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    MICROELECTROMECHANICAL BUTTON DEVICE AND CORRESPONDING WATERPROOF USER INTERFACE ELEMENT
    1.
    发明公开
    MICROELECTROMECHANICAL BUTTON DEVICE AND CORRESPONDING WATERPROOF USER INTERFACE ELEMENT 审中-公开

    公开(公告)号：US20240051817A1

    公开(公告)日：2024-02-15

    申请号：US18363599

    申请日：2023-08-01

    Applicant: STMICROELECTRONICS S.r.l.

    Inventor： Federico VERCESI ,  Gabriele GATTERE ,  Giorgio ALLEGATO ,  Mikel AZPEITIA URQUIA ,  Alessandro DANEI

    IPC: B81B7/00 ,  B81B7/02 ,  H03K17/975

    CPC classification number: B81B7/0058 ,  B81B7/02 ,  H03K17/975 ,  H01H2231/028 ,  B81B2203/04

    Abstract: A microelectromechanical button device is provided with a detection structure having: a substrate of semiconductor material with a front surface and a rear surface; a buried electrode arranged on the substrate; a mobile electrode, arranged in a structural layer overlying the substrate and elastically suspended above the buried electrode at a separation distance so as to form a detection capacitor; and a cap coupled over the structural layer and having a first main surface facing the structural layer and a second main surface that is designed to be mechanically coupled to a deformable portion of a case of an electronic apparatus of a portable or wearable type. The cap has, on its first main surface, an actuation portion arranged over the mobile electrode and configured to cause, in the presence of a pressure applied on the second main surface, a deflection of the mobile electrode and its approach to the buried electrode, with a consequent capacitive variation of the detection capacitor, which is indicative of an actuation of the microelectromechanical button device.

    ULTRA-THIN SEMICONDUCTOR DIE WITH IRREGULAR TEXTURED SURFACES
    3.
    发明申请
    ULTRA-THIN SEMICONDUCTOR DIE WITH IRREGULAR TEXTURED SURFACES 有权

    公开(公告)号：US20220415703A1

    公开(公告)日：2022-12-29

    申请号：US17357826

    申请日：2021-06-24

    Applicant: STMICROELECTRONICS S.r.l.

    Inventor： Mikel AZPEITIA URQUIA ,  Lorenzo TENTORI

    IPC: H01L21/70 ,  H01L23/00 ,  H01L21/78

    Abstract: The present disclosure is directed to at least one embodiment of a die including a sidewall having a uniform surface and an irregular surface. The uniform surface may be a scalloped surface and scallops of the scalloped surface are substantially the same size and shape relative to each other. The irregular surface has a more irregular texture as compared to the uniform surface. The irregular surface may include a plurality of randomly spaced high points and a plurality of randomly spaced low points that are between adjacent ones of the high points. In a method of manufacturing the die, a cavity is pre-formed in a substrate and a multilayer structure is formed on the substrate. The multilayer structure includes an active area that is aligned with and overlies the cavity. After the multilayer structure is formed, at least one recess is formed extending into the multilayer structure to the cavity. Forming the recess forms a die structure suspended above the cavity and an extension extending from the die structure to a suspension structure surrounding the die structure. The die structure is released from the die suspension structure by breaking the extension.

    MICRO-ELECTRO-MECHANICAL DEVICE HAVING TWO BURIED CAVITIES AND MANUFACTURING PROCESS THEREOF
    5.
    发明申请
    MICRO-ELECTRO-MECHANICAL DEVICE HAVING TWO BURIED CAVITIES AND MANUFACTURING PROCESS THEREOF 审中-公开

    公开(公告)号：US20190210868A1

    公开(公告)日：2019-07-11

    申请号：US15866380

    申请日：2018-01-09

    Applicant: STMICROELECTRONICS S.R.L.

    Inventor： Enri DUQI ,  Lorenzo BALDO ,  Marco DEL SARTO ,  Mikel AZPEITIA URQUIA

    IPC: B81C1/00 ,  B81B7/00 ,  B81B3/00

    Abstract: A micro-electro-mechanical device, comprising a monolithic body of semiconductor material accommodating a first buried cavity; a sensitive region facing the first buried cavity; a second cavity facing the first buried cavity; a decoupling trench extending from the monolithic body and separating the sensitive region from a peripheral portion of the monolithic body; a cap die, forming an ASIC, bonded to and facing the first face of the monolithic body; and a first gap between the cap die and the monolithic body. The device also comprises at least one spacer element between the monolithic body and the cap die; at least one stopper element between the monolithic body and the cap die; and a second gap between the stopper element and one between the monolithic body and the cap die. The second gap is smaller than the first gap.

    MICRO-ELECTRO-MECHANICAL DEVICE HAVING TWO BURIED CAVITIES AND MANUFACTURING PROCESS THEREOF
    7.
    发明申请
    MICRO-ELECTRO-MECHANICAL DEVICE HAVING TWO BURIED CAVITIES AND MANUFACTURING PROCESS THEREOF 审中-公开

    公开(公告)号：US20200262699A1

    公开(公告)日：2020-08-20

    申请号：US16869159

    申请日：2020-05-07

    Applicant: STMICROELECTRONICS S.R.L.

    Inventor： Enri DUQI ,  Lorenzo BALDO ,  Marco DEL SARTO ,  Mikel AZPEITIA URQUIA

    IPC: B81C1/00 ,  B81B3/00 ,  B81B7/00

    Abstract: A micro-electro-mechanical device, comprising a monolithic body of semiconductor material accommodating a first buried cavity; a sensitive region facing the first buried cavity; a second cavity facing the first buried cavity; a decoupling trench extending from the monolithic body and separating the sensitive region from a peripheral portion of the monolithic body; a cap die, forming an ASIC, bonded to and facing the first face of the monolithic body; and a first gap between the cap die and the monolithic body. The device also comprises at least one spacer element between the monolithic body and the cap die; at least one stopper element between the monolithic body and the cap die; and a second gap between the stopper element and one between the monolithic body and the cap die. The second gap is smaller than the first gap.

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