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    SEMICONDUCTOR LIGHT-EMITTING DEVICE
    2.
    发明公开
    SEMICONDUCTOR LIGHT-EMITTING DEVICE 审中-公开

    公开(公告)号：US20240290915A1

    公开(公告)日：2024-08-29

    申请号：US18581676

    申请日：2024-02-20

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Juwon Jeong ,  Sanghyun Kim ,  Jiho You ,  Sungwoo Choi

    IPC: H01L33/46 ,  H01L33/50 ,  H01L33/60

    CPC classification number: H01L33/46 ,  H01L33/502 ,  H01L33/60

    Abstract: A semiconductor light-emitting device includes a light emitting structure, a wavelength conversion member arranged on an upper surface of the light emitting structure, the wavelength conversion member including a first surface in contact with the light emitting structure, a second surface opposite to the first surface, and a sidewall, wherein the first surface entirely covers the upper surface of the light emitting structure, and a portion of the sidewall adjacent to the first surface is slanted with respect to the first surface, and a coating layer arranged on the second surface of the wavelength conversion member, the coating layer including a first material layer and a second material layer alternately stacked on the second surface, wherein the first material layer includes an oxide, and the second material layer includes magnesium fluoride (MgF2), wherein the second material layer is arranged at an uppermost surface of the coating layer.

    Semiconductor light emitting device and semiconductor light emitting package
    3.
    发明授权
    Semiconductor light emitting device and semiconductor light emitting package 有权

    公开(公告)号：US11735694B2

    公开(公告)日：2023-08-22

    申请号：US16908921

    申请日：2020-06-23

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Jae-Yoon Kim ,  Sungjoon Kim ,  Sanghyun Kim

    IPC: H01L33/38 ,  H01L25/075 ,  H01L33/32

    CPC classification number: H01L33/382 ,  H01L25/0753 ,  H01L33/32

    Abstract: Semiconductor light emitting devices and packages are provided. The semiconductor light emitting device includes a substrate, a luminous structure, and first and second electrodes. The substrate has a first region and a second region that is spaced apart in a first direction from the first region. The luminous structure includes a first semiconductor layer, an active layer, and a second semiconductor layer that are sequentially stacked on the substrate. The first electrode is on the second semiconductor layer. The second electrode is electrically coupled to the first semiconductor layer through plural first openings that penetrate the first electrode, the second semiconductor layer, and the active layer, where the first openings expose the first semiconductor layer. The first electrode is in contact with the second semiconductor layer in the first region and in the second region, and the first openings are in the first region.

    Reticle in an apparatus for extreme ultraviolet exposure
    5.
    发明授权
    Reticle in an apparatus for extreme ultraviolet exposure 有权

    公开(公告)号：US11835850B2

    公开(公告)日：2023-12-05

    申请号：US17173245

    申请日：2021-02-11

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Sanghyun Kim ,  Jinho Jeon

    IPC: G03F1/24 ,  G03F1/58 ,  G03F1/60 ,  H01L21/033

    CPC classification number: G03F1/24 ,  G03F1/58 ,  G03F1/60 ,  H01L21/0332 ,  H01L21/0337

    Abstract: A reticle in an apparatus for extreme ultraviolet (EUV) exposure includes a substrate having an image area and a black border area surrounding the image area, a multi-layer structure on the image area and the black border area of the substrate, the multi-layer structure to reflect EUV light, a capping layer covering the multi-layer structure, first absorber layer patterns on the capping layer in the image area and the black border area, and an absorber structure on the capping layer in the black border area, the absorber structure including one of the first absorber layer patterns, a hard mask pattern, and a second absorber layer pattern sequentially stacked, the absorber structure covering an entire upper surface of the capping layer in the black border area.

    Package box assembly comprising hanger
    7.
    发明授权
    Package box assembly comprising hanger 有权

    公开(公告)号：US12221255B2

    公开(公告)日：2025-02-11

    申请号：US18359265

    申请日：2023-07-26

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Sanghyun Kim ,  Kwangchul Park

    IPC: B65D5/52 ,  B65D5/42

    Abstract: A package box assembly is provided. The package box assembly includes a first box comprising an accommodation portion defined by a plate and a side wall disposed to surround the plate along the periphery of the plate and having a designated height, a second box accommodated in the accommodation portion, a hanger disposed in a first space of the accommodation portion to protrude through an opening formed in the side wall, an elastic member disposed in the first space to press the hanger toward the opening, and a sealing member removably disposed on the side wall to seal the opening. The hanger is accommodated in the first space while being pushed by pressure from the elastic member. In case that the sealing member is removed, the hanger at least partially protrudes to the outside of the first box via the opening by the pushing force of the elastic member.

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