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公开(公告)号:US20240027890A1
公开(公告)日:2024-01-25
申请号:US18180210
申请日:2023-03-08
Applicant: Samsung Electronics Co., Ltd.
Inventor: Hyungjong Bae , Hyun Jung Hwang , Heebom Kim , Seong-Bo Shim , Seungyoon Lee , Woo-Yong Jung , Chan Hwang
Abstract: A reflective mask used in an EUV exposure process includes a mask substrate, a reflective layer on the mask substrate, and an absorption layer on the reflective layer. The reflective mask includes a main region, an out-of-band region surrounding the main region, and an alignment mark region outside a periphery of the out-of-band region. The absorption layer in the alignment mark region includes an alignment mark and an anti-reflection pattern adjacent the alignment mark, and the anti-reflection pattern includes line-and-space patterns having a predetermined line width in the alignment mark region.
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公开(公告)号:US11086210B2
公开(公告)日:2021-08-10
申请号:US16578628
申请日:2019-09-23
Applicant: Samsung Electronics Co., Ltd.
Inventor: Yigwon Kim , Sangjin Kim , Heeyoung Go , Heebom Kim , Hoon Kim , Hong-Seock Choi , Jinseok Heo
IPC: G03F1/24
Abstract: Disclosed are photomasks, methods of fabricating the same, and methods of manufacturing semiconductor devices using the same. The photomask comprises a substrate including a pattern region and a peripheral region around the pattern region, a reflection layer on the pattern region and extending onto the peripheral region, an absorption structure on the reflection layer, and a dielectric pattern on the absorption structure on the peripheral region and exposing the absorption structure on the pattern region.
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公开(公告)号:US11409193B2
公开(公告)日:2022-08-09
申请号:US17028049
申请日:2020-09-22
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Mankyu Kang , Hoon Kim , Jongkeun Oh , Minho Kim , Heebom Kim
Abstract: A reticle for an apparatus for EUV exposure and a method of manufacturing a reticle, the reticle including a substrate including an edge region and a main region; a multi-layer structure on the main region and the edge region, a sidewall of the multi-layer structure overlying the edge region; a capping layer covering an upper surface and the sidewall of the multi-layer structure and at least a portion of the edge region of the substrate; and an absorber layer on the capping layer, the absorber layer covering an entire upper surface of the capping layer on the edge region of the substrate, wherein a stacked structure of the capping layer and the absorber layer is on an upper surface of the edge region of the substrate, and a sidewall of the stacked structure of the capping layer and the absorber layer is perpendicular to an upper surface of the substrate.
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公开(公告)号:US20190243234A1
公开(公告)日:2019-08-08
申请号:US16125864
申请日:2018-09-10
Applicant: Samsung Electronics Co., Ltd.
Inventor: Yongseung MOON , Heebom Kim , Changyoung Jeong
Abstract: Provided is a pellicle to be used in a photolithography process. The pellicle a film, at least a portion of which includes carbon allotropes. The film has a first surface and a second surface facing the first surface, the film comprises a doped region including dopants, the doped region adjacent to the first surface, the dopants include least one of boron or nitrogen, and the doped region comprises a bond between an atom of at least one of the dopants and a carbon atom.
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