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公开(公告)号：US06241838B1
公开(公告)日：2001-06-05
申请号：US09140705
申请日：1998-08-26
IPC分类号： B32B3126
CPC分类号： H05K1/186 , H01L23/5383 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K1/16 , H05K3/4629 , H05K2201/10636 , Y02P70/611 , Y10T29/435 , Y10T29/49163 , H01L2924/00
摘要： A method of producing a multi-layer ceramic substrate involves the steps of preparing compact blocks including a raw ceramic functional material to be the passive component, preparing a raw composite laminated member having a plurality of laminated ceramic green sheets containing a ceramic insulating material and wiring conductors and preliminarily providing spaces in the inside such that the compact blocks fit into the spaces, arranging sheet type bases made from a raw ceramic not sintered at the baking temperature of the composite laminated member on the principal plane at both ends with respect to the lamination direction of the raw composite laminated member, baking the raw composite laminated member with the raw composite laminated member interposed by the sheet type bases so as to restrain the contraction at a temperature not more than about 1000° C., and eliminating the unsintered sheet type bases.
摘要翻译： 制造多层陶瓷基板的方法包括以下步骤：制备包括作为被动元件的原料陶瓷功能材料的致密块，制备具有多个层压陶瓷生片的原始复合层压元件，所述层压陶瓷生片包含陶瓷绝缘材料和布线 导体，并且预先在内部提供空间，使得紧凑块嵌入空间中，将由未在复合层压构件的烘烤温度下烧结的未烧结陶瓷制成的片状基底相对于层压体在两端设置在主平面上 方向，将原料复合层叠体用原料复合层叠体烘干，将片材类型的基材进行烘烤，以抑制不高于约1000℃的温度的收缩，除去未烧结的片状 基地
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2.发明授权Multilayer ceramic substrate, method for manufacturing the same, and electronic device 有权多层陶瓷基板及其制造方法以及电子设备公开(公告)号：US06811635B2
公开(公告)日：2004-11-02
申请号：US09943389
申请日：2001-08-30
IPC分类号： B32B3126
CPC分类号： B32B18/00 , C04B2235/6567 , C04B2235/786 , C04B2237/066 , C04B2237/341 , C04B2237/343 , C04B2237/345 , C04B2237/346 , C04B2237/348 , C04B2237/361 , C04B2237/365 , C04B2237/68 , H01L2224/16225 , H01L2924/00014 , H01L2924/19105 , H05K1/0306 , H05K3/4611 , H05K3/4629 , H01L2224/0401
摘要： A method for manufacturing a multilayer ceramic substrate includes a firing step wherein low-temperature-sinterable ceramic material contained in green base layers and inorganic material contained in green constraining layers chemically react each other, whereby a reaction layer is formed along an interface between the green base layer and the green constraining layer. The reaction layer acts to enhance a bonding force between the green base layer and the green constraining layer.
摘要翻译： 一种多层陶瓷基板的制造方法，其特征在于，包括在绿色基底层中的低温可烧结陶瓷材料和绿色约束层中所含的无机材料发生化学反应的烧成工序，由此沿着绿色 基层和绿色约束层。 反应层用于增强绿色基底层和绿色约束层之间的结合力。
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3.发明授权公开(公告)号：US06395118B1
公开(公告)日：2002-05-28
申请号：US09584317
申请日：2000-05-31
IPC分类号： B32B3126
CPC分类号： H05K1/186 , C04B35/053 , C04B35/111 , C04B35/185 , C04B35/486 , C04B35/583 , C04B35/63404 , H01L21/481 , H01L21/4857 , H01L23/49822 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K1/162 , H05K3/4611 , H05K3/4629 , H05K3/4688 , H05K2201/10636 , H05K2203/308 , Y02P70/611 , Y10S428/901 , Y10T428/24926 , H01L2924/00
摘要： The present invention provides a method for readily and efficiently manufacturing a ceramic substrate having an excellent dimensional accuracy and small degree of warp comprising the steps of: preparing a non-sintered multilayer ceramic body formed by laminating ceramic layers and conductor layers; forming a multilayer ceramic body-with constraint layers by adhering a first constraint layer and a second constraint layer on one major surface and the other major surface, respectively, of the multilayer ceramic body, the first and second constraint layers being prepared by dispersing a ceramic powder that is not sintered under the sintering condition of the multilayer ceramic body; firing the multilayer ceramic body with the constraint layers under the firing condition of the multilayer ceramic body; and removing the first constraint layer and the second constraint layer after sintering the multilayer ceramic body, wherein the thickness of the first constraint layer is made to be larger than the thickness of the second constraint layer, and the first constraint layer is provided on one major surface that is more largely contracted by firing.
摘要翻译： 本发明提供一种容易且有效地制造具有优异的尺寸精度和小的翘曲度的陶瓷基板的方法，包括以下步骤：制备通过层压陶瓷层和导体层形成的非烧结多层陶瓷体; 通过将第一约束层和第二约束层分别粘附在多层陶瓷体的一个主表面和另一个主表面上来形成具有约束层的多层陶瓷体，所述第一和第二约束层通过将陶瓷 在多层陶瓷体的烧结条件下不烧结的粉末; 在多层陶瓷体的烧制条件下，用约束层烧制多层陶瓷体; 以及在烧结所述多层陶瓷体之后移除所述第一约束层和所述第二约束层，其中使所述第一约束层的厚度大于所述第二约束层的厚度，并且所述第一约束层设置在一个主体上 表面更大程度上是通过射击收缩的。
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公开(公告)号：US06551427B2
公开(公告)日：2003-04-22
申请号：US10096415
申请日：2002-03-11
IPC分类号： B32B3126
CPC分类号： H05K1/186 , C04B35/053 , C04B35/111 , C04B35/185 , C04B35/486 , C04B35/583 , C04B35/63404 , H01L21/481 , H01L21/4857 , H01L23/49822 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K1/162 , H05K3/4611 , H05K3/4629 , H05K3/4688 , H05K2201/10636 , H05K2203/308 , Y02P70/611 , Y10S428/901 , Y10T428/24926 , H01L2924/00
摘要： The present invention provides a method for readily and efficiently manufacturing a ceramic substrate having an excellent dimensional accuracy and small degree of warp comprising the steps of: preparing a non-sintered multilayer ceramic body formed by laminating ceramic layers and conductor layers; forming a multilayer ceramic body with constraint layers by adhering a first constraint layer and a second constraint layer on one major surface and the other major surface, respectively, of the multilayer ceramic body, the first and second constraint layers being prepared by dispersing a ceramic powder that is not sintered under the sintering condition of the multilayer ceramic body; firing the multilayer ceramic body with the constraint layers under the firing condition of the multilayer ceramic body; and removing the first constraint layer and the second constraint layer after sintering the multilayer ceramic body, wherein the thickness of the first constraint layer is made to be larger than the thickness of the second constraint layer, and the first constraint layer is provided on one major surface that is more largely contracted by firing.
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公开(公告)号：US06228196B1
公开(公告)日：2001-05-08
申请号：US09316770
申请日：1999-05-21
IPC分类号： B32B3126
CPC分类号： H05K1/186 , H01L21/4857 , H05K1/0306 , H05K1/16 , H05K3/4629 , H05K2201/10636 , Y02P70/611
摘要： The invention provides a method of producing a multi-layer ceramic substrate comprising a laminated member having a plurality of ceramic layers made of a ceramic insulating material and a wiring conductor, comprising the steps of: preparing a raw compact having the plurality of the laminated ceramic green sheets containing the ceramic insulating material and the wiring conductor; providing raw sheet type bases on the principal plane at both ends with respect to the lamination direction of the raw compact, the raw sheet type bases containing a ceramic not to be sintered at the baking temperature of the raw compact; baking the raw compact in the state interposed between the sheet type bases so as to obtain the laminated member; and eliminating the unsintered sheet type bases; wherein the heat expansion coefficient difference of the sheet type bases and the laminated member after baking is 2.5×10−6 degK−1 or more.
摘要翻译： 本发明提供一种制造多层陶瓷基板的方法，该多层陶瓷基板包括具有由陶瓷绝缘材料和布线导体制成的多个陶瓷层的层叠构件，包括以下步骤：制备具有多个层叠陶瓷 包含陶瓷绝缘材料和布线导体的生片; 相对于原料的层叠方向在两端的主面上设置原料片型基材，在原料的烧成温度下含有不要烧结的陶瓷的原料片型基材; 在插入在片状基底之间的状态下烘烤原料，以获得层压构件; 消除未烧结的片状基材; 其特征在于，所述片状基材和所述层叠体的烘焙后的热膨胀系数差为2.5×10 -6 degK -1以上。
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公开(公告)号：US06414247B1
公开(公告)日：2002-07-02
申请号：US09443230
申请日：1999-11-18
IPC分类号： H05K109
CPC分类号： H05K1/0306 , C03C14/004 , C03C17/06 , C03C2214/08 , C03C2214/20 , H05K1/092
摘要： A glass ceramic multilayer circuit board uses Ag as a conductive material, in which oxidation and diffusion of silver are suppressed. The glass ceramic multilayer circuit board is formed by stacking glass ceramic layers and conductor layers, and then simultaneously burning the layered product. The glass ceramic layers are made of a glass ceramic insulating material which is composed of a glass component and a ceramic component, and to which a metal powder of Cu, Ni or the like is added.
摘要翻译： 玻璃陶瓷多层电路板使用Ag作为导电材料，其中银的氧化和扩散被抑制。 玻璃陶瓷多层电路板通过层叠玻璃陶瓷层和导体层而形成，然后同时燃烧层叠体。 玻璃陶瓷层由玻璃成分和陶瓷成分构成的玻璃陶瓷绝缘材料制成，并且添加有Cu，Ni等的金属粉末。
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公开(公告)号：US20110223399A1
公开(公告)日：2011-09-15
申请号：US13110307
申请日：2011-05-18
申请人： Hiroshige Adachi , Sadaaki Sakamoto
发明人： Hiroshige Adachi , Sadaaki Sakamoto
CPC分类号： H05K1/0306 , C04B35/20 , H01B3/12 , H01L2224/16227 , H01L2924/15192 , H01L2924/15313 , H01L2924/16251 , H01L2924/19105 , H05K3/4611 , H05K3/4629
摘要： Provided is a glass ceramic composition which can be fired at a temperature of 1000° C. or lower, and a sintered body of which has a low relative permittivity and a high Q value, stable temperature characteristic and high reliability, and is excellent in plating solution resistance. The glass ceramic composition provides a low dielectric constant layer for inclusion in a laminate glass ceramic substrate in a ceramic multilayer module. It includes a first ceramic having forsterite as the main constituent, a second ceramic having at least one of SrTiO3 and TiO2 as the main constituent, a third ceramic having BaZrO3 as the main constituent, a fourth ceramic having at least one of ZrO2 and MnO as the main constituent, and 3 weight % or more of a borosilicate glass containing Li2O, MgO, B2O3, SiO2 and ZnO, which further contains an additive constituent including at least one of CaO and SrO.
摘要翻译： 本发明提供一种玻璃陶瓷组合物，其可以在1000℃以下的温度下烧结，其烧结体的相对介电常数低，Q值高，温度特性稳定，可靠性高，电镀性优异 溶液阻力。 玻璃陶瓷组合物提供了用于包含在陶瓷多层模块中的层压玻璃陶瓷基板中的低介电常数层。 它包括以镁橄榄石为主要成分的第一陶瓷，以SrTiO3和TiO2为主要成分的第二陶瓷，以BaZrO3为主要成分的第三陶瓷，具有ZrO 2和MnO中的至少一种的第四陶瓷， 主要成分和含有Li 2 O，MgO，B 2 O 3，SiO 2和ZnO的硼硅酸玻璃的3重量％以上，其还含有包含CaO和SrO中的至少一种的添加剂成分。
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8.发明授权Glass ceramic composition, glass ceramic sintered material and ceramic multilayer substrate 失效玻璃陶瓷组合物，玻璃陶瓷烧结材料和陶瓷多层基板公开(公告)号：US06924245B2
公开(公告)日：2005-08-02
申请号：US10442153
申请日：2003-05-21
申请人： Sadaaki Sakamoto
发明人： Sadaaki Sakamoto
IPC分类号： C04B35/16 , C03C8/14 , C03C14/00 , C04B35/46 , H01B3/12 , H05K1/03 , H05K1/16 , H05K3/46 , C04B35/465 , C03C10/02 , C03C10/04
CPC分类号： H01B3/12 , C03C8/14 , C03C14/004 , H05K1/0306 , H05K1/162 , H05K3/4611 , H05K3/4629 , H05K3/4688 , H05K2201/09672
摘要： A glass ceramic composition which can be fired at a low temperature and which has a high dielectric constant, a relatively small thermal expansion coefficient and a small temperature coefficient of dielectric constant is provided. The glass ceramic composition contains about 5% to 75% by weight of TiO2 powder, about 5% to 75% by weight of CaTiSiO5 powder and about 15% to 50% by weight of glass powder.
摘要翻译： 提供了可以在低温下烧制并具有高介电常数，相对较小的热膨胀系数和较小的介电常数温度系数的玻璃陶瓷组合物。 玻璃陶瓷组合物含有约5％至75％重量的TiO 2粉末，约5％至75％重量的CaTiSiO 5粉末和约15％至50％ 重量百分比的玻璃粉末。
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9.发明授权Multilayered ceramic board, method for fabricating the same, and electronic device using multilayered ceramic board 失效多层陶瓷板，其制造方法以及使用多层陶瓷板的电子器件公开(公告)号：US06776862B2
公开(公告)日：2004-08-17
申请号：US09942461
申请日：2001-08-29
申请人： Sadaaki Sakamoto
发明人： Sadaaki Sakamoto
IPC分类号： B32B3126
CPC分类号： B32B18/00 , C04B2235/6567 , C04B2237/341 , C04B2237/343 , H01L2224/16225 , H01L2924/15192 , H01L2924/19105 , H05K1/0306 , H05K3/4611 , H05K3/4629 , Y10T428/24917 , Y10T428/24926
摘要： A method for fabricating a multilayered ceramic board includes forming a green laminate, the green laminate including a plurality of green base layers containing a low-temperature sinterable ceramic material which is a ceramic powder and a glass component, and a binder; at least one green constraining layer disposed in contact with a principal surface of a specific green base layer, the green constraining layer containing an inorganic material powder which is not sintered at the sintering temperature of the low-temperature sinterable ceramic material; and wiring conductors; and firing the green laminate at the sintering temperature of the low-temperature sinterable ceramic material. The firing step includes a binder removal step and a sintering step for obtaining the sintered state of the low-temperature sinterable ceramic material in which the ceramic powder is densified while the glass component is fluidized. The rate of temperature increase from the binder removal step to the sintering step is set to be more than about ° C./minute.
摘要翻译： 一种多层陶瓷板的制造方法，其特征在于，具备生坯层叠体，所述生坯层叠体包含多个含有陶瓷粉末和玻璃成分的低温可烧结陶瓷材料的绿色基底层和粘合剂; 至少一个与特定绿色基底层的主表面接触的绿色约束层，所述绿色约束层含有在所述低温可烧结陶瓷材料的烧结温度下未烧结的无机材料粉末; 和布线导体; 并在低温可烧结陶瓷材料的烧结温度下焙烧生坯层压体。 焙烧步骤包括粘合剂去除步骤和烧结步骤，用于获得当玻璃组分流化时陶瓷粉末致密化的低温可烧结陶瓷材料的烧结状态。 从粘合剂去除步骤到烧结步骤的温度升高速率设定为大于约℃/分钟。
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公开(公告)号：US08592041B2
公开(公告)日：2013-11-26
申请号：US13110307
申请日：2011-05-18
申请人： Hiroshige Adachi , Sadaaki Sakamoto
发明人： Hiroshige Adachi , Sadaaki Sakamoto
CPC分类号： H05K1/0306 , C04B35/20 , H01B3/12 , H01L2224/16227 , H01L2924/15192 , H01L2924/15313 , H01L2924/16251 , H01L2924/19105 , H05K3/4611 , H05K3/4629
摘要： Provided is a glass ceramic composition which can be fired at a temperature of 1000° C. or lower, and a sintered body of which has a low relative permittivity and a high Q value, stable temperature characteristic and high reliability, and is excellent in plating solution resistance. The glass ceramic composition provides a low dielectric constant layer for inclusion in a laminate glass ceramic substrate in a ceramic multilayer module. It includes a first ceramic having forsterite as the main constituent, a second ceramic having at least one of SrTiO3 and TiO2 as the main constituent, a third ceramic having BaZrO3 as the main constituent, a fourth ceramic having at least one of ZrO2 and MnO as the main constituent, and 3 weight % or more of a borosilicate glass containing Li2O, MgO, B2O3, SiO2 and ZnO, which further contains an additive constituent including at least one of CaO and SrO.
摘要翻译： 本发明提供一种玻璃陶瓷组合物，其可以在1000℃以下的温度下烧结，其烧结体的相对介电常数低，Q值高，温度特性稳定，可靠性高，电镀性优异 溶液阻力。 玻璃陶瓷组合物提供了用于包含在陶瓷多层模块中的层压玻璃陶瓷基板中的低介电常数层。 它包括以镁橄榄石为主要成分的第一陶瓷，以SrTiO3和TiO2为主要成分的第二陶瓷，以BaZrO3为主要成分的第三陶瓷，具有ZrO 2和MnO中的至少一种的第四陶瓷， 主要成分和含有Li 2 O，MgO，B 2 O 3，SiO 2和ZnO的硼硅酸玻璃的3重量％以上，其还含有包含CaO和SrO中的至少一种的添加剂成分。
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