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22 条记录 (耗时 0.044 秒)

    Stem
    2.
    发明授权
    Stem 有权

    公开(公告)号：US10945337B2

    公开(公告)日：2021-03-09

    申请号：US16702705

    申请日：2019-12-04

    申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.

    发明人： Takumi Ikeda ,  Yasuyuki Kimura ,  HanSu Kim ,  HaeRyong Ahn

    IPC分类号： H05K1/18 ,  H05K1/02 ,  H05K1/11

    摘要： A stem has a stem body that has a first surface to be placed on a flexible substrate, a second surface opposite to the first surface, and a through hole passing through the first surface and the second surface, a cylindrical body that is fitted into the through hole of the stem body, and a lead that is inserted into the cylindrical body and fixed to the cylindrical body with a fixing member and that has an end portion protruding from the first surface of the stem body. The cylindrical body has a protrusion that protrudes toward the flexible substrate from the first surface of the stem body and surrounds an outer circumferential surface of the end portion of the lead.

    Optical element package and optical element device
    3.
    发明授权
    Optical element package and optical element device 有权

    公开(公告)号：US10389084B2

    公开(公告)日：2019-08-20

    申请号：US15341427

    申请日：2016-11-02

    申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.

    发明人： Yasuyuki Kimura

    IPC分类号： H01S5/022 ,  H01S5/024 ,  H01S5/026 ,  H01L31/02 ,  H01L31/16

    摘要： An optical element package includes: an eyelet including an upper surface and a lower surface opposite to the upper surface; a heat releasing part disposed on the upper surface of the eyelet; a through hole formed through the eyelet to extend from the upper surface of the eyelet to the lower surface of the eyelet; a lead sealed by a certain member provided in the through hole and including a lead portion extending from the lower surface of the eyelet and a lead wiring portion extending from the upper surface of the eyelet; and an insulating substrate disposed between the lead wiring portion and the heat releasing part and comprising a front surface and a back surface opposite to the front surface.

    Optical semiconductor device
    7.
    发明授权
    Optical semiconductor device 有权

    公开(公告)号：US09983363B2

    公开(公告)日：2018-05-29

    申请号：US15650857

    申请日：2017-07-15

    申请人： Shinko Electric Industries Co., Ltd.

    发明人： Yasuyuki Kimura

    IPC分类号： H01L21/00 ,  G02B6/38 ,  G02B6/42 ,  G02B6/122 ,  H01L23/14 ,  G02B6/13

    CPC分类号： G02B6/3839 ,  G02B6/1221 ,  G02B6/13 ,  G02B6/4214 ,  H01L23/142

    摘要： An optical semiconductor device includes a base, a wiring substrate, and a sub-mount. The base includes a bottom wall, a side wall projecting from a peripheral edge of the bottom wall, and a flange extending outward from an upper end of the side wall. The wiring substrate includes a distal portion inserted into and fixed to the base. An optical element is mounted on the sub-mount. The bottom wall of the base includes a first seat to which the sub-mount is fixed and a second seat to which the distal portion is fixed. The second seat is located at a higher position than the first seat. An upper surface of the distal portion of the wiring substrate includes a pad connected to the optical element. An upper surface of the pad of the distal portion is flush with an upper surface of an electrode of the optical element.

    Optical device package and optical device apparatus
    8.
    发明授权
    Optical device package and optical device apparatus 有权
    光学器件封装和光学器件设备

    公开(公告)号：US09588313B2

    公开(公告)日：2017-03-07

    申请号：US15083948

    申请日：2016-03-29

    申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.

    发明人： Yasuyuki Kimura

    IPC分类号： G02B6/36 ,  G02B6/42

    CPC分类号： G02B6/428 ,  G02B6/4204 ,  G02B6/4246 ,  G02B6/4269 ,  G02B6/4274

    摘要： An optical device package includes a metal base body including a cutout portion formed from an outer circumferential surface of the metal base body toward the center portion thereof, and a wiring board connected on a side surface of the cutout portion of the metal base body. The wiring board includes an optical device mounting region provided on a portion of the wiring board located inside the cutout portion of the metal base body, and a pad arranged on a portion of the wiring board located outside the optical device mounting region.

    摘要翻译： 光学器件封装包括金属基体，该金属基体包括从金属基体的外周面朝向其中心部形成的切口部，以及连接在金属基体的切口部的侧面的布线基板。 布线板包括设置在位于金属基体的切口部的内侧的布线基板的一部分上的光学装置安装区域和布置在位于光学装置安装区域外侧的布线基板的一部分上的焊盘。

    Header for semiconductor device, and semiconductor device
    10.
    发明授权
    Header for semiconductor device, and semiconductor device 有权

    公开(公告)号：US11153962B2

    公开(公告)日：2021-10-19

    申请号：US16829454

    申请日：2020-03-25

    申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.

    发明人： Yasuyuki Kimura ,  Takumi Ikeda

    IPC分类号： H01L23/492 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K7/14

    摘要： A header for a semiconductor device, includes a main body section having an upper surface, and a cavity formed in the upper surface, a heat dissipation section provided on the upper surface of the main body section, and a wiring board provided inside the cavity. The wiring board includes a substrate having a first principal surface, and a second principal surface provided on an opposite side from the first principal surface, a first conductor pattern provided on the first principal surface, and having a mounting section on which a semiconductor element is mounted, and a second conductor pattern provided on the second principal surface, and bonded to an inner wall surface of the cavity and the heat dissipation section. A portion of the first conductor pattern extends beyond the heat dissipation section when viewed in a thickness direction of the wiring board.