利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

15 条记录 (耗时 0.02 秒)

    Glass ceramic board
    1.
    发明授权
    Glass ceramic board 有权
    玻璃陶瓷板

    公开(公告)号：US06414247B1

    公开(公告)日：2002-07-02

    申请号：US09443230

    申请日：1999-11-18

    申请人： Hideaki Nakai ,  Hirofumi Sunahara ,  Sadaaki Sakamoto

    发明人： Hideaki Nakai ,  Hirofumi Sunahara ,  Sadaaki Sakamoto

    IPC分类号： H05K109

    CPC分类号： H05K1/0306 ,  C03C14/004 ,  C03C17/06 ,  C03C2214/08 ,  C03C2214/20 ,  H05K1/092

    摘要： A glass ceramic multilayer circuit board uses Ag as a conductive material, in which oxidation and diffusion of silver are suppressed. The glass ceramic multilayer circuit board is formed by stacking glass ceramic layers and conductor layers, and then simultaneously burning the layered product. The glass ceramic layers are made of a glass ceramic insulating material which is composed of a glass component and a ceramic component, and to which a metal powder of Cu, Ni or the like is added.

    摘要翻译： 玻璃陶瓷多层电路板使用Ag作为导电材料，其中银的氧化和扩散被抑制。 玻璃陶瓷多层电路板通过层叠玻璃陶瓷层和导体层而形成，然后同时燃烧层叠体。 玻璃陶瓷层由玻璃成分和陶瓷成分构成的玻璃陶瓷绝缘材料制成，并且添加有Cu，Ni等的金属粉末。

    Method for manufacturing ceramic substrate and non-fired ceramic substrate
    2.
    发明授权
    Method for manufacturing ceramic substrate and non-fired ceramic substrate 有权
    制造陶瓷基板和非烧结陶瓷基板的方法

    公开(公告)号：US06395118B1

    公开(公告)日：2002-05-28

    申请号：US09584317

    申请日：2000-05-31

    申请人： Sadaaki Sakamoto ,  Hirofumi Sunahara

    发明人： Sadaaki Sakamoto ,  Hirofumi Sunahara

    IPC分类号： B32B3126

    CPC分类号： H05K1/186 ,  C04B35/053 ,  C04B35/111 ,  C04B35/185 ,  C04B35/486 ,  C04B35/583 ,  C04B35/63404 ,  H01L21/481 ,  H01L21/4857 ,  H01L23/49822 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K1/162 ,  H05K3/4611 ,  H05K3/4629 ,  H05K3/4688 ,  H05K2201/10636 ,  H05K2203/308 ,  Y02P70/611 ,  Y10S428/901 ,  Y10T428/24926 ,  H01L2924/00

    摘要： The present invention provides a method for readily and efficiently manufacturing a ceramic substrate having an excellent dimensional accuracy and small degree of warp comprising the steps of: preparing a non-sintered multilayer ceramic body formed by laminating ceramic layers and conductor layers; forming a multilayer ceramic body-with constraint layers by adhering a first constraint layer and a second constraint layer on one major surface and the other major surface, respectively, of the multilayer ceramic body, the first and second constraint layers being prepared by dispersing a ceramic powder that is not sintered under the sintering condition of the multilayer ceramic body; firing the multilayer ceramic body with the constraint layers under the firing condition of the multilayer ceramic body; and removing the first constraint layer and the second constraint layer after sintering the multilayer ceramic body, wherein the thickness of the first constraint layer is made to be larger than the thickness of the second constraint layer, and the first constraint layer is provided on one major surface that is more largely contracted by firing.

    摘要翻译： 本发明提供一种容易且有效地制造具有优异的尺寸精度和小的翘曲度的陶瓷基板的方法，包括以下步骤：制备通过层压陶瓷层和导体层形成的非烧结多层陶瓷体; 通过将第一约束层和第二约束层分别粘附在多层陶瓷体的一个主表面和另一个主表面上来形成具有约束层的多层陶瓷体，所述第一和第二约束层通过将陶瓷 在多层陶瓷体的烧结条件下不烧结的粉末; 在多层陶瓷体的烧制条件下，用约束层烧制多层陶瓷体; 以及在烧结所述多层陶瓷体之后移除所述第一约束层和所述第二约束层，其中使所述第一约束层的厚度大于所述第二约束层的厚度，并且所述第一约束层设置在一个主体上 表面更大程度上是通过射击收缩的。

    Method of producing a multi-layer ceramic substrate
    4.
    发明授权
    Method of producing a multi-layer ceramic substrate 失效
    多层陶瓷基板的制造方法

    公开(公告)号：US06241838B1

    公开(公告)日：2001-06-05

    申请号：US09140705

    申请日：1998-08-26

    申请人： Sadaaki Sakamoto ,  Hirofumi Sunahara ,  Hiroshi Takagi ,  Yukio Sakabe

    发明人： Sadaaki Sakamoto ,  Hirofumi Sunahara ,  Hiroshi Takagi ,  Yukio Sakabe

    IPC分类号： B32B3126

    CPC分类号： H05K1/186 ,  H01L23/5383 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K1/16 ,  H05K3/4629 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/435 ,  Y10T29/49163 ,  H01L2924/00

    摘要： A method of producing a multi-layer ceramic substrate involves the steps of preparing compact blocks including a raw ceramic functional material to be the passive component, preparing a raw composite laminated member having a plurality of laminated ceramic green sheets containing a ceramic insulating material and wiring conductors and preliminarily providing spaces in the inside such that the compact blocks fit into the spaces, arranging sheet type bases made from a raw ceramic not sintered at the baking temperature of the composite laminated member on the principal plane at both ends with respect to the lamination direction of the raw composite laminated member, baking the raw composite laminated member with the raw composite laminated member interposed by the sheet type bases so as to restrain the contraction at a temperature not more than about 1000° C., and eliminating the unsintered sheet type bases.

    摘要翻译： 制造多层陶瓷基板的方法包括以下步骤：制备包括作为被动元件的原料陶瓷功能材料的致密块，制备具有多个层压陶瓷生片的原始复合层压元件，所述层压陶瓷生片包含陶瓷绝缘材料和布线 导体，并且预先在内部提供空间，使得紧凑块嵌入空间中，将由未在复合层压构件的烘烤温度下烧结的未烧结陶瓷制成的片状基底相对于层压体在两端设置在主平面上 方向，将原料复合层叠体用原料复合层叠体烘干，将片材类型的基材进行烘烤，以抑制不高于约1000℃的温度的收缩，除去未烧结的片状 基地

    Method of producing a multi-layer ceramic substrate
    6.
    发明授权
    Method of producing a multi-layer ceramic substrate 有权
    多层陶瓷基板的制造方法

    公开(公告)号：US06228196B1

    公开(公告)日：2001-05-08

    申请号：US09316770

    申请日：1999-05-21

    申请人： Sadaaki Sakamoto ,  Hirofumi Sunahara ,  Mitsuyoshi Nishide

    发明人： Sadaaki Sakamoto ,  Hirofumi Sunahara ,  Mitsuyoshi Nishide

    IPC分类号： B32B3126

    CPC分类号： H05K1/186 ,  H01L21/4857 ,  H05K1/0306 ,  H05K1/16 ,  H05K3/4629 ,  H05K2201/10636 ,  Y02P70/611

    摘要： The invention provides a method of producing a multi-layer ceramic substrate comprising a laminated member having a plurality of ceramic layers made of a ceramic insulating material and a wiring conductor, comprising the steps of: preparing a raw compact having the plurality of the laminated ceramic green sheets containing the ceramic insulating material and the wiring conductor; providing raw sheet type bases on the principal plane at both ends with respect to the lamination direction of the raw compact, the raw sheet type bases containing a ceramic not to be sintered at the baking temperature of the raw compact; baking the raw compact in the state interposed between the sheet type bases so as to obtain the laminated member; and eliminating the unsintered sheet type bases; wherein the heat expansion coefficient difference of the sheet type bases and the laminated member after baking is 2.5×10−6 degK−1 or more.

    摘要翻译： 本发明提供一种制造多层陶瓷基板的方法，该多层陶瓷基板包括具有由陶瓷绝缘材料和布线导体制成的多个陶瓷层的层叠构件，包括以下步骤：制备具有多个层叠陶瓷 包含陶瓷绝缘材料和布线导体的生片; 相对于原料的层叠方向在两端的主面上设置原料片型基材，在原料的烧成温度下含有不要烧结的陶瓷的原料片型基材; 在插入在片状基底之间的状态下烘烤原料，以获得层压构件; 消除未烧结的片状基材; 其特征在于，所述片状基材和所述层叠体的烘焙后的热膨胀系数差为2.5×10 -6 degK -1以上。

    Crystalline glass composition for use in circuit board, sintered crystalline glass, insulator composition insulating paste and thick film circuit board
    7.
    发明授权
    Crystalline glass composition for use in circuit board, sintered crystalline glass, insulator composition insulating paste and thick film circuit board 有权
    晶体玻璃组合物用于电路板，烧结晶体玻璃，绝缘体组合物绝缘膏和厚膜电路板

    公开(公告)号：US06270880B1

    公开(公告)日：2001-08-07

    申请号：US09418926

    申请日：1999-10-15

    申请人： Hiromichi Kawakami ,  Hirofumi Sunahara ,  Toshiki Tanaka ,  Shizuharu Watanabe ,  Hiroshi Takagi

    发明人： Hiromichi Kawakami ,  Hirofumi Sunahara ,  Toshiki Tanaka ,  Shizuharu Watanabe ,  Hiroshi Takagi

    IPC分类号： B32B300

    CPC分类号： C03C10/0009 ,  H01L23/15 ,  H01L23/49894 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/0306 ,  Y10T428/24926 ,  H01L2924/00

    摘要： Provided is a crystalline glass composition for use in a circuit board that can be sintered at a temperature of 1100° C. and is endowed with favorable characteristics such as a relative dielectric constant of as low as ½ and a thermal expansion coefficient of as high as 12 ppm/° C. as an electrical insulating insulator for use in a circuit board. The crystalline glass composition contains SiO2, MgO and CaO, the composition ratio of SiO2, MgO and CaO in % by weight falling within an area surrounded by the lines connecting the points A (25, 45, 30), B (25, 0, 75), C (44, 0, 56), D (44, 22, 34), E (40, 19, 41) and F (29, 40, 31) in a ternary phase diagram wherein at least one melwinite, monticellite or calcium silicate crystalline phase is deposited by heat-treating the composition. A ceramic powder having a thermal expansion coefficient of about 6.0 ppm/C or more is sometimes added in the powder comprising the glass composition.

    摘要翻译： 本发明提供一种用于电路板的结晶玻璃组合物，其可以在1100℃的温度下烧结并具有良好的特性，例如相对介电常数低至1/2，热膨胀系数高达 12ppm /℃作为用于电路板的电绝缘绝缘体。 结晶玻璃组合物含有SiO 2，MgO和CaO，SiO 2，MgO和CaO的组成比以重量百分比落入由连接点A（25,45,30），B（25,0， 75），C（44，0，56），D（44,22,34），E（40,19,41）和F（29,40,31），其中至少一种黄铁矿， 或通过热处理该组合物沉积硅酸钙结晶相。 有时在包含玻璃组合物的粉末中加入热膨胀系数约为6.0ppm /℃以上的陶瓷粉末。

    Inductance-capacitance composite component with a glass having a low temperature softening point
    8.
    发明授权
    Inductance-capacitance composite component with a glass having a low temperature softening point 失效
    具有低温软化点的玻璃的电感 - 电容复合部件

    公开(公告)号：US6094111A

    公开(公告)日：2000-07-25

    申请号：US971505

    申请日：1997-11-17

    申请人： Hirofumi Sunahara

    发明人： Hirofumi Sunahara

    IPC分类号： H01F27/00 ,  H01G4/08 ,  H01G4/40 ,  H03H7/01

    CPC分类号： H03H7/0115 ,  H03H2001/0057 ,  H03H2001/0085

    摘要： An inductance-capacitance (LC) composite component comprising a body obtained by monolithically sintering a capacitor portion having a layered structure consisting of a dielectric ceramic layer and an electrode layer with an inductor portion having a layered structure consisting of a magnetic ceramic layer and an electrode layer, wherein at least one of said dielectric ceramic layer and said magnetic layer contains a glass having a softening point of 800.degree. C. or lower, and said dielectric ceramic layer and said magnetic layer are monolithically sintered at a temperature of 1,000.degree. C. or lower. The LC composite component is free from generation of cracks and degradation in characteristics, and is thereby highly reliable.

    摘要翻译： 一种电感 - 电容（LC）复合元件，包括通过将具有由介电陶瓷层和电极层组成的层状结构的电容器部分整体烧结而获得的主体，其电感部分具有由磁性陶瓷层和电极 其中所述介电陶瓷层和所述磁性层中的至少一个包含软化点为800℃或更低的玻璃，并且所述介电陶瓷层和所述磁性层在1000℃的温度下被整体烧结。 或更低。 LC复合组分不产生裂纹和特性劣化，因此高度可靠。

    Multilayered ceramic substrate and production method therefor
    9.
    发明授权
    Multilayered ceramic substrate and production method therefor 有权
    多层陶瓷基板及其制备方法

    公开(公告)号：US06743316B2

    公开(公告)日：2004-06-01

    申请号：US10001316

    申请日：2001-11-01

    申请人： Hideyuki Harada ,  Hirofumi Sunahara

    发明人： Hideyuki Harada ,  Hirofumi Sunahara

    IPC分类号： B32B3126

    CPC分类号： H01L21/481 ,  Y10T29/49124

    摘要： In a ceramic green-sheet stack to be fired to form a multilayered ceramic substrate having a cavity, a shrinkage-reducing pad is formed along a boundary interface between first ceramic green sheets having an opening for defining a cavity, and second ceramic green sheets having no opening. The shrinkage-reducing pad is exposed on the entire periphery of the inner peripheral surface of the cavity at the bottom end of the inner peripheral surface. The shrinkage-reducing pad contains a glass component, and serves to reduce shrinkage stress produced at the boundary interface between the first and second ceramic green sheets during the firing process.

    摘要翻译： 在烧成陶瓷生片叠层以形成具有空腔的多层陶瓷基板的情况下，沿着具有用于形成空腔的开口的第一陶瓷生片之间的边界界面形成收缩减少垫，并且具有第 没有开放 收缩减少垫在内周面的底端的空腔的内周面的整个周边露出。 收缩减少垫包含玻璃成分，用于在烧制工序中减少在第一和第二陶瓷生片之间的边界界面产生的收缩应力。