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    ULTRA-THIN SEMICONDUCTOR DIE WITH IRREGULAR TEXTURED SURFACES
    1.
    发明申请
    ULTRA-THIN SEMICONDUCTOR DIE WITH IRREGULAR TEXTURED SURFACES 有权

    公开(公告)号：US20220415703A1

    公开(公告)日：2022-12-29

    申请号：US17357826

    申请日：2021-06-24

    Applicant: STMICROELECTRONICS S.r.l.

    Inventor： Mikel AZPEITIA URQUIA ,  Lorenzo TENTORI

    IPC: H01L21/70 ,  H01L23/00 ,  H01L21/78

    Abstract: The present disclosure is directed to at least one embodiment of a die including a sidewall having a uniform surface and an irregular surface. The uniform surface may be a scalloped surface and scallops of the scalloped surface are substantially the same size and shape relative to each other. The irregular surface has a more irregular texture as compared to the uniform surface. The irregular surface may include a plurality of randomly spaced high points and a plurality of randomly spaced low points that are between adjacent ones of the high points. In a method of manufacturing the die, a cavity is pre-formed in a substrate and a multilayer structure is formed on the substrate. The multilayer structure includes an active area that is aligned with and overlies the cavity. After the multilayer structure is formed, at least one recess is formed extending into the multilayer structure to the cavity. Forming the recess forms a die structure suspended above the cavity and an extension extending from the die structure to a suspension structure surrounding the die structure. The die structure is released from the die suspension structure by breaking the extension.

    FLUID EJECTION DEVICE WITH REDUCED NUMBER OF COMPONENTS, AND METHOD FOR MANUFACTURING THE FLUID EJECTION DEVICE
    2.
    发明申请
    FLUID EJECTION DEVICE WITH REDUCED NUMBER OF COMPONENTS, AND METHOD FOR MANUFACTURING THE FLUID EJECTION DEVICE 审中-公开

    公开(公告)号：US20200324545A1

    公开(公告)日：2020-10-15

    申请号：US16848549

    申请日：2020-04-14

    Applicant: STMICROELECTRONICS S.r.l.

    Inventor： Domenico GIUSTI ,  Carlo Luigi PRELINI ,  Lorenzo TENTORI

    IPC: B41J2/14 ,  B41J2/165

    Abstract: Various embodiments provide an ejection device for a fluid. The ejection device includes a first semiconductor wafer, housing, on a first side thereof, a piezoelectric actuator and an outlet channel for the fluid alongside the piezoelectric actuator; a second semiconductor wafer having, on a first side thereof, a recess and, on a second side thereof opposite to the first side, at least one inlet channel for said fluid fluidically coupled to the recess; and a dry-film coupled to a second side, opposite to the first side, of the first wafer. The first and the second wafers are coupled together so that the piezoelectric actuator and the outlet channel are set directly facing, and completely contained in, the recess that forms a reservoir for the fluid. The dry-film has an ejection nozzle.

    MEMS ULTRASONIC TRANSDUCER DEVICE WITH IMPROVED DAMPING OF THE OSCILLATIONS OF A MEMBRANE OF THE SAME, AND MANUFACTURING PROCESS OF THE SAME
    7.
    发明公开
    MEMS ULTRASONIC TRANSDUCER DEVICE WITH IMPROVED DAMPING OF THE OSCILLATIONS OF A MEMBRANE OF THE SAME, AND MANUFACTURING PROCESS OF THE SAME 审中-公开

    公开(公告)号：US20230166293A1

    公开(公告)日：2023-06-01

    申请号：US18053718

    申请日：2022-11-08

    Applicant: STMICROELECTRONICS S.r.l.

    Inventor： Domenico GIUSTI ,  Marco FERRERA ,  Lorenzo TENTORI

    IPC: B06B1/06 ,  G01S15/08

    CPC classification number: B06B1/0681 ,  B06B1/0629 ,  B06B1/0651 ,  B06B1/0666 ,  G01S15/08

    Abstract: MEMS ultrasonic transducer, MUT, device, comprising a semiconductor body with a first and a second main surface and including: a first chamber extending into the semiconductor body at a distance from the first main surface; a membrane formed by the semiconductor body between the first main surface and the first chamber; a piezoelectric element on the membrane; a second chamber extending into the semiconductor body between the first chamber and the second main surface; a central fluidic passage extending into the semiconductor body from the second main surface to the first chamber and traversing the second chamber; and one or more lateral fluidic passages extending into the semiconductor body from the second main surface to the second chamber. The one or more lateral fluidic passages, the central fluidic passage and the second chamber define a fluidic recirculation path that fluidically connects the first chamber with the outside of the semiconductor body.

    MICROFLUIDIC DEVICE FOR SPRAYING VERY SMALL DROPS OF LIQUIDS
    8.
    发明申请
    MICROFLUIDIC DEVICE FOR SPRAYING VERY SMALL DROPS OF LIQUIDS 有权

    公开(公告)号：US20220410183A1

    公开(公告)日：2022-12-29

    申请号：US17845718

    申请日：2022-06-21

    Applicant: STMICROELECTRONICS S.R.L.

    Inventor： Domenico GIUSTI ,  Gianluca GULLI' ,  Francesco FERRARIO ,  Davide MAERNA ,  Lorenzo TENTORI

    IPC: B05B1/08 ,  B05B1/24 ,  B05B1/14

    Abstract: A microfluidic device has a chamber; a fluidic access channel in fluidic connection with the chamber; a plurality of nozzle apertures in fluidic connection with the chamber; and an actuator, operatively coupled to the fluid containment chamber and configured to cause ejection of drops of fluid through the nozzle apertures in an operating condition of the microfluidic device. The chamber has an elongated shape, with a length and a maximum width, wherein an aspect ratio between the length and the maximum width of the chamber is at least 3:1. The nozzle apertures are configured to generate, in use, a plurality of drops having a total drop volume, wherein a ratio total drop volume to a chamber volume is at least 15%.

    FLUID EJECTION DEVICE WITH REDUCED NUMBER OF COMPONENTS, AND METHOD FOR MANUFACTURING THE FLUID EJECTION DEVICE
    9.
    发明申请
    FLUID EJECTION DEVICE WITH REDUCED NUMBER OF COMPONENTS, AND METHOD FOR MANUFACTURING THE FLUID EJECTION DEVICE 有权

    公开(公告)号：US20220126580A1

    公开(公告)日：2022-04-28

    申请号：US17572374

    申请日：2022-01-10

    Applicant: STMICROELECTRONICS S.r.l.

    Inventor： Domenico GIUSTI ,  Carlo Luigi PRELINI ,  Lorenzo TENTORI

    IPC: B41J2/14 ,  B41J2/165

    Abstract: Various embodiments provide an ejection device for a fluid. The ejection device includes a first semiconductor wafer, housing, on a first side thereof, a piezoelectric actuator and an outlet channel for the fluid alongside the piezoelectric actuator; a second semiconductor wafer having, on a first side thereof, a recess and, on a second side thereof opposite to the first side, at least one inlet channel for said fluid fluidically coupled to the recess; and a dry-film coupled to a second side, opposite to the first side, of the first wafer. The first and the second wafers are coupled together so that the piezoelectric actuator and the outlet channel are set directly facing, and completely contained in, the recess that forms a reservoir for the fluid. The dry-film has an ejection nozzle.

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