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    Semiconductor module including a printed circuit board
    1.
    发明授权
    Semiconductor module including a printed circuit board 有权

    公开(公告)号：US11191151B2

    公开(公告)日：2021-11-30

    申请号：US16562082

    申请日：2019-09-05

    Applicant: SK hynix Inc.

    Inventor： Kyu Yong Choi ,  Jin Ho Bae ,  Yu Jeong Choe

    IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18

    Abstract: A device may include a substrate having a first surface and a second surface, a first conductive terminal disposed over the first surface, a second conductive terminal spaced apart from the first conductive terminal in a first direction and disposed over the first surface, a first conductive auxiliary pattern disposed below the first conductive terminal and overlapping with the first conductive terminal, the first conductive auxiliary pattern being coupled to the second conductive terminal, and a second conductive auxiliary pattern disposed below the second conductive terminal and overlapping with the second conducive terminal, the second conductive auxiliary pattern being coupled to the first conductive terminal.

    Semiconductor package and method for manufacturing the same
    4.
    发明授权
    Semiconductor package and method for manufacturing the same 有权
    半导体封装及其制造方法

    公开(公告)号：US09412716B2

    公开(公告)日：2016-08-09

    申请号：US14284637

    申请日：2014-05-22

    Applicant: SK hynix Inc.

    Inventor： Jin Ho Bae ,  Qwan Ho Chung ,  Seong Kweon Ha ,  Jong Hyun Kim ,  Bok Gyu Min ,  Jae Won Shin

    IPC: H01L23/34 ,  H01L23/00 ,  H01L21/48 ,  H01L23/12 ,  H01L23/498 ,  H01L21/66

    CPC classification number: H01L24/85 ,  H01L21/481 ,  H01L22/32 ,  H01L23/12 ,  H01L23/49838 ,  H01L23/49894 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

    Abstract: A method of manufacturing a semiconductor package includes: forming a strip substrate including a plurality of unit substrates, each being provided with a first connection pad and a second connection pad on a first surface of the unit substrate and each unit substrate being electrically and physically isolated from each other with the intervention of saw lines, first ground connection pads formed on the respective unit substrates, each of the first ground connection pads being electrically coupled with the first connection pad over the respective unit substrates, second ground connection pads formed on the saw line on the first surface side of the unit substrates and electrically isolated from the unit substrates, and test wiring formed on the saw line, the test wiring being electrically isolated from the unit substrates and electrically coupled with the second ground connection pads; and attaching semiconductor chips onto the respective unit substrates.

    Abstract translation: 一种制造半导体封装的方法，包括：形成包括多个单元基板的带状基板，每个单元基板在单元基板的第一表面上设置有第一连接焊盘和第二连接焊盘，并且每个单元基板被电气和物理隔离 通过锯线的干预，形成在各个单元基板上的第一接地连接焊盘，每个第一接地连接焊盘与相应的单元基板上的第一连接焊盘电耦合，形成在锯上的第二接地连接焊盘 在单元基板的第一表面侧上并且与单元基板电隔离，以及形成在锯线上的测试布线，测试布线与单元基板电隔离并与第二接地连接焊盘电耦合; 以及将半导体芯片附接到各个单元基板上。

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