公开(公告)号：US20240043265A1

公开(公告)日：2024-02-08

申请号：US18359754

申请日：2023-07-26

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Giorgio ALLEGATO ,  Silvia NICOLI ,  Anna ALESSANDRI ,  Matteo GARAVAGLIA

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0022 ,  B81C1/00269 ,  B81B2201/0228 ,  B81B2203/0315 ,  B81B2207/053 ,  B81C2203/0154 ,  B81C2203/0109 ,  B81C2203/038

Abstract: Electronic device including: a MEMS sensor device including a functional structure which transduces a chemical or physical quantity into a corresponding electrical quantity; a cap including a semiconductive substrate; and a bonding dielectric region, which mechanically couples the cap to the MEMS sensor device. The cap further includes a conductive region, which extends between the semiconductive substrate and the MEMS sensor device and includes: a first portion, which is arranged laterally with respect to the semiconductive substrate and is exposed, so as to be electrically coupleable to a terminal at a reference potential by a corresponding wire bonding; and a second portion, which contacts the semiconductive substrate.

公开(公告)号：US20240239648A1

公开(公告)日：2024-07-18

申请号：US18409584

申请日：2024-01-10

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Silvia NICOLI ,  Lorenzo TENTORI ,  Giuseppe BRUNO

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0067 ,  B81C1/00317 ,  B81B2201/0292 ,  B81B2203/0315 ,  B81C2203/0118 ,  B81C2203/0127

Abstract: The MEMS device has: a sensor body having a functional structure configured to transduce a physical or chemical quantity into a corresponding electrical quantity; and a cap bonded to the sensor body and having a first cavity overlying the functional structure. The cap has a supporting portion and a cover portion that form the first cavity. The supporting portion is bonded to the sensor body. The cover portion is bonded to the supporting portion and has an inner wall delimiting on a side the first cavity and facing the functional structure. The MEMS device further has a first coating that extends within the first cavity on the inner wall of the cover portion.

公开(公告)号：US20230348258A1

公开(公告)日：2023-11-02

申请号：US18302610

申请日：2023-04-18

Applicant: STMicroelectronics S.r.l.

Inventor： Mikel AZPEITIA URQUIA ,  Enri DUQI ,  Silvia NICOLI ,  Roberto CAMPEDELLI ,  Igor VARISCO ,  Lorenzo TENTORI

IPC: B81B3/00 ,  B81C1/00

CPC classification number: B81B3/001 ,  B81C1/00158 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81B2203/033 ,  B81B2203/0361 ,  B81B2207/11 ,  B81C2201/014 ,  B81C2201/0156 ,  B81C2201/0177 ,  B81C2201/0169

Abstract: MEMS structure, comprising: a semiconductor body; a cavity buried in the semiconductor body; a membrane suspended on the cavity; and at least one antistiction bump completely contained in the cavity with the function of preventing the side of the membrane internal to the cavity from sticking to the opposite side, which delimits the cavity downwardly.

公开(公告)号：US20230064114A1

公开(公告)日：2023-03-02

申请号：US17821717

申请日：2022-08-23

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Paolo FERRARI ,  Flavio Francesco VILLA ,  Roberto CAMPEDELLI ,  Luca LAMAGNA ,  Enri DUQI ,  Mikel AZPEITIA URQUIA ,  Silvia NICOLI ,  Maria Carolina TURI

IPC: B81C1/00 ,  G01L9/00

Abstract: The present disclosure is directed to a method for manufacturing a micro-electro-mechanical device. The method includes the steps of forming, on a substrate, a first protection layer of crystallized aluminum oxide, impermeable to HF; forming, on the first protection layer, a sacrificial layer of silicon oxide removable with HF; forming, on the sacrificial layer, a second protection layer of crystallized aluminum oxide; exposing a sacrificial portion of the sacrificial layer; forming, on the sacrificial portion, a first membrane layer of a porous material, permeable to HF; forming a cavity by removing the sacrificial portion through the first membrane layer; and sealing pores of the first membrane layer by forming a second membrane layer on the first membrane layer.

公开(公告)号：US20230061430A1

公开(公告)日：2023-03-02

申请号：US17896692

申请日：2022-08-26

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Paolo FERRARI ,  Lorenzo CORSO ,  Flavio Francesco VILLA ,  Silvia NICOLI ,  Luca LAMAGNA

IPC: B81C1/00 ,  B81B7/02

Abstract: Method for manufacturing a micro-electro-mechanical system, MEMS, integrating a first MEMS device and a second MEMS device. The first MEMS device is a capacitive pressure sensor and the second MEMS device is an inertial sensor. The steps of manufacturing the first and second MEMS devices are, at least partly, shared with each other, resulting in a high degree of integration on a single die, and allowing to implement a manufacturing process with high yield and controlled costs.