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公开(公告)号：US09509278B2
公开(公告)日：2016-11-29
申请号：US13828066
申请日：2013-03-14
CPC分类号： H03H9/2457 , H03B5/30 , H03H9/02259 , H03H9/02275 , H03H9/2431 , H03H2009/02291 , H03H2009/02346 , H03H2009/02496
摘要： An apparatus includes a microelectromechanical system (MEMS) device. The MEMS device includes a resonator suspended from a substrate, an anchor disposed at a center of the resonator, a plurality of suspended beams radiating between the anchor and the resonator, a plurality of first electrodes disposed about the anchor, and a plurality of second electrodes disposed about the anchor. The plurality of first electrodes and the resonator form a first electrostatic transducer. The plurality of second electrodes and the resonator form a second electrostatic transducer. The first electrostatic transducer and the second electrostatic transducer are configured to sustain rotational vibrations of the resonator at a predetermined frequency about an axis through the center of the resonator and orthogonal to a plane of the substrate in response to a signal on the first electrode.
摘要翻译： 一种装置包括微机电系统（MEMS）装置。 MEMS器件包括从衬底悬挂的谐振器，设置在谐振器中心的锚，在锚和谐振器之间辐射的多个悬臂，围绕锚定器设置的多个第一电极和多个第二电极 围绕锚点布置。 多个第一电极和谐振器形成第一静电换能器。 多个第二电极和谐振器形成第二静电换能器。 第一静电换能器和第二静电换能器被配置为响应于第一电极上的信号，以围绕谐振器的中心的轴线以预定的频率维持谐振器的旋转振动并且与基板的平面正交。
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2.发明授权Methods and structures for thin-film encapsulation and co-integration of same with microelectronic devices and microelectromechanical systems (MEMS) 有权用于薄膜封装和与微电子器件和微机电系统（MEMS）相结合的方法和结构公开(公告)号：US09428377B2
公开(公告)日：2016-08-30
申请号：US14532658
申请日：2014-11-04
CPC分类号： B81C1/00246 , B81B3/0021 , B81B7/007 , B81B7/0077 , B81B7/008 , B81B2201/0214 , B81B2201/0235 , B81B2201/0264 , B81B2203/0127 , B81B2203/0315 , B81C1/00158 , B81C1/00269 , B81C1/00285 , B81C1/00333 , B81C1/0038 , B81C2201/0105 , B81C2201/056 , B81C2203/0118 , B81C2203/0136 , B81C2203/0172 , B81C2203/019 , B81C2203/0735 , G01N27/223 , G01N27/227
摘要： Methods and structures that may be implemented in one example to co-integrate processes for thin-film encapsulation and formation of microelectronic devices and microelectromechanical systems (MEMS) such as sensors and actuators. For example, structures having varying characteristics may be fabricated using the same basic process flow by selecting among different process options or modules for use with the basic process flow in order to create the desired structure/s. Various process flow sequences as well as a variety of device design structures may be advantageously enabled by the various disclosed process flow sequences.
摘要翻译： 可以在一个示例中实现的方法和结构，以共同整合用于薄膜封装和形成微电子器件和微机电系统（MEMS）例如传感器和致动器的过程。 例如，可以使用相同的基本工艺流程来制造具有不同特性的结构，通过选择与基本工艺流程一起使用的不同工艺选项或模块以便创建所需的结构。 可以通过各种公开的处理流程序列有利地实现各种处理流程序列以及各种设备设计结构。
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3.发明申请公开(公告)号：US20160023888A1
公开(公告)日：2016-01-28
申请号：US14532658
申请日：2014-11-04
CPC分类号： B81C1/00246 , B81B3/0021 , B81B7/007 , B81B7/0077 , B81B7/008 , B81B2201/0214 , B81B2201/0235 , B81B2201/0264 , B81B2203/0127 , B81B2203/0315 , B81C1/00158 , B81C1/00269 , B81C1/00285 , B81C1/00333 , B81C1/0038 , B81C2201/0105 , B81C2201/056 , B81C2203/0118 , B81C2203/0136 , B81C2203/0172 , B81C2203/019 , B81C2203/0735 , G01N27/223 , G01N27/227
摘要： Methods and structures that may be implemented in one example to co-integrate processes for thin-film encapsulation and formation of microelectronic devices and microelectromechanical systems (MEMS) such as sensors and actuators. For example, structures having varying characteristics may be fabricated using the same basic process flow by selecting among different process options or modules for use with the basic process flow in order to create the desired structure/s. Various process flow sequences as well as a variety of device design structures may be advantageously enabled by the various disclosed process flow sequences.
摘要翻译： 可以在一个示例中实现的方法和结构，以共同整合用于薄膜封装和形成微电子器件和微机电系统（MEMS）例如传感器和致动器的过程。 例如，可以使用相同的基本工艺流程来制造具有不同特性的结构，通过选择与基本工艺流程一起使用的不同工艺选项或模块以便创建所需的结构。 可以通过各种公开的处理流程序列有利地实现各种处理流程序列以及各种设备设计结构。
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公开(公告)号：US20140266509A1
公开(公告)日：2014-09-18
申请号：US13828066
申请日：2013-03-14
IPC分类号： H03H9/24
CPC分类号： H03H9/2457 , H03B5/30 , H03H9/02259 , H03H9/02275 , H03H9/2431 , H03H2009/02291 , H03H2009/02346 , H03H2009/02496
摘要： An apparatus includes a microelectromechanical system (MEMS) device. The MEMS device includes a resonator suspended from a substrate, an anchor disposed at a center of the resonator, a plurality of suspended beams radiating between the anchor and the resonator, a plurality of first electrodes disposed about the anchor, and a plurality of second electrodes disposed about the anchor. The plurality of first electrodes and the resonator form a first electrostatic transducer. The plurality of second electrodes and the resonator form a second electrostatic transducer. The first electrostatic transducer and the second electrostatic transducer are configured to sustain rotational vibrations of the resonator at a predetermined frequency about an axis through the center of the resonator and orthogonal to a plane of the substrate in response to a signal on the first electrode.
摘要翻译： 一种装置包括微机电系统（MEMS）装置。 MEMS器件包括从衬底悬挂的谐振器，设置在谐振器中心的锚，在锚和谐振器之间辐射的多个悬臂，围绕锚定器设置的多个第一电极和多个第二电极 围绕锚点布置。 多个第一电极和谐振器形成第一静电换能器。 多个第二电极和谐振器形成第二静电换能器。 第一静电换能器和第二静电换能器被配置为响应于第一电极上的信号，以围绕谐振器的中心的轴线以预定的频率维持谐振器的旋转振动并且与基板的平面正交。
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