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公开(公告)号：US10020091B2
公开(公告)日：2018-07-10
申请号：US15190909
申请日：2016-06-23
Applicant: SAMSUNG ELECTRONICS CO., LTD. , The Industry & Academic Cooperation in Chungnam National University
Inventor： Sang Eui Lee , Yeonggyu Jeong , Kyoung-Seok Moon , Hiesang Sohn , Taewon Lee , In Taek Han
CPC classification number: H01B1/24 , B82Y30/00 , C08J5/005 , C08J2301/02 , D21H11/18 , D21H13/50 , D21H21/52 , H01B1/22 , Y10S977/752 , Y10S977/762 , Y10S977/783 , Y10S977/932
Abstract: A conductive composite including: a polymer matrix including a microcellulose fiber; and at least two conductive nanomaterials dispersed in the polymer matrix, wherein the conductive nanomaterial includes a metal nanowire, wherein the at least two of the conductive nanomaterials provide an assembled layer surrounding a surface of the microcellulose fiber.
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2.发明申请公开(公告)号：US20180168000A1
公开(公告)日：2018-06-14
申请号：US15836002
申请日：2017-12-08
Applicant: Samsung Electronics Co., Ltd.
Inventor： Hiesang Sohn , Seyun Kim , Haengdeog Koh , Doyoon Kim , Soichiro Mizusaki , Jinhong Kim , Hajin Kim , Minjong Bae , Changsoo Lee
CPC classification number: H05B1/0263 , B29C70/025 , B29C70/88 , C03C4/14 , C03C8/14 , C03C8/16 , C03C14/004 , C03C17/007 , C03C17/008 , C03C2217/452 , C03C2217/48 , H05B3/14 , H05B3/141 , H05B3/146 , H05B3/26 , H05B2203/013
Abstract: A heating element includes a plurality of matrix particles and a conductive inorganic filler disposed at interfaces between the plurality of matrix particles to provide a conductive network.
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公开(公告)号：US09900979B2
公开(公告)日：2018-02-20
申请号：US15240132
申请日：2016-08-18
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hiesang Sohn , Chan Kwak , Mi Jeong Kim , Hyeon Cheol Park , Weonho Shin , Youngjin Cho
CPC classification number: H05K1/09 , C01B31/0484 , C01B32/184 , H05K1/0306 , H05K1/0313 , H05K3/146 , H05K3/22 , H05K2201/0145 , H05K2201/0154 , H05K2201/0158 , H05K2201/0323 , H05K2201/0338 , H05K2203/0783 , Y02E10/50
Abstract: A conductor includes a substrate, a first conductive layer disposed on the substrate and including two or more islands including graphene, and a second conductive layer disposed on the first conductive layer and including a conductive metal nanowire, wherein at least one of an upper surface and a lower surface of the islands including graphene includes a P-type dopant.
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公开(公告)号：US09892821B2
公开(公告)日：2018-02-13
申请号：US15397259
申请日：2017-01-03
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hiesang Sohn , Weonho Shin , Yun Sung Woo
CPC classification number: H01B5/14 , C01B32/186 , C01B32/194 , C01B2204/22 , C03C17/3644 , C03C17/3649 , C03C17/3671 , G06F3/0412 , H01B1/02 , H01B1/04 , H01L31/1884 , H05B33/28 , Y02E10/50
Abstract: An electrical conductor including a substrate, a first conductive layer including graphene, and a second conductive layer including a conductive metal nanowire, wherein the first conductive layer and the second conductive layer are disposed on the substrate, wherein the first conductive layer is disposed between the substrate and the second conductive layer or on the second conductive layer, wherein the first conductive layer has a first surface facing the second conductive layer and a second surface which is opposite to the first surface, and wherein, in the first surface and the second surface, the graphene is p-doped with a p-type dopant.
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公开(公告)号：US20180163969A1
公开(公告)日：2018-06-14
申请号：US15633832
申请日：2017-06-27
Applicant: Samsung Electronics Co., Ltd.
Inventor： Changsoo Lee , Doyoon Kim , Hajin Kim , Haengdeog Koh , Seyun Kim , Jinhong Kim , Taehun Kim , Soichiro Mizusaki , Minjong Bae , Hiesang Sohn , Kunwoo Choi
CPC classification number: F24C7/062 , A47J37/0629 , F24C7/046 , F24C7/067 , F24C15/007 , H05B3/08 , H05B3/145 , H05B3/26 , H05B3/62 , H05B2203/002 , H05B2214/02
Abstract: A planar heating apparatus includes a substrate, first electrodes on the substrate, second electrodes alternately arranged with the first electrodes, an electrode connector connecting end portions of the first or second electrodes to each other and a power connector connected to the electrode connector and to which a power supply is connected. The power connector extends outside of the substrate.
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Patent Agency Ranking
6.发明申请公开(公告)号：US20180099487A1
公开(公告)日：2018-04-12
申请号：US15723339
申请日：2017-10-03
Applicant: Samsung Electronics Co., Ltd.
Inventor： Haengdeog Koh , Doyoon Kim , Seyun Kim , Jinhong Kim , Hajin Kim , Soichiro MIZUSAKI , Minjong Bae , Hiesang Sohn , Changsoo Lee
CPC classification number: B32B17/10174 , B32B17/10944 , B82Y30/00 , C01G55/004 , C01P2002/02 , C01P2004/03 , C01P2004/50 , C01P2004/51 , C01P2004/62 , C01P2004/64 , C03C3/093 , C03C8/02 , C03C14/002 , C03C14/006 , C03C17/008 , C03C2214/02 , C03C2214/16 , C03C2217/452 , C03C2217/48
Abstract: A composite material structure including a matrix material layer; and a plurality of one-dimensional nanostructure distributed in the matrix material layer and having an electrical conductivity which is greater than an electrical conductivity of the matrix material layer, wherein the plurality of one-dimensional nanostructures includes a first one-dimensional nanostructure and a second one-dimensional nanostructure in contact with each other.
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公开(公告)号：US12041697B2
公开(公告)日：2024-07-16
申请号：US16919792
申请日：2020-07-02
Applicant: Samsung Electronics Co., Ltd.
Inventor： Hiesang Sohn , Seyun Kim , Haengdeog Koh , Doyoon Kim , Soichiro Mizusaki , Jinhong Kim , Hajin Kim , Minjong Bae , Changsoo Lee
IPC: H05B1/02 , B29C70/02 , B29C70/88 , C03C4/14 , C03C8/04 , C03C8/14 , C03C8/16 , C03C14/00 , C03C17/00 , H05B3/14 , H05B3/26
CPC classification number: H05B1/0263 , B29C70/025 , B29C70/88 , C03C4/14 , C03C8/04 , C03C8/14 , C03C8/16 , C03C14/004 , C03C17/007 , C03C17/008 , H05B3/14 , H05B3/141 , H05B3/146 , H05B3/26 , C03C2217/452 , C03C2217/48 , H05B2203/013
Abstract: A heating element includes a plurality of matrix particles and a conductive inorganic filler disposed at interfaces between the plurality of matrix particles to provide a conductive network.
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公开(公告)号：US11162687B2
公开(公告)日：2021-11-02
申请号：US15633832
申请日：2017-06-27
Applicant: Samsung Electronics Co., Ltd.
Inventor： Changsoo Lee , Doyoon Kim , Hajin Kim , Haengdeog Koh , Seyun Kim , Jinhong Kim , Taehun Kim , Soichiro Mizusaki , Minjong Bae , Hiesang Sohn , Kunwoo Choi
Abstract: A planar heating apparatus includes a substrate, first electrodes on the substrate, second electrodes alternately arranged with the first electrodes, an electrode connector connecting end portions of the first or second electrodes to each other and a power connector connected to the electrode connector and to which a power supply is connected. The power connector extends outside of the substrate.
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9.发明申请公开(公告)号：US20180136181A1
公开(公告)日：2018-05-17
申请号：US15810229
申请日：2017-11-13
Applicant: Samsung Electronics Co., Ltd.
Inventor： Minjong Bae , Jinhong Kim , Hajin Kim , Haengdeog Koh , Doyoon Kim , Seyun Kim , Soichiro MIZUSAKI , Hiesang Sohn , Changsoo Lee
CPC classification number: G01N33/0027 , G08B17/103 , H01B1/14 , H01B3/004 , H01B3/087 , H01B5/14
Abstract: A composite filler structure includes a substrate, a filler layer spaced apart from the substrate and comprising a matrix material layer and a plurality of conductive filler particles, an electrode in contact with the filler layer and configured to provide an electrical signal to the filler layer, and an insulating layer between the substrate and the electrode, and including an alkali oxide in an amount of about 7 weight percent or less, based on a total weight of the composite filler structure.
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公开(公告)号：US10779362B2
公开(公告)日：2020-09-15
申请号：US15836002
申请日：2017-12-08
Applicant: Samsung Electronics Co., Ltd.
Inventor： Hiesang Sohn , Seyun Kim , Haengdeog Koh , Doyoon Kim , Soichiro Mizusaki , Jinhong Kim , Hajin Kim , Minjong Bae , Changsoo Lee
IPC: H05B1/02 , H05B3/14 , B29C70/88 , C03C14/00 , B29C70/02 , C03C4/14 , C03C17/00 , C03C8/16 , C03C8/14 , H05B3/26
Abstract: A heating element includes a plurality of matrix particles and a conductive inorganic filler disposed at interfaces between the plurality of matrix particles to provide a conductive network.
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