公开(公告)号：US20180220972A1

公开(公告)日：2018-08-09

申请号：US15888511

申请日：2018-02-05

申请人： Samsung Electronics Co., Ltd.

发明人： Injo Jeong ,  Younghwan Kim ,  Hyungsup Byeon ,  Seung-Eun Lee ,  Jae-Bong Chun ,  Jungsu Ha ,  Bokun Choi

IPC分类号： A61B5/00 ,  A61B5/0408

CPC分类号： A61B5/7445 ,  A61B5/04085 ,  A61B5/681 ,  A61B5/6898 ,  A61B5/7475 ,  A61B2560/0468 ,  A61B2562/0209 ,  G06F3/0412

摘要： An electronic device that is capable of measuring biometric information is provided. The electronic device includes a housing; a display panel at least partially accommodated in the housing; a first electrode formed over at least a portion of the display panel to be visually transparent and to be exposed to the outside of the electronic device; and a second electrode formed in at least a portion of one face of the housing below the display panel to be exposed to the outside of the electronic device.

公开(公告)号：US11433341B2

公开(公告)日：2022-09-06

申请号：US16666902

申请日：2019-10-29

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Bokun Choi ,  Jeseung Oh ,  Heejun Kang ,  Eungchan Kim ,  Youngmin Jeong ,  Hankyu Choi ,  Jungsu Ha

IPC分类号： B01D46/00 ,  D06F58/22 ,  B01D46/24 ,  B01D46/64

摘要： A filter assembly includes a primary filter; a secondary filter into which the primary filter is detachably inserted; a case detachably coupled to the primary filter and comprising a plurality of air inlet holes; and at least one blade being rotatably coupled to the secondary filter and configured to compresses first foreign substances collected in the primary filter based on the primary filter moving in a first direction in which the primary filter is drawn out from the secondary filter.

公开(公告)号：US20180269126A1

公开(公告)日：2018-09-20

申请号：US15983125

申请日：2018-05-18

申请人： Samsung Electronics Co., Ltd.

发明人： Yunhyeok Im ,  Oleg Feygenson ,  Sang Il Kim ,  Youngbae Kim ,  Jichul Kim ,  Seungkon Mok ,  Jungsu Ha

IPC分类号： H01L23/367 ,  H01L23/373 ,  H01L25/00 ,  H01L23/552 ,  H01L23/00 ,  H01L29/06 ,  H01L21/56 ,  H01L25/10 ,  H01L23/498

CPC分类号： H01L23/367 ,  H01L21/4871 ,  H01L21/563 ,  H01L23/36 ,  H01L23/3736 ,  H01L23/49816 ,  H01L23/552 ,  H01L23/562 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/92 ,  H01L25/105 ,  H01L25/50 ,  H01L29/0657 ,  H01L2224/13025 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/92125 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/10158 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00

摘要： Semiconductor packages and methods of fabricating the same are disclosed. The semiconductor package may include a package substrate, a semiconductor chip, which is mounted on the package substrate to have a bottom surface facing the package substrate and a top surface opposite to the bottom surface, a mold layer provided on the package substrate to encapsulate the semiconductor chip, and a heat dissipation layer provided on the top surface of the semiconductor chip. The mold layer may have a top surface substantially coplanar with the top surface of the semiconductor chip, and the top surfaces of the semiconductor chip and the mold layer may have a difference in surface roughness from each other.