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公开(公告)号：US10728958B2
公开(公告)日：2020-07-28
申请号：US15868451
申请日：2018-01-11
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seyun Kim , Jinhong Kim , Haengdeog Koh , Doyoon Kim , Hajin Kim , Soichiro Mizusaki , Minjong Bae , Changsoo Lee
Abstract: A The heating element structure includes: a conductive metal substrate; a heating layer spaced apart from the conductive metal substrate and configured to generate heat in response to an electrical signal; electrodes in contact with the heating layer and configured to provide the electrical signal to the heating layer; and a first insulating layer on the conductive metal substrate, the first insulating layer comprising a first matrix material and a particle, wherein a difference between a coefficient of thermal expansion (CTE) of the first matrix material and a coefficient of thermal expansion of the particle is about 4×10−6 per Kelvin or less.
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公开(公告)号：US10893578B2
公开(公告)日：2021-01-12
申请号：US16145753
申请日：2018-09-28
Applicant: Samsung Electronics Co., Ltd.
Inventor： Haengdeog Koh , Hajin Kim , Minjong Bae , Doyoon Kim , Seyun Kim , Jinhong Kim , Soichiro Mizusaki , Changsoo Lee
Abstract: A composition for forming a heating element; a dried and sintered product thereof; and a method of preparing the composition for forming a heating element, the composition including a matrix particle, a composite filler, and a solvent, wherein the composite filler includes a core and a coating layer disposed on the core, the core includes a nanosheet filler, and the composition has a pH in a range of about 5 to about 9.
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3.发明申请公开(公告)号：US20180168000A1
公开(公告)日：2018-06-14
申请号：US15836002
申请日：2017-12-08
Applicant: Samsung Electronics Co., Ltd.
Inventor： Hiesang Sohn , Seyun Kim , Haengdeog Koh , Doyoon Kim , Soichiro Mizusaki , Jinhong Kim , Hajin Kim , Minjong Bae , Changsoo Lee
CPC classification number: H05B1/0263 , B29C70/025 , B29C70/88 , C03C4/14 , C03C8/14 , C03C8/16 , C03C14/004 , C03C17/007 , C03C17/008 , C03C2217/452 , C03C2217/48 , H05B3/14 , H05B3/141 , H05B3/146 , H05B3/26 , H05B2203/013
Abstract: A heating element includes a plurality of matrix particles and a conductive inorganic filler disposed at interfaces between the plurality of matrix particles to provide a conductive network.
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公开(公告)号：US10917942B2
公开(公告)日：2021-02-09
申请号：US16045834
申请日：2018-07-26
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jinhong Kim , Seyun Kim , Haengdeog Koh , Doyoon Kim , Hajin Kim , Soichiro Mizusaki , Minjong Bae , Changsoo Lee
Abstract: Provided are a structure, a planar heater including the same, a heating device including the planar heater, and a method of preparing the structure. The structure includes a metal substrate, an insulating layer disposed on the metal substrate, an electrode layer disposed on the insulating layer, and an electrically conductive layer disposed on the electrode layer, wherein a difference in a coefficient of thermal expansion (CTE) between the metal substrate and the insulating layer is 4 parts per million per degree Kelvin change in temperature (ppm/K) or less.
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公开(公告)号：US20180163969A1
公开(公告)日：2018-06-14
申请号：US15633832
申请日：2017-06-27
Applicant: Samsung Electronics Co., Ltd.
Inventor： Changsoo Lee , Doyoon Kim , Hajin Kim , Haengdeog Koh , Seyun Kim , Jinhong Kim , Taehun Kim , Soichiro Mizusaki , Minjong Bae , Hiesang Sohn , Kunwoo Choi
CPC classification number: F24C7/062 , A47J37/0629 , F24C7/046 , F24C7/067 , F24C15/007 , H05B3/08 , H05B3/145 , H05B3/26 , H05B3/62 , H05B2203/002 , H05B2214/02
Abstract: A planar heating apparatus includes a substrate, first electrodes on the substrate, second electrodes alternately arranged with the first electrodes, an electrode connector connecting end portions of the first or second electrodes to each other and a power connector connected to the electrode connector and to which a power supply is connected. The power connector extends outside of the substrate.
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Patent Agency Ranking
6.发明申请公开(公告)号：US20180099487A1
公开(公告)日：2018-04-12
申请号：US15723339
申请日：2017-10-03
Applicant: Samsung Electronics Co., Ltd.
Inventor： Haengdeog Koh , Doyoon Kim , Seyun Kim , Jinhong Kim , Hajin Kim , Soichiro MIZUSAKI , Minjong Bae , Hiesang Sohn , Changsoo Lee
CPC classification number: B32B17/10174 , B32B17/10944 , B82Y30/00 , C01G55/004 , C01P2002/02 , C01P2004/03 , C01P2004/50 , C01P2004/51 , C01P2004/62 , C01P2004/64 , C03C3/093 , C03C8/02 , C03C14/002 , C03C14/006 , C03C17/008 , C03C2214/02 , C03C2214/16 , C03C2217/452 , C03C2217/48
Abstract: A composite material structure including a matrix material layer; and a plurality of one-dimensional nanostructure distributed in the matrix material layer and having an electrical conductivity which is greater than an electrical conductivity of the matrix material layer, wherein the plurality of one-dimensional nanostructures includes a first one-dimensional nanostructure and a second one-dimensional nanostructure in contact with each other.
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公开(公告)号：US12041697B2
公开(公告)日：2024-07-16
申请号：US16919792
申请日：2020-07-02
Applicant: Samsung Electronics Co., Ltd.
Inventor： Hiesang Sohn , Seyun Kim , Haengdeog Koh , Doyoon Kim , Soichiro Mizusaki , Jinhong Kim , Hajin Kim , Minjong Bae , Changsoo Lee
IPC: H05B1/02 , B29C70/02 , B29C70/88 , C03C4/14 , C03C8/04 , C03C8/14 , C03C8/16 , C03C14/00 , C03C17/00 , H05B3/14 , H05B3/26
CPC classification number: H05B1/0263 , B29C70/025 , B29C70/88 , C03C4/14 , C03C8/04 , C03C8/14 , C03C8/16 , C03C14/004 , C03C17/007 , C03C17/008 , H05B3/14 , H05B3/141 , H05B3/146 , H05B3/26 , C03C2217/452 , C03C2217/48 , H05B2203/013
Abstract: A heating element includes a plurality of matrix particles and a conductive inorganic filler disposed at interfaces between the plurality of matrix particles to provide a conductive network.
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公开(公告)号：US11162687B2
公开(公告)日：2021-11-02
申请号：US15633832
申请日：2017-06-27
Applicant: Samsung Electronics Co., Ltd.
Inventor： Changsoo Lee , Doyoon Kim , Hajin Kim , Haengdeog Koh , Seyun Kim , Jinhong Kim , Taehun Kim , Soichiro Mizusaki , Minjong Bae , Hiesang Sohn , Kunwoo Choi
Abstract: A planar heating apparatus includes a substrate, first electrodes on the substrate, second electrodes alternately arranged with the first electrodes, an electrode connector connecting end portions of the first or second electrodes to each other and a power connector connected to the electrode connector and to which a power supply is connected. The power connector extends outside of the substrate.
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9.发明申请公开(公告)号：US20180136181A1
公开(公告)日：2018-05-17
申请号：US15810229
申请日：2017-11-13
Applicant: Samsung Electronics Co., Ltd.
Inventor： Minjong Bae , Jinhong Kim , Hajin Kim , Haengdeog Koh , Doyoon Kim , Seyun Kim , Soichiro MIZUSAKI , Hiesang Sohn , Changsoo Lee
CPC classification number: G01N33/0027 , G08B17/103 , H01B1/14 , H01B3/004 , H01B3/087 , H01B5/14
Abstract: A composite filler structure includes a substrate, a filler layer spaced apart from the substrate and comprising a matrix material layer and a plurality of conductive filler particles, an electrode in contact with the filler layer and configured to provide an electrical signal to the filler layer, and an insulating layer between the substrate and the electrode, and including an alkali oxide in an amount of about 7 weight percent or less, based on a total weight of the composite filler structure.
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公开(公告)号：US10779362B2
公开(公告)日：2020-09-15
申请号：US15836002
申请日：2017-12-08
Applicant: Samsung Electronics Co., Ltd.
Inventor： Hiesang Sohn , Seyun Kim , Haengdeog Koh , Doyoon Kim , Soichiro Mizusaki , Jinhong Kim , Hajin Kim , Minjong Bae , Changsoo Lee
IPC: H05B1/02 , H05B3/14 , B29C70/88 , C03C14/00 , B29C70/02 , C03C4/14 , C03C17/00 , C03C8/16 , C03C8/14 , H05B3/26
Abstract: A heating element includes a plurality of matrix particles and a conductive inorganic filler disposed at interfaces between the plurality of matrix particles to provide a conductive network.
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