公开(公告)号：US20240193415A1

公开(公告)日：2024-06-13

申请号：US18356612

申请日：2023-07-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seong-Jin PARK ,  Seon Min RHEE ,  Jaewon YANG

IPC: G06N3/08

CPC classification number: G06N3/08

Abstract: A processor-implemented method including generating a first corrected result image of a first desired pattern image using a backward correction neural network provided an input based on the first desired pattern image, the backward correction neural network performing a backward correction of a first process, generating a first simulated result image using a forward simulation neural network based on the first corrected result image, the forward simulation neural network performing a forward simulation of a performance of the first process, and updating the first corrected result image so that an error between the first desired pattern image and the first simulated result image is reduced.

公开(公告)号：US20240168372A1

公开(公告)日：2024-05-23

申请号：US18518551

申请日：2023-11-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Deokyoung KANG ,  Youngchul KWAK ,  Serim RYOU ,  Seong-Jin PARK ,  Seon Min RHEE ,  Jaewon YANG ,  Eunju KIM ,  Hyeok LEE

IPC: G03F1/72 ,  G06T7/564

CPC classification number: G03F1/72 ,  G06T7/564 ,  G06T2207/10032 ,  G06T2207/10061 ,  G06T2207/20081 ,  G06T2207/20084 ,  G06T2207/30148

Abstract: A method and apparatus for estimating a resist image (RI) are disclosed. The method includes obtaining an aerial image (AI) and a first RI from a mask image (MI), obtaining a second RI from the AI, and obtaining a third RI based on the first RI and the second RI.

公开(公告)号：US20250123243A1

公开(公告)日：2025-04-17

申请号：US18670118

申请日：2024-05-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyeon Bo SHIM ,  Souk KIM ,  Younghoon SOHN ,  Jaeho KIM ,  Inseok PARK ,  Jaewon YANG ,  Minho RIM

IPC: G01N29/04 ,  G01N29/24

Abstract: A semiconductor substrate inspection device is provided and includes: a function generator that generates a first signal and a second signal; an ultrasonic generator that receives the first signal generated from the function generator, generates an ultrasonic wave based on the first signal, and generates a surface wave signal on an upper surface of a substrate using the ultrasonic wave; and an electron beam measurer that inspects the surface wave signal, wherein the electron beam measurer includes: a laser light source that receives the second signal generated from the function generator and generates a first pulse laser beam based on the second signal; an electron beam generator that receives the first pulse laser beam and generates an electron beam that is emitted onto the upper surface of the substrate; and a backscattered electron detector that detects backscattered electrons generated based on the electron beam being incident on the substrate.

公开(公告)号：US20230197460A1

公开(公告)日：2023-06-22

申请号：US18072998

申请日：2022-12-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaewon YANG ,  Seongjin PARK ,  Sangchul YEO ,  Seonmin RHEE ,  Hyeok LEE ,  Sooryong LEE ,  Seungju HAN

IPC: H01L21/308 ,  G06T3/40 ,  G06V10/46 ,  G06V10/82 ,  G03F7/20

CPC classification number: H01L21/308 ,  G03F7/70616 ,  G06T3/4007 ,  G06V10/46 ,  G06V10/82

Abstract: A semiconductor device patterning method includes generating an input image by imaging information about a pattern of a sample, acquiring an output image of the pattern of the sample after a preset semiconductor process with respect to the sample, generating a predictive model through learning using a Deep Neural Network (DNN) with the input image and the output image, and predicting a pattern image after the semiconductor process for a pattern of a semiconductor device by using the predictive model.

公开(公告)号：US20240303824A1

公开(公告)日：2024-09-12

申请号：US18594453

申请日：2024-03-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyeok LEE ,  Jaewon YANG ,  Gun HUH

IPC: G06T7/12 ,  G06T7/00 ,  G06T7/143

CPC classification number: G06T7/12 ,  G06T7/0004 ,  G06T7/143 ,  G06T2207/20081 ,  G06T2207/20084 ,  G06T2207/30148

Abstract: Provided is a contour probability prediction method of probabilistically predicting a contour, the contour probability prediction method including acquiring a plurality of contour images for an image of a wafer on which a process has been performed according to a design image, calculating a contour average and a contour standard deviation from the plurality of contour images, generating a probability distribution image calculated with a predetermined probability distribution, on the basis of the contour average and the contour standard deviation, and deep-learning-training a probability prediction model by inputting the design image and the probability distribution image into the probability prediction model.

公开(公告)号：US20240413024A1

公开(公告)日：2024-12-12

申请号：US18532473

申请日：2023-12-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sangchul YEO ,  Doyun KIM ,  Jaewon YANG

IPC: H01L21/66 ,  G03F1/36 ,  G06T7/00 ,  G06T7/11

Abstract: Provided is a pattern inspection method including obtaining an image of a substrate on which a pattern is formed, extracting a contour based on the image, detecting positions of a target pattern based on the contour, generating pattern inspection data by performing a curve-fitting on the detected positions of the target pattern, and analyzing the pattern based on the pattern inspection data, wherein the curve-fitting is performed by using at least one of a Sigmoid function, a hyperbolic tangent function, and a Fermi-Dirac function, and wherein the pattern inspection data includes a width in a first direction, a height in a second direction, and a pattern slope of the target pattern.

公开(公告)号：US20240386635A1

公开(公告)日：2024-11-21

申请号：US18528275

申请日：2023-12-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang Chul YEO ,  Yongjin CHUN ,  Min-Cheol KANG ,  Jaewon YANG

IPC: G06T11/60 ,  G06T7/13 ,  G06V10/24 ,  G06V10/50 ,  G06V10/74

Abstract: Disclosed is an operating method of an electronic device which includes a processor and supports manufacture of a semiconductor device. The operating method includes receiving, at the processor, a layout image for the manufacture of the semiconductor device and a captured image generated by capturing the semiconductor device actually manufactured, aligning, at the processor, the layout image and the captured image based on a result of emphasizing edges and corners of the layout image and the captured image, and performing, at the processor, learning based on the aligned layout image and the aligned captured image such that a first modified layout image is generated from the layout image, and the semiconductor device is manufactured based on a second modified layout image generated from the layout image.

公开(公告)号：US20230281792A1

公开(公告)日：2023-09-07

申请号：US18060260

申请日：2022-11-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sooryong LEE ,  Jaewon YANG ,  Kyoung Cho NA ,  Jihong KIM ,  Sang Chul YEO ,  Hyeok LEE

IPC: G06T7/00 ,  G06T11/00 ,  G06T3/40 ,  G06F30/392

CPC classification number: G06T7/001 ,  G06T11/00 ,  G06T3/40 ,  G06F30/392 ,  G06T2207/30148 ,  G06T2207/20081

Abstract: Disclosed is an operating method of an electronic device which includes a processor executing a semiconductor layout simulation module based on machine learning. The operating method includes receiving, at the semiconductor layout simulation module executed by the processor, a layout image, inferring a wafer image based on the layout image and a fabrication device information image of a semiconductor fabrication device fabricating a semiconductor integrated circuit based on a final layout image, adjusting the layout image when the wafer image is not acceptable, and confirming the layout image as the final layout image when the wafer image is acceptable.

公开(公告)号：US20230280646A1

公开(公告)日：2023-09-07

申请号：US17972231

申请日：2022-10-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyungsoo KIM ,  Sooryong LEE ,  Jaewon YANG ,  Sangchul YEO ,  Hyeok LEE

IPC: G03F1/36 ,  G03F1/80 ,  G03F7/20

CPC classification number: G03F1/36 ,  G03F1/80 ,  G03F7/705

Abstract: The inventive concept provides a corner rounding method of a deep learning-based optical proximity correction (OPC) pattern by which patterning reliability may be ensured, and an OPC method and a mask manufacturing including the corner rounding method. The corner rounding method of a deep learning-based OPC pattern includes: obtaining a contour of a photoresist (PR) pattern or an etching pattern on a wafer; obtaining a square layout of the PR pattern or the etching pattern corresponding to the contour; generating a transform model through deep learning with the square layout and the contour; and obtaining a rounded layout target with respect to a square layout target by using the transform model.

公开(公告)号：US20200168271A1

公开(公告)日：2020-05-28

申请号：US16421855

申请日：2019-05-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ihor VASYLTSOV ,  Youngnam HWANG ,  Jinmin KIM ,  Yongha PARK ,  Hyunsik PARK ,  Jaewon YANG

IPC: G11C11/54 ,  G11C11/4096 ,  G11C11/408 ,  G11C11/4091 ,  G06N3/04

Abstract: A semiconductor memory device includes a memory cell array including first memory cells and second memory cell, and a peripheral circuit. When a first command, a first address, and first input data are received, the peripheral circuit reads first data from the first memory cells based on the first address in response to the first command, performs a first operation by using the first data and the first input data, and reads second data from the second memory cells by using a result of the first operation.