公开(公告)号：US20150232721A1

公开(公告)日：2015-08-20

申请号：US14440314

申请日：2015-05-01

申请人： SIKA TECHNOLOGY AG

发明人： Urs Burckhardt ,  Kai Paschkowski ,  Martin Linnenbrink ,  Sven Rosenau

IPC分类号： C09J175/04 ,  B32B37/12

CPC分类号： C09J175/04 ,  B32B37/1207 ,  B32B2037/1215 ,  B32B2037/1261 ,  B32B2375/00 ,  B32B2379/08 ,  C08G18/12 ,  C08G18/4202 ,  C08G18/503 ,  C08G2170/20 ,  Y10T428/249921 ,  Y10T428/31551 ,  C08G18/50

摘要： Described is moisture-reactive hot-melt adhesive compounds, including at least one polyurethane polymer P which is solid at room temperature and which has isocyanate groups, at least one polyaldimine ALD of the formula (Ia) or (Ib), and at least one acid K in the form of an organic monocarbon acid, or dicarbon acid, or an organic monosulphonic acid, or disulphonic acid, or a compound which can be hydrolyzed to give one of these acids. These hot-melt adhesive compounds cure without bubbles and exhibit exceptionally quick crosslinking speed and good strength after crosslinking.

摘要翻译： 描述了水分反应性热熔粘合剂化合物，其包括至少一种在室温下为固体并且具有异氰酸酯基团的至少一种聚氨酯聚合物P，至少一种式（Ia）或（Ib）的聚醛亚胺ALD和至少一种 有机单碳酸或二碳酸或有机单磺酸或二磺酸形式的酸K或可水解以得到这些酸之一的化合物。 这些热熔胶化合物无气泡固化，交联速度快，交联强度好。

公开(公告)号：US09932502B2

公开(公告)日：2018-04-03

申请号：US14709977

申请日：2015-05-12

申请人： Sika Technology AG

发明人： Doreen Janke ,  Kai Paschkowski

IPC分类号： C09J151/06 ,  C09J5/06 ,  B32B37/12 ,  B32B5/02 ,  B32B7/12 ,  B32B27/08 ,  B32B27/12 ,  B32B27/18 ,  B32B27/28 ,  B32B27/32 ,  C08L23/02 ,  C08L91/06

CPC分类号： C09J151/06 ,  B32B5/022 ,  B32B7/12 ,  B32B27/08 ,  B32B27/12 ,  B32B27/18 ,  B32B27/283 ,  B32B27/32 ,  B32B37/1207 ,  B32B2037/1215 ,  B32B2307/702 ,  B32B2383/00 ,  C08L23/02 ,  C08L91/06 ,  C09J5/06 ,  C09J2400/226 ,  C09J2400/263 ,  C09J2451/00 ,  C09J2451/003

摘要： A hot melt adhesive composition is provided which contains at least one silane group-containing thermoplastic poly-α-olefin which is solid at 25° C. and at least one paraffin wax. The hot melt adhesive composition has only low adhesion to uncoated aluminum tool surfaces, wherein at the same time they have high final strengths and thermal stabilities comparable to conventional adhesives, as well as good resistance to environmental influences. The hot melt adhesive is suitable as a laminating adhesive for laminating films made of thermoplastic olefins, which have sufficient stability for subsequent deep-draw lamination.

公开(公告)号：US20150225629A1

公开(公告)日：2015-08-13

申请号：US14424650

申请日：2013-09-11

申请人： SIKA TECHNOLOGY AG

发明人： Kai Paschkowski ,  Doreen Janke

IPC分类号： C09J151/00 ,  B32B27/32 ,  B32B17/06 ,  B32B37/06 ,  B32B27/08 ,  B32B37/18 ,  B32B37/12 ,  C09J123/02 ,  B32B5/18

CPC分类号： C09J151/003 ,  B32B5/18 ,  B32B17/064 ,  B32B27/08 ,  B32B27/32 ,  B32B37/06 ,  B32B37/1207 ,  B32B37/1284 ,  B32B37/18 ,  B32B37/182 ,  B32B2037/1215 ,  B32B2305/022 ,  B32B2305/18 ,  B32B2315/08 ,  B32B2317/16 ,  C08K5/0091 ,  C08L23/12 ,  C08L43/04 ,  C08L51/06 ,  C08L57/02 ,  C08L2205/025 ,  C08L2205/035 ,  C08L2207/14 ,  C08L2312/08 ,  C09J123/02 ,  C09J123/14 ,  C09J151/06 ,  Y10T428/249921 ,  Y10T428/249985 ,  Y10T428/31612 ,  Y10T428/31663

摘要： Hot-melt adhesive compositions are described that have at least one thermoplastic poly-α-olefin that is solid at 25° C. and silane groups, at least one thermoplastic poly-α-olefin that is solid at 25° C. and that does not contain silane groups, and at least one resin that is tackifying at 25° C. The product of the content of the thermoplastic poly-α-olefin with respect to the weight and the degree of grafting of the thermoplastic poly-α-olefin is ≦0.06. In comparison to conventional hot-melt adhesive compositions based on poly-α-olefins, the described hot-melt adhesive compositions are characterized in that the hot-melt adhesive compositions can be reactivated after the processing and cross-linking. That is, the compositions can be put into a liquid or soft state by means of heat and pressure and can be processed well again. At the same time, the described hot-melt adhesives have the physical processing properties characteristic of reactive polyolefin hot-melt adhesives, such as high initial heat resistance, high final strength and heat stability, and good resistance to environmental influences.

摘要翻译： 描述了具有至少一种在25℃下为固体的热塑性聚-α-烯烃和硅烷基团的热熔粘合剂组合物，至少一种在25℃下为固体的热塑性聚-α-烯烃， 不含硅烷基和至少一种在25℃下增粘的树脂。热塑性聚-α-烯烃的含量相对于热塑性聚-α-烯烃的重量和接枝度的乘积为 ＆nlE; 0.06。 与基于聚-α-烯烃的常规热熔粘合剂组合物相比，所述热熔粘合剂组合物的特征在于，热熔粘合剂组合物可以在加工和交联后再活化。 也就是说，组合物可以通过热和压力进入液体或软态，并且可以再次良好地加工。 同时，所述热熔粘合剂具有反应性聚烯烃热熔粘合剂的物理加工性能，如初始耐热性高，最终强度高，热稳定性好，耐环境性好。

公开(公告)号：US10767083B2

公开(公告)日：2020-09-08

申请号：US15753891

申请日：2016-09-13

申请人： SIKA TECHNOLOGY AG

发明人： Doreen Janke ,  Kai Paschkowski ,  Mathias Cordes ,  Dirk Urbach

IPC分类号： C09J5/06 ,  B32B27/32 ,  C09J123/14 ,  C08L23/14 ,  B32B27/36 ,  B32B27/30 ,  C08L51/06 ,  B32B27/12 ,  B32B7/12 ,  B32B27/34 ,  B32B15/085 ,  B32B37/12 ,  C08J5/12 ,  C09J123/02

摘要： A hot-melt glue composition, including a) at least one atactic poly-α-olefin (APAO) that is solid at 25° C.; b) at least one hydrocarbon resin having a softening point of at least 80° C., measured in accordance with the ring-and-ball method according to DIN EN 1238; and c) at least one maleic-anhydride-grafted wax having a softening point of not more than 150° C., measured in accordance with the ring-and-ball method according to DIN EN 1238, which is a maleic-anhydride-grafted polypropylene wax or a maleic-anhydride-grafted polyethylene wax, wherein the proportion of the at least one maleic-anhydride-grafted wax in the hot-melt glue composition is at least 3 wt %. The hot-melt glue composition is characterized by a low reactivation temperature, together with high heat resistance and good adhesion to ABS and nonpolar polyolefin materials. The hot-melt glue composition is well suited for film lamination by vacuum deep-drawing lamination, in particular for applications in automobile construction.

公开(公告)号：US10800957B2

公开(公告)日：2020-10-13

申请号：US15781685

申请日：2016-12-21

申请人： SIKA TECHNOLOGY AG

发明人： Martin Schmider ,  Kai Paschkowski ,  Jörg Plaumann

IPC分类号： C09J175/06 ,  C08G18/48 ,  C08G18/76 ,  C08G18/42 ,  C08G18/40 ,  C09J175/04 ,  C08K3/34 ,  C08L33/12 ,  C09J5/06 ,  C09J175/08 ,  C08K3/04 ,  C08K3/36

摘要： Solvent-free polyurethane hot melt adhesives which can be obtained by reacting a composition including a polyether polyol, a polyester polyol, at least one poly(meth)acrylate, and one or more fillers, selected from kaolin, fumed silica, soot, and wollastonite, with a polyisocyanate. In comparison to similar adhesives without a filler content, the adhesives are characterized by significantly improved heat resistance properties while the remaining properties are comparable. Furthermore, in some cases, improved mechanical properties, such as an improved tear strength, could be observed by adding the fillers. The aforementioned hot melt adhesive compositions are therefore suitable in particular for applications in automotive construction, in the textile industry, and in the packaging industry, and in particular for adhering sandwich panels.

公开(公告)号：US09982173B2

公开(公告)日：2018-05-29

申请号：US15125552

申请日：2015-03-05

申请人： SIKA TECHNOLOGY AG

发明人： Doreen Janke ,  Mathias Cordes ,  Kai Paschkowski

IPC分类号： C09J175/04 ,  C08G18/87 ,  C08G18/83 ,  C09J175/08 ,  C08G18/76 ,  C08G18/78 ,  C08G18/80 ,  C08G18/12 ,  C08G18/28 ,  C08G18/42 ,  C08G18/10 ,  C09J5/00 ,  C09J175/06

CPC分类号： C09J175/04 ,  C08G18/10 ,  C08G18/12 ,  C08G18/289 ,  C08G18/42 ,  C08G18/4202 ,  C08G18/7671 ,  C08G18/7843 ,  C08G18/809 ,  C08G18/837 ,  C08G2170/00 ,  C08G2170/20 ,  C09J5/00 ,  C09J7/38 ,  C09J175/06 ,  C09J175/08 ,  C09J2201/61 ,  C09J2475/00

摘要： A moisture-cured hot-melt adhesive can be formulated as a PUR-HM that is R-40 classification-free and stable during storage and processing, having a residual monomer content of less than 1 wt. % and having good cross-linking density and full-curing speed. The hot-melt adhesive is particularly suitable for vehicle construction in industrial manufacture, in particular of automobiles, in the textile or furniture industry or in the packaging industry.