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公开(公告)号：US20190322935A1
公开(公告)日：2019-10-24
申请号：US16391222
申请日：2019-04-22
发明人： Jong Hee PARK , Ki Tae KIM , Jin Seock KIM , Gyu-Po KIM , Hyun-Cheol SHIN , Dae-Woo LEE , Sang-Hyuk LEE
摘要： An etchant composition is presented. The composition includes: 18 wt % to 25 wt % of a first organic acid compound; 15 wt % to 20 wt % of a second organic acid compound; 8.1 wt % to 9.9 wt % of an inorganic acid compound; 1 wt % to 4.9 wt % of a sulfonic acid compound; 10 wt % to 20 wt % of a hydrogen sulfate salt compound; 1 wt % to 5 wt % of a nitrogen-containing dicarbonyl compound; 1 wt % to 5 wt % of an amino acid derivative compound; 0.1 wt % to 2 wt % of an iron-containing oxidizing agent compound; and a balance amount of water.
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2.发明申请ETCHANT COMPOSITION, METAL WIRING, AND METHOD OF MANUFACTURING A DISPLAY SUBSTRATE 审中-公开蚀刻组合物，金属接线以及制造显示基板的方法公开(公告)号：US20140097006A1
公开(公告)日：2014-04-10
申请号：US13874934
申请日：2013-05-01
发明人： Hong-Sick PARK , Wang-Woo LEE , Bong-Kyun KIM , Jong-Hyun CHOUNG , Young-Woo PARK , Gyu-Po KIM , Won-Guk SEO , Hyun-Cheol SHIN , Seung-Yeon HAN , Ki-Beom LEE , Sam-Young CHO
CPC分类号： H05K3/067 , H01L27/1225 , H01L27/124 , H01L29/458 , H01L29/4908 , H01L29/7869 , H05K1/09
摘要： A wet etching composition usable for etching a copper-based wiring layer includes between about 40% by weight to about 60% by weight of phosphoric acid, between about 1% by weight to about 10% by weight of nitric acid, between about 3% by weight to about 15% by weight of acetic acid, between about 0.01% by weight to about 0.1% by weight of a copper-ion compound, between about 1% by weight to about 10% by weight of a nitric salt, between about 1% by weight to about 10% by weight of an acetic salt, and a remainder of water
摘要翻译： 可用于蚀刻铜基布线层的湿蚀刻组合物包括约40重量％至约60重量％的磷酸，约1重量％至约10重量％的硝酸，约3重量％ 至约15重量％的乙酸，约0.01重量％至约0.1重量％的铜离子化合物，约1重量％至约10重量％的硝酸盐之间，介于约 1重量％至约10重量％的乙酸盐，剩余的水
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公开(公告)号：US20140011352A1
公开(公告)日：2014-01-09
申请号：US13728463
申请日：2012-12-27
发明人： Jong-Hyun CHOUNG , In-Bae KIM , Seon-Il KIM , Hong Sick PARK , Jae Woo JEONG , Gyu-Po KIM , Won-Guk SEO , Hyun-Cheol SHIN , Ki-Beom LEE , Sam-Young CHO , Seung-Yeon HAN
CPC分类号： C23F1/18 , C23F1/26 , H01L21/4814
摘要： A metal wire etchant including persulfate, a sulfonate, a fluorine compound, an azole-based compound, an organic acid, a nitrate, and a chlorine compound, and a method of making the same.
摘要翻译： 包括过硫酸盐，磺酸盐，氟化合物，唑类化合物，有机酸，硝酸盐和氯化合物的金属线蚀刻剂及其制备方法。
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4.发明申请公开(公告)号：US20200148951A1
公开(公告)日：2020-05-14
申请号：US16579073
申请日：2019-09-23
发明人： Jonghee PARK , Kitae KIM , Jinseock KIM , Gyu-Po KIM , Hyun-Cheol SHIN , Dae-Woo LEE , Sang-Hyuk LEE , Zheng HONG
IPC分类号： C09K13/06
摘要： An etching composition includes an inorganic acid compound, a carboxylic acid compound, a sulfonic acid compound, a glycol compound, a nitrogen-containing dicarbonyl compound, a sulfate compound and water.
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公开(公告)号：US20200148950A1
公开(公告)日：2020-05-14
申请号：US16575593
申请日：2019-09-19
发明人： Jonghee PARK , Kitae KIM , Jinseock KIM , Gyu-Po KIM , Hyun-Cheol SHIN , Dae-Woo LEE , Sang-Hyuk LEE
IPC分类号： C09K13/06
摘要： An etching composition for a silver-containing thin film includes an inorganic acid compound, a carboxylic acid compound, a sulfonic acid compound, a glycol compound, a nitrogen-containing dicarbonyl compound, a metal-based oxidizer, and water.
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6.发明申请ETCHANT COMPOSITION, AND METHOD OF MANUFACTURING A DISPLAY SUBSTRATE USING THE SAME 有权蚀刻组合物，以及使用其制造显示基板的方法公开(公告)号：US20140295626A1
公开(公告)日：2014-10-02
申请号：US13964371
申请日：2013-08-12
发明人： Hong-Sick PARK , Young-Jun KIM , Young-Woo PARK , Wang-Woo LEE , Won-Guk SEO , Sam-Young CHO , Seung-Yeon HAN , Gyu-Po KIM , Hyun-Cheol SHIN , Ki-Beom LEE
CPC分类号： C23F1/18 , H01L21/67075 , H01L27/124 , H01L27/1259 , H01L29/4908 , H01L29/66969 , H01L29/78633 , H01L29/7869
摘要： An etchant composition includes about 25 percent by weight to about 35 percent by weight of phosphoric acid, about 3 percent by weight to about 9 percent by weight of nitric acid, about 10 percent by weight to about 20 percent by weight of acetic acid, about 5 percent by weight to about 10 percent by weight of a nitrate, about 6 percent by weight to about 15 percent by weight of a sulfonic acid, about 1 percent by weight to about 5 percent by weight of an amine compound including a carboxyl group, about 0.1 percent by weight to about 1 percent by weight of a water-soluble amino acid, about 0.01 percent by weight to about 1 percent by weight of an azole compound, and water.
摘要翻译： 蚀刻剂组合物包括约25重量％至约35重量％的磷酸，约3重量％至约9重量％的硝酸，约10重量％至约20重量％的乙酸，约 5重量％至10重量％的硝酸盐，约6重量％至约15重量％的磺酸，约1重量％至约5重量％的包含羧基的胺化合物， 约0.1重量％至约1重量％的水溶性氨基酸，约0.01重量％至约1重量％的唑化合物和水。
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