摘要:
An image sensor includes a first column line and a second column line configured to extend in a first direction, a plurality of pixel groups configured to connect to the first column line or the second column line and to comprise a plurality of pixels in each of the plurality of pixel groups, a bias circuit configured to comprise a first current circuit and a second current circuit configured to output different bias currents in a first operational mode, and a switching circuit configured to connect the first column line to the first current circuit and connect the second column line to the second current circuit during a first time period, and to connect the first column line to the second current circuit and connect the second column line to the first current circuit during a second time period subsequent to the first time period in the first operational mode.
摘要:
An image sensor includes a first column line and a second column line configured to extend in a first direction, a plurality of pixel groups configured to connect to the first column line or the second column line and to comprise a plurality of pixels in each of the plurality of pixel groups, a bias circuit configured to comprise a first current circuit and a second current circuit configured to output different bias currents in a first operational mode, and a switching circuit configured to connect the first column line to the first current circuit and connect the second column line to the second current circuit during a first time period, and to connect the first column line to the second current circuit and connect the second column line to the first current circuit during a second time period subsequent to the first time period in the first operational mode.
摘要:
An image sensor includes a first column line and a second column line configured to extend in a first direction, a plurality of pixel groups configured to connect to the first column line or the second column line and to comprise a plurality of pixels in each of the plurality of pixel groups, a bias circuit configured to comprise a first current circuit and a second current circuit configured to output different bias currents in a first operational mode, and a switching circuit configured to connect the first column line to the first current circuit and connect the second column line to the second current circuit during a first time period, and to connect the first column line to the second current circuit and connect the second column line to the first current circuit during a second time period subsequent to the first time period in the first operational mode.
摘要:
An analog-to-digital converter includes a gain amplification unit configured to receive a pixel signal at a first node and to amplify a gain of the pixel signal, a first capacitor connected between the first node and a second node, an amplifier configured to receive and amplify a signal output from the gain amplification unit and the first capacitor, and a conversion circuit configured to convert an output signal of the amplifier to a digital signal based on a reference signal and output the digital signal as a first output signal.
摘要:
A programmable gain amplifier includes a sampling circuit, a source follower, a first capacitor and an error amplifier. The sampling circuit is configured to perform correlated double sampling on an input signal using a reference voltage. The first capacitor is connected between the sampling circuit and the source follower. The error amplifier is connected between an input terminal of the source follower and an output terminal of the source follower. The error amplifier is configured to reset a voltage of the output terminal of the source follower to the reference voltage during a source follower reset operation.
摘要:
The disclosure provides a method of an appliance, including receiving prediction information indicating a predicted failure of the appliance, obtaining a schedule for which use of a repair service for repairing the predicted failure based on the prediction information is available, transmitting a signal for requesting maintenance information used to delay the predicted failure and maintain a normal operation of the appliance if the obtained schedule is after a predicted failure time point indicated by the prediction information, receiving the maintenance information, and operating based on the maintenance information.
摘要:
An image sensor and an image processing system including the same are provided. The image sensor includes a pixel array including a plurality of pixels each connected to one of first through m-th column lines to output a pixel signal, where “m” is an integer of at least 2; analog-to-digital converters each configured to receive the pixel signal corresponding to one of the first through m-th column lines, to compare the pixel signal with a ramp signal, and to convert the pixel signal to a digital pixel signal; and a blocking circuit connected to an input terminal of at least one of the analog-to-digital converters to block an influence of an operation of others among the analog-to-digital converters.
摘要:
An image sensor for reducing channel variation and an image processing system including the same. The image sensor includes first to mth pixels (m≧2), each of which is connected to a corresponding column line from among first to mth column lines and is configured to output a respective pixel signal.’ The image sensor further includes first to mth bias circuits, each of which is connected to a corresponding column line from among the first to mth column lines and is configured to fix a voltage of the corresponding column line to a bias voltage when a column line-specific pixel is not selected to output the respective pixel signal. An analog-to-digital converter in the image sensor is configured to convert the pixel signals into digital signals.
摘要:
A test apparatus includes a first module configured to structurally support a target semiconductor device, and a second module reversibly attachable to the first module. The first module includes a first housing including one or more inner surfaces at least partially defining an inner space, a volume control unit configured to control a volume of the inner space, a mounting unit at least partially exposed to the inner space and configured to be exposed to the target semiconductor device, and a magnetic force control unit in the first housing. The second module includes a second housing, a test board in the second housing, and an attachable/detachable member in the second housing. The test board may be electrically connected to the target semiconductor device. The magnetic force control unit may control a magnetic property of the attachable/detachable member to cause the attachable/detachable member to attach/detach to/from the magnetic force control unit.