352069A1

    公开(公告)日：2016-12-01

    申请号：US15165335

    申请日：2016-05-26

    申请人： Shinko Electric Industries Co., LTD.

    发明人： Yasuyuki Kimura ,  Takumi Ikeda ,  Masao Kainuma ,  Kazuya Terashima

    IPC分类号： H01S5/022 ,  H01S5/024

    CPC分类号： H01S5/02212 ,  H01L2224/48091 ,  H01S5/02268 ,  H01S5/02276 ,  H01S5/02469 ,  H01L2924/00014

    摘要： A semiconductor device header is provided with a base including a main body and a heat sink. A lead is inserted through a through hole extending through the main body. The is defined by a first opening and a second opening that opens in the upper surface of the main body. The second opening is in communication with the first opening and is smaller than the first opening in a plan view. The first opening is filled with an encapsulant that seals the lead. The second opening is filled with a covering material having a smaller relative permittivity than the encapsulant. The heat sink is located at a position partially overlapped with the first opening in a plan view and separated from the second opening in a plan view.

    摘要翻译： 半导体器件集管设置有包括主体和散热器的基座。 引线穿过延伸穿过主体的通孔插入。 由在主体的上表面中开口的第一开口和第二开口限定。 第二开口与第一开口连通并且在俯视图中小于第一开口。 第一个开口填充有密封铅的密封剂。 第二开口填充有比密封剂相对介电常数小的覆盖材料。 散热器位于与平面图中与第一开口部分重叠的位置，并且在俯视图中与第二开口分离。

    Header for semiconductor device, and semiconductor device
    6.
    发明授权
    Header for semiconductor device, and semiconductor device 有权

    公开(公告)号：US11153962B2

    公开(公告)日：2021-10-19

    申请号：US16829454

    申请日：2020-03-25

    申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.

    发明人： Yasuyuki Kimura ,  Takumi Ikeda

    IPC分类号： H01L23/492 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K7/14

    摘要： A header for a semiconductor device, includes a main body section having an upper surface, and a cavity formed in the upper surface, a heat dissipation section provided on the upper surface of the main body section, and a wiring board provided inside the cavity. The wiring board includes a substrate having a first principal surface, and a second principal surface provided on an opposite side from the first principal surface, a first conductor pattern provided on the first principal surface, and having a mounting section on which a semiconductor element is mounted, and a second conductor pattern provided on the second principal surface, and bonded to an inner wall surface of the cavity and the heat dissipation section. A portion of the first conductor pattern extends beyond the heat dissipation section when viewed in a thickness direction of the wiring board.