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公开(公告)号:US5289625A
公开(公告)日:1994-03-01
申请号:US62039
申请日:1993-05-17
申请人: Sachio Umetsu , Toshio Tsuda , Yusaku Azuma , Toshihiko Miura , Katsumi Ishihara , Teiji Ohsaka
发明人: Sachio Umetsu , Toshio Tsuda , Yusaku Azuma , Toshihiko Miura , Katsumi Ishihara , Teiji Ohsaka
CPC分类号: B23P19/001 , Y10T29/49819 , Y10T29/49829 , Y10T29/53061 , Y10T29/53087
摘要: There is disclosed an apparatus and a method for feeding articles, the apparatus containing a tape transporting apparatus, including a transporting member having plural containing portions in succession, a cover tape for covering the apertures of the containing portions of the transporting member, a first reel for simultaneously winding the transporting member and the cover tape, a second reel for winding the transporting member only, a third reel for winding the cover tape only, a drive assembly for rotating the first, second and third reels, intermittent drive unit for driving the transporting member, control unit for driving the drive assembly and intermittent drive unit, an aperture for loading or removing the articles into or from the containing portions of the transporting member, a first detector for detecting the presence or absence of the article in the containing portion, and a guide member for defining the position to an article assembling apparatus or an article manufacturing apparatus, wherein each of these apparatus is provided with a robot hand and a main control unit to be connected to the control unit mentioned above.
摘要翻译: 公开了一种用于供给物品的装置和方法,该装置包括带传送装置,包括具有多个容纳部分的传送构件,覆盖传送构件的容纳部分的孔的盖带,第一卷轴 为了同时卷绕传送部件和盖带,仅用于卷绕传送部件的第二卷轴,仅用于卷绕盖带的第三卷轴,用于旋转第一,第二和第三卷轴的驱动组件,用于驱动传送部件的间歇驱动单元 用于驱动驱动组件和间歇驱动单元的控制单元,用于将物品装载或移出输送构件的容纳部分的孔,用于检测容纳部分中物品是否存在的第一检测器 ,以及用于限定物品组装装置或物品制造商的位置的引导构件 其中,这些装置中的每一个设置有要连接到上述控制单元的机器人手和主控制单元。
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公开(公告)号:US5090113A
公开(公告)日:1992-02-25
申请号:US503745
申请日:1990-04-03
申请人: Sachio Umetsu , Toshio Tsuda , Yusaku Azuma , Toshihiko Miura , Katsumi Ishihara , Teiji Ohsaka
发明人: Sachio Umetsu , Toshio Tsuda , Yusaku Azuma , Toshihiko Miura , Katsumi Ishihara , Teiji Ohsaka
IPC分类号: B23P19/00
CPC分类号: B23P19/001 , Y10T29/53039 , Y10T29/53061 , Y10T29/53348 , Y10T29/53361
摘要: There is disclosed an apparatus for feeding articles, containing a tape transporting apparatus, including a transporting member having plural container portions in succession, a cover tape for covering the apertures of the container portions of the transporting member, a first reel on which ends of the transporting member and the cover tape are fixed, for simultaneously winding the transporting member and the cover tape, a second reel on which the other end of the transporting member is fixed, for winding the transporting member only, a third reel on which the other end of the cover tape is fixed, for winding the cover tape only, a drive assembly for rotating the first, second and third reels, intermittent drive unit for intermittently driving the transporting member by engaging with successive perforations formed on the transporting member, a control unit for driving the drive assembly and intermittent drive unit, an aperture for loading or removing the articles into or from the container portions of the transporting member, a first detector provided in the vicinity of the aperture, for detecting the presence or absence of an article in a container portion, and a guide member for defining the position to an article assembling apparatus or an article manufacturing apparatus, wherein each of these apparatus is provided with a robot hand and a main control unit to be connected to the control unit mentioned above.
摘要翻译: 公开了一种包含带输送装置的物品的装置,该装置包括连续地具有多个容器部分的传送部件,覆盖传送部件的容器部分的孔的盖带,第一卷轴, 传送构件和盖带固定,用于同时卷绕传送构件和盖带;传送构件的另一端固定在其上的第二卷轴,用于卷绕传送构件;第三卷轴,其另一端 的盖带固定,用于仅缠绕盖带;驱动组件,用于旋转第一,第二和第三卷轴;间歇驱动单元,用于通过与形成在传送构件上的连续穿孔接合来间歇地驱动传送构件;控制单元 用于驱动驱动组件和间歇驱动单元,用于将物品装入或从其中取出物品的孔 设置在孔附近的用于检测容器部分中物品的存在或不存在的第一检测器和用于限定物品组装设备或物品制造设备的位置的引导件 其中,这些装置中的每一个设置有要连接到上述控制单元的机器人手和主控制单元。
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公开(公告)号:US5203661A
公开(公告)日:1993-04-20
申请号:US598746
申请日:1990-10-16
申请人: Takeo Tanita , Masateru Yasuhara , Shozo Kasai , Yusaku Azuma , Toshihiro Yamamoto , Norio Nikaido , Toshio Tsuda
发明人: Takeo Tanita , Masateru Yasuhara , Shozo Kasai , Yusaku Azuma , Toshihiro Yamamoto , Norio Nikaido , Toshio Tsuda
IPC分类号: B65G1/04
CPC分类号: B65G1/0435
摘要: A handling device for a stocker, for storing various articles or containers, has a pair of engaging members for storing or extracting the articles, in which the engaging members have unbalanced engaging forces and the articles are aligned in one direction by the unbalanced engaging forces.
摘要翻译: 用于储存器的处理装置,用于储存各种物品或容器,具有用于储存或取出物品的一对接合构件,其中接合构件具有不平衡的接合力,并且物品通过不平衡的接合力在一个方向上对齐。
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公开(公告)号:US07586183B2
公开(公告)日:2009-09-08
申请号:US11405478
申请日:2006-04-18
申请人: Takeshi Kawabata , Motoaki Satou , Toshiyuki Fukuda , Toshio Tsuda , Kazuhiro Nobori , Seiichi Nakatani
发明人: Takeshi Kawabata , Motoaki Satou , Toshiyuki Fukuda , Toshio Tsuda , Kazuhiro Nobori , Seiichi Nakatani
IPC分类号: H01L23/02
CPC分类号: H01L25/0657 , H01L23/5385 , H01L23/5389 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/105 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/451 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2225/0651 , H01L2225/0652 , H01L2225/06541 , H01L2225/06555 , H01L2225/06572 , H01L2225/1023 , H01L2225/107 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2924/1627 , H01L2924/181 , H01L2924/30107 , H01L2924/3011 , H01L2924/3511 , H01L2924/00012 , H01L2924/00 , H01L2224/05599
摘要: A semiconductor module is formed by alternately stacking resin boards and sheet members. Each of the resin boards includes first buried conductors. A semiconductor chip is mounted on the upper face of each of the resin boards. Each of the sheet members having an opening for accommodating the semiconductor chip and including second buried conductors electrically connected to the first buried conductors. A first resin board located at the bottom is thicker than second resin boards. Each of the sheet members includes an adhesive member covering the upper and side faces of the semiconductor chip.
摘要翻译: 通过交替堆叠树脂板和片材构件形成半导体模块。 每个树脂板包括第一掩埋导体。 半导体芯片安装在每个树脂板的上表面上。 每个片构件具有用于容纳半导体芯片的开口,并且包括电连接到第一掩埋导体的第二掩埋导体。 位于底部的第一树脂板比第二树脂板厚。 每个片状构件包括覆盖半导体芯片的上表面和侧面的粘合构件。
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公开(公告)号:US20060231939A1
公开(公告)日:2006-10-19
申请号:US11405478
申请日:2006-04-18
申请人: Takeshi Kawabata , Motoaki Satou , Toshiyuki Fukuda , Toshio Tsuda , Kazuhiro Nobori , Seiichi Nakatani
发明人: Takeshi Kawabata , Motoaki Satou , Toshiyuki Fukuda , Toshio Tsuda , Kazuhiro Nobori , Seiichi Nakatani
IPC分类号: H01L23/02
CPC分类号: H01L25/0657 , H01L23/5385 , H01L23/5389 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/105 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/451 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2225/0651 , H01L2225/0652 , H01L2225/06541 , H01L2225/06555 , H01L2225/06572 , H01L2225/1023 , H01L2225/107 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2924/1627 , H01L2924/181 , H01L2924/30107 , H01L2924/3011 , H01L2924/3511 , H01L2924/00012 , H01L2924/00 , H01L2224/05599
摘要: A semiconductor module is formed by alternately stacking resin boards and sheet members. Each of the resin boards includes first buried conductors. A semiconductor chip is mounted on the upper face of each of the resin boards. Each of the sheet members having an opening for accommodating the semiconductor chip and including second buried conductors electrically connected to the first buried conductors. A first resin board located at the bottom is thicker than second resin boards. Each of the sheet members includes an adhesive member covering the upper and side faces of the semiconductor chip.
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公开(公告)号:US5305521A
公开(公告)日:1994-04-26
申请号:US903119
申请日:1992-06-23
申请人: Masaki Inaba , Tsuyoshi Baba , Tsuyoshi Orikasa , Takashi Ohba , Toshio Tsuda
发明人: Masaki Inaba , Tsuyoshi Baba , Tsuyoshi Orikasa , Takashi Ohba , Toshio Tsuda
CPC分类号: B41J2/14024 , B41J2/1604 , B41J2/1623 , Y10T29/49401 , Y10T29/4981 , Y10T29/49899 , Y10T29/49902
摘要: Disclosed in an ink-jet head assembling method for executing alignments between a top plate and a heater board. The method comprises steps of holding the top plate by fingers, moving the fingers to bring the top plate to a position above the heater board with adhesives having been applied, releasing the holding of the fingers, enabling them to engage with an ink reception port of the top plate, and moving the fingers sideways to abut against the ink reception port, and adjusting a relative position between heaters of the heater board and nozzles of the top plate.
摘要翻译: 公开了一种用于执行顶板和加热器板之间的对准的喷墨头组装方法。 该方法包括以下步骤:通过手指握住顶板,移动手指以使顶板处于施加粘合剂的上方的加热器板上方的位置,释放手指的保持,使其能够与 顶板,并且使手指侧向移动以抵靠墨水接收口,并且调节加热器板的加热器和顶板的喷嘴之间的相对位置。
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公开(公告)号:US5090119A
公开(公告)日:1992-02-25
申请号:US605096
申请日:1990-10-30
申请人: Toshio Tsuda , Yasuhiko Horio , Yoshihiro Bessho , Toru Ishida
发明人: Toshio Tsuda , Yasuhiko Horio , Yoshihiro Bessho , Toru Ishida
IPC分类号: H01L21/607 , H01L23/485
CPC分类号: H01L24/12 , H01L24/11 , H01L2224/1134 , H01L2224/13099 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , Y10T29/49149 , Y10T29/49151
摘要: A substrate provided with conductive terminals and another substrate provided with electrode pads and two-stepped electrical contact bumps formed respectively on the electrode pads and each consisting of a first raised portion and a second raised portion formed on the first raised portion, are joined securely by bonding the second raised portions coated respectively with droplets of conductive adhesive and the corresponding conductive terminals by the droplets of the conducting adhesive. The ratio of the area of a section of the first raised portion in a plane parallel to the surface of the electrode pad is greater than the area of a section of the second raised portion parallel to the section of the first raised portion at a predetermined ratio. In an exemplary method of forming the electrical contact bump, the second raised portion is formed by bending a conductive wire in a loop by a ball bonding apparatus.
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公开(公告)号:US07365416B2
公开(公告)日:2008-04-29
申请号:US11242904
申请日:2005-10-05
申请人: Takeshi Kawabata , Motoaki Satou , Toshiyuki Fukuda , Toshio Tsuda , Kazuhiro Nobori , Seiichi Nakatani
发明人: Takeshi Kawabata , Motoaki Satou , Toshiyuki Fukuda , Toshio Tsuda , Kazuhiro Nobori , Seiichi Nakatani
IPC分类号: H01L23/02
CPC分类号: H01L23/49816 , H01L21/486 , H01L21/563 , H01L25/105 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2225/1023 , H01L2225/107 , H01L2225/1094 , H01L2924/01078 , H01L2924/15173 , H01L2924/15311 , H01L2924/1627 , H01L2924/3011 , H01L2924/3511 , H01L2924/00 , H01L2924/00012
摘要: A semiconductor module is formed by alternately stacking resin boards 3 on which semiconductor chips 2 are mounted and sheet members having openings larger than the semiconductor chips 2 and bonded to the resin boards 3. The resin board 4 located at the bottom out of the resin boards 3 is thicker than the other resin boards 3.
摘要翻译: 半导体模块通过交替堆叠安装有半导体芯片2的树脂板3和具有比半导体芯片2大的开口的片状部件并且结合到树脂板3而形成。 位于树脂基板3的底部的树脂基板4比其他树脂基板3厚。
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公开(公告)号:US06935457B2
公开(公告)日:2005-08-30
申请号:US10347294
申请日:2003-01-21
申请人: Toshio Tsuda
发明人: Toshio Tsuda
CPC分类号: B62D49/06
摘要: A body frame is provided for a riding tractor. An axis of an engine mounted on the body frame is oriented lengthwise along the tractor and a flywheel is provided on the axis of the engine. The body frame comprises a pair of left and right side members extending lengthwise along the tractor, cross members disposed in front and rear of the engine, respectively, so as to connect the left and right side members to each other, and reinforcing members provided on inside portions of the respective side members. The reinforcing members are disposed laterally inward from the lateral outermost end of the flywheel in a space between the engine and each of the side members.
摘要翻译: 为骑乘拖拉机提供车身框架。 安装在车身框架上的发动机的轴线沿拖拉机纵向定向,并且在发动机的轴线上设置飞轮。 主体框架包括一对沿着拖拉机纵向延伸的左侧和右侧构件,分别设置在发动机的前后的横向构件,以将左侧和右侧构件相互连接,并且将加强构件设置在 各个侧部件的内部。 加强构件在发动机和每个侧构件之间的空间中从飞轮的最外侧侧向内侧布置。
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公开(公告)号:US06041880A
公开(公告)日:2000-03-28
申请号:US969548
申请日:1997-11-13
CPC分类号: B60K11/04 , B60K17/00 , B60K5/12 , B60Y2200/221 , B60Y2200/41
摘要: A frame is disposed between an engine and a transmission casing and is made of three sheet metal parts; an engine mounting part, a transmitting shaft covering part and a transmission casing mounting part. The transmitting shaft covering part consists of two laterally or vertically separable halves which join each other to form a barrel. One end of each half is fixed to the engine mounting part, while the other end is fixed to the transmission casing mounting part. Reinforcing members are disposed below a transmitting shaft housed in the transmitting shaft covering part. An expanded portion is disposed at the other end of the transmitting shaft covering part. An opening edge of the expanded portion is fixed to the transmission casing mounting part.
摘要翻译: 框架设置在发动机和变速器壳体之间,并由三个金属片制成; 发动机安装部,传动轴覆盖部和变速器壳安装部。 传动轴覆盖部分由两个横向或垂直分离的半部组成,它们彼此连接以形成筒体。 每一半的一端固定在发动机安装部上,另一端固定在变速器壳体安装部上。 加强构件设置在容纳在传动轴覆盖部中的传动轴的下方。 扩展部分设置在传动轴覆盖部分的另一端。 膨胀部的开口边缘被固定到变速器壳体安装部。
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