MEMORY DEVICE AND OPERATING METHOD THEREOF

    公开(公告)号:US20250054530A1

    公开(公告)日:2025-02-13

    申请号:US18399456

    申请日:2023-12-28

    Applicant: SK hynix Inc.

    Inventor: Tae Jung HA

    Abstract: Memory devices and operating methods are disclosed. In an embodiment, a memory device may include a memory cell array including a plurality of memory cells, each of the plurality of memory cells configured to store a data value corresponding to read data to be read out through a plurality of conductive lines, and a read circuit connected to the plurality of conductive to generate the read data corresponding to the data value stored in a selected memory cell among the plurality of memory cells based on or according to whether there is a change in a cell current flowing through the selected memory cell during a single read period.

    SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

    公开(公告)号:US20240349513A1

    公开(公告)日:2024-10-17

    申请号:US18467617

    申请日:2023-09-14

    Applicant: SK hynix Inc.

    Inventor: Tae Jung HA

    CPC classification number: H10B61/00

    Abstract: A semiconductor device includes: a first contact plug disposed over the substrate; two or more insulating patterns disposed on a side surface of the first contact plug and sequentially along a direction away from the first contact plug; and a memory pattern connected to the first contact plug, wherein an upper surface of the first contact plug and upper surfaces of the insulating patterns form an inclined surface whose height decreases as a distance from a center of the first contact plug increases, the inclined surface includes a first inclined surface disposed on a first side of the center of the first contact plug and a second inclined surface disposed on second side of the center of the first contact plug, the second side opposite to the first side, and the memory pattern has a lower surface in contact with the first inclined surface.

    SWITCHING DEVICE AND NON-VOLATILE MEMORY DEVICE INCLUDING THE SAME

    公开(公告)号:US20190074436A1

    公开(公告)日:2019-03-07

    申请号:US15977606

    申请日:2018-05-11

    Applicant: SK hynix Inc.

    Abstract: A switching device includes a first switching element having a snap-back behavior characteristic, an output voltage of the first switching element decreasing when an input current increases from a turn-on threshold current of the first switching element. The switching device further includes a second switching element having a continuous-resistance behavior characteristic, an output voltage of the second switching element increasing when the input current increases from a turn-on threshold current of the second switching element. The turn-on threshold current of the first switching element is lower than the turn-on threshold current of the second switching element.

    RESISTANCE CHANGE MEMORY DEVICE
    6.
    发明申请

    公开(公告)号:US20190013465A1

    公开(公告)日:2019-01-10

    申请号:US15942236

    申请日:2018-03-30

    Applicant: SK hynix Inc.

    Inventor: Tae Jung HA

    Abstract: A resistance change memory device is provided. The resistance change memory device includes a lower electrode, a tunneling barrier layer disposed on the lower electrode, a resistance switching layer disposed on the tunneling barrier layer, an oxygen vacancy reservoir layer disposed on the resistance switching layer, and an upper electrode disposed on the oxygen vacancy reservoir layer. The oxygen vacancy reservoir layer is electrically conductive.

    RESISTANCE CHANGE MEMORY DEVICE AND METHOD OF SENSING THE SAME

    公开(公告)号:US20170372778A1

    公开(公告)日:2017-12-28

    申请号:US15435158

    申请日:2017-02-16

    Applicant: SK hynix Inc.

    Inventor: Tae Jung HA

    Abstract: A method of sensing a resistance change memory device includes preparing a memory cell including a variable resistance element storing different data on the basis of a variable resistance, and a switching element connected to the variable resistance element and performing a threshold switching operation, measuring a first cell current by applying a first read voltage to the memory cell, the first read voltage being selected in a threshold-sensing range of a current-voltage characteristic curve of the memory cell, measuring a second cell current by applying a second read voltage to the memory cell, the second read voltage being selected in a resistance-sensing range of the current-voltage characteristic curve, and when at least one of the first cell current and the second cell current is greater than a corresponding reference current, outputting a data signal having a first logic value as data stored in the memory cell.

    SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

    公开(公告)号:US20240172452A1

    公开(公告)日:2024-05-23

    申请号:US18315149

    申请日:2023-05-10

    Applicant: SK hynix Inc.

    Inventor: Tae Jung HA

    CPC classification number: H10B61/00 H10N50/01 H10N50/80

    Abstract: A semiconductor device may include: first conductive lines extending in a first direction; second conductive lines extending a second direction crossing the first direction; a plurality of first memory cells disposed at first intersections of the first conductive lines and the second conductive lines, respectively, each first memory cell including a first memory layer and a first selector layer that is disposed over the first memory layer; and a plurality of second memory cells disposed at second intersections of the first conductive lines and the second conductive lines, each second memory cell including a second selector layer and a second memory layer that is disposed over the second selector layer, wherein each of the first memory cells and each of the second memory cells are alternately disposed along the first direction and the second direction.

    SEMICONDUCTOR DEVICE
    9.
    发明公开

    公开(公告)号:US20230413693A1

    公开(公告)日:2023-12-21

    申请号:US17992782

    申请日:2022-11-22

    Applicant: SK hynix Inc.

    CPC classification number: H01L45/122 H01L27/24 H01L45/145 H01L23/5283

    Abstract: A semiconductor device may include: a plurality of first conductive lines extending in a first direction; a plurality of second conductive lines spaced apart from the first conductive lines and extending in a second direction intersecting the first direction; and a plurality of memory cells respectively disposed to overlap intersection regions of the plurality of the first conductive lines and the plurality of the second conductive lines; and a layer structured to include an insulating material containing metal ions and formed between each memory cell and at least one of a first conductive line and a second conductive line that intersects with each other at a memory cell.

    ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME

    公开(公告)号:US20220109026A1

    公开(公告)日:2022-04-07

    申请号:US17204822

    申请日:2021-03-17

    Applicant: SK hynix Inc.

    Abstract: An electronic device may include a semiconductor memory structured to include a plurality of memory cells, wherein each of the plurality of memory cells may comprise: a first electrode layer; a second electrode layer; and a selection element layer disposed between the first electrode layer and the second electrode layer to electrically couple or decouple an electrical connection between the first electrode layer and the second electrode layer based on a magnitude of an applied voltage or an applied current with respect to a threshold magnitude, wherein the selection element layer has a dopant concentration profile which decreases from an interface between the selection element layer and the first electrode layer toward an interface between the selection element layer and the second electrode layer.

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