公开(公告)号：US20160261941A1

公开(公告)日：2016-09-08

申请号：US14943848

申请日：2015-11-17

Applicant: STMICROELECTRONICS S.R.L. ,  STMICROELECTRONICS (MALTA) LTD

Inventor： Roberto BRIOSCHI ,  Silvia ADORNO ,  Kenneth FONK

IPC: H04R1/08 ,  B81C1/00 ,  H04R31/00 ,  B81B7/00 ,  H04R19/00 ,  H04R19/04

CPC classification number: H04R1/086 ,  B81B7/0058 ,  B81B7/0061 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2207/012 ,  B81B2207/07 ,  B81C1/00309 ,  B81C2203/0785 ,  H01L2224/48137 ,  H01L2224/48227 ,  H04R19/005 ,  H04R19/04 ,  H04R31/00 ,  H04R31/006

Abstract: A semiconductor integrated device, comprising: a package defining an internal space and having an acoustic-access opening in acoustic communication with an environment external to the package; a MEMS acoustic transducer, housed in the internal space and provided with an acoustic chamber facing the acoustic-access opening; and a filtering module, which is designed to inhibit passage of contaminating particles having dimensions larger than a filtering dimension and is set between the MEMS acoustic transducer and the acoustic-access opening. The filtering module defines at least one direct acoustic path between the acoustic-access opening and the acoustic chamber.

Abstract translation: 一种半导体集成器件，包括：限定内部空间并且具有与所述封装外部的环境声学连通的声学通路开口的封装; MEMS声学换能器，其容纳在内部空间中并且设置有面向声学进入开口的声学室; 以及过滤模块，其设计成抑制具有大于过滤尺寸的尺寸的污染颗粒的通过并设置在MEMS声学换能器和声学通路开口之间。 滤波模块限定声学通道开口和声学室之间的至少一个直接声路径。

公开(公告)号：US20200236470A1

公开(公告)日：2020-07-23

申请号：US16749579

申请日：2020-01-22

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Fabrizio CERINI ,  Enri DUQI ,  Silvia ADORNO ,  Lorenzo BALDO

IPC: H04R19/02 ,  B81B3/00 ,  B81C1/00 ,  H04R17/00 ,  H04R19/00 ,  H04R31/00 ,  H04R1/02

Abstract: An actuation structure of a MEMS electroacoustic transducer is formed in a die of semiconductor material having a monolithic body with a front surface and a rear surface extending in a horizontal plane x-y plane and defined in which are: a frame; an actuator element arranged in a central opening defined by the frame; cantilever elements, coupled at the front surface between the actuator element and the frame; and piezoelectric regions arranged on the cantilever elements and configured to be biased to cause a deformation of the cantilever elements by the piezoelectric effect. A first stopper arrangement is integrated in the die and configured to interact with the cantilever elements to limit a movement thereof in a first direction of a vertical axis orthogonal to the horizontal plane, x-y plane towards the underlying central opening.

公开(公告)号：US20200221234A1

公开(公告)日：2020-07-09

申请号：US16813477

申请日：2020-03-09

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Fabrizio CERINI ,  Silvia ADORNO ,  Federico VERCESI

IPC: H04R17/02 ,  B81B3/00 ,  B81C1/00 ,  H01L41/113

Abstract: A piezoelectric MEMS transducer formed in a body of semiconductor material, which has a central axis and a peripheral area and comprises a plurality of beams, transverse to the central axis and having a first end, coupled to the peripheral area of the body, and a second end, facing the central axis; a membrane, transverse to the central axis and arranged underneath the plurality of beams; and a pillar, parallel to the central axis and rigid with the second end of the beams and to the membrane. The MEMS transducer further comprises a plurality of piezoelectric sensing elements arranged on the plurality of beams.

公开(公告)号：US20190090067A1

公开(公告)日：2019-03-21

申请号：US16128288

申请日：2018-09-11

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Matteo PERLETTI ,  Federico VERCESI ,  Silvia ADORNO ,  Giorgio ALLEGATO

IPC: H04R19/04 ,  B81B7/00 ,  B81C1/00 ,  H04R19/00 ,  H04R1/28

CPC classification number: H04R19/04 ,  B81B7/0029 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2207/012 ,  B81C1/00309 ,  B81C1/00626 ,  B81C2201/014 ,  B81C2201/0198 ,  H04R1/086 ,  H04R1/2807 ,  H04R19/005 ,  H04R31/00 ,  H04R2201/003

Abstract: A method for manufacturing a filtering module comprising the steps of: forming a multilayer body comprising a filter layer of semiconductor material and having a thickness of less than 10 μm, a first structural layer coupled to a first side of the filter layer, and a second structural layer coupled to a second side, opposite to the first side, of the filter layer; forming a recess in the first structural layer, which extends throughout its thickness; removing selective portions, exposed through the recess, of the filter layer to form a plurality of openings, which extend throughout the thickness of the filter layer; and completely removing the second structural layer to connect fluidically the first and second sides of the filter layer, thus forming a filtering membrane designed to inhibit passage of contaminating particles.

公开(公告)号：US20220238485A1

公开(公告)日：2022-07-28

申请号：US17580480

申请日：2022-01-20

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Dario PACI ,  Silvia ADORNO ,  Marco DEL SARTO ,  Fabrizio CERINI ,  Alex GRITTI

IPC: H01L25/065 ,  H01L23/64 ,  H01L23/00 ,  H01L23/538

Abstract: A packaged electronic system having a support formed by an insulating organic substrate housing a buried conductive region that is floating. A first die is fixed to the support and carries, on a first main surface, a first die contact region capacitively coupled to a first portion of the buried conductive region. A second die is fixed to the support and carries, on a first main surface, a second die contact region capacitively coupled to a second portion of the buried conductive region. A packaging mass encloses the first die, the second die, the first die contact region, the second die contact region, and, at least partially, the support.

公开(公告)号：US20210178430A1

公开(公告)日：2021-06-17

申请号：US17118443

申请日：2020-12-10

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Silvia ADORNO ,  Roberto CARMINATI

IPC: B06B1/02 ,  B06B1/06

Abstract: A micro-machined ultrasonic transducer is proposed. The micro-machined ultrasonic transducer includes a membrane element for transmitting/receiving ultrasonic waves, during the transmission/reception of ultrasonic waves the membrane element oscillating, about an equilibrium position, at a respective resonance frequency. The equilibrium position of the membrane element is variable according to a biasing electric signal applied to the membrane element. The micro-machined ultrasonic transducer further comprises a cap structure extending above the membrane element; the cap structure identifies, between it and the membrane element, a cavity whose volume is variable according to the equilibrium position of the membrane element. The cap structure comprises an opening for inputting/outputting the ultrasonic waves into/from the cavity. The cap structure and the membrane element act as tunable Helmholtz resonator, whereby the resonance frequency is variable according to the volume of the cavity.

公开(公告)号：US20240259734A1

公开(公告)日：2024-08-01

申请号：US18416751

申请日：2024-01-18

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Federico VERCESI ,  Fabrizio CERINI ,  Silvia ADORNO

IPC: H04R19/04 ,  H04R7/04 ,  H04R7/18 ,  H04R19/00 ,  H04R31/00

CPC classification number: H04R19/04 ,  H04R7/04 ,  H04R7/18 ,  H04R19/005 ,  H04R31/003 ,  H04R31/006 ,  H04R2201/003

Abstract: Capacitive, MEMS-type acoustic transducer, having a sound collection part and a transduction part. A substrate region surrounds a first chamber arranged in the sound collection part and open towards the outside; a fixed structure is coupled to the substrate region; a cap region is coupled to the fixed structure. A sensitive membrane is arranged in the sound collection part, is coupled to the fixed structure and faces the first chamber. A transduction chamber is arranged in the transduction part, hermetically closed with respect to the outside and accommodates a detection membrane. An articulated structure extends between the sensitive membrane and the detection membrane, through the walls of the transduction chamber. A fixed electrode faces and is capacitively coupled to the detection membrane. Conducive electrical connection regions extend above the substrate region, into the transduction chamber.

公开(公告)号：US20230328456A1

公开(公告)日：2023-10-12

申请号：US18295673

申请日：2023-04-04

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Fabrizio CERINI ,  Silvia ADORNO ,  Marco SALINA

IPC: H04R17/00 ,  H10N30/20 ,  H04R7/06 ,  H04R7/18

CPC classification number: H04R17/005 ,  H10N30/20 ,  H04R2400/11 ,  H04R7/18 ,  H04R2201/003 ,  H04R7/06

Abstract: A microelectromechanical electroacoustic transducer includes a supporting frame of semiconductor material, a membrane of semiconductor material, connected to the supporting frame along a perimeter and having central symmetry, and a piezoelectric actuator on a peripheral portion of the membrane. The membrane has through slits of elongated shape arranged around a center of the membrane.

公开(公告)号：US20170339494A1

公开(公告)日：2017-11-23

申请号：US15365590

申请日：2016-11-30

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Matteo PERLETTI ,  Igor VARISCO ,  Luca LAMAGNA ,  Silvia ADORNO ,  Gabriele GATTERE ,  Carlo VALZASINA ,  Sebastiano CONTI

IPC: H04R19/00 ,  B81B3/00 ,  G01H11/06 ,  B81C1/00

CPC classification number: H04R19/005 ,  B81B3/0021 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/0136 ,  B81B2203/0315 ,  B81B2203/04 ,  B81B2203/053 ,  B81C1/00158 ,  B81C2201/0109 ,  B81C2201/0111 ,  B81C2201/0133 ,  G01H11/06 ,  H04R31/00 ,  H04R2201/003 ,  H04R2201/023

Abstract: A MEMS acoustic transducer provided with: a substrate of semiconductor material, having a back surface and a front surface opposite with respect to a vertical direction; a first cavity formed within the substrate, which extends from the back surface to the front surface; a membrane which is arranged at the upper surface, suspended above the first cavity and anchored along a perimeter thereof to the substrate; and a combfingered electrode arrangement including a number of mobile electrodes coupled to the membrane and a number of fixed electrodes coupled to the substrate and facing respective mobile electrodes for forming a sensing capacitor, wherein a deformation of the membrane as a result of incident acoustic pressure waves causes a capacitive variation of the sensing capacitor. In particular, the combfingered electrode arrangement lies vertically with respect to the membrane and extends parallel thereto.

公开(公告)号：US20230314257A1

公开(公告)日：2023-10-05

申请号：US18169818

申请日：2023-02-15

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Enri DUQI ,  Patrick FEDELI ,  Nicolo' MANCA ,  Silvia ADORNO

IPC: G01L27/00

CPC classification number: G01L27/005 ,  H02J50/10

Abstract: Method for determining a first and a second calibrated value of atmospheric pressure, performed by an electronic apparatus comprising a fixed device and a first and a second movable device comprising respectively a first and a second movable barometer. The method comprises: determining whether the movable devices are being inductively charged by the fixed device; if so, acquiring respective measured values of atmospheric pressure through the movable barometers, and a reference value of atmospheric pressure in a common reference point of the electronic apparatus, the movable barometers being at respective predefined height differences with respect to the common reference point; calculating respective pressure differences as a function of the measured values of atmospheric pressure and of the reference value of atmospheric pressure; and when the movable devices are not being charged, acquiring new measured values of atmospheric pressure through the movable barometers, and determining the respective calibrated values of atmospheric pressure as a function of the new measured values of atmospheric pressure and of the pressure differences.