-
Patent Agency Ranking
公开(公告)号：US11289438B2
公开(公告)日：2022-03-29
申请号：US16985445
申请日：2020-08-05
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jiseok Hong , Unbyoung Kang , Myungsung Kang , Taehun Kim , Sangcheon Park , Hyuekjae Lee , Jihwan Hwang
Abstract: According to an aspect of the inventive concept, there is provided a die-to-wafer bonding structure including a die having a first test pad, a first bonding pad formed on the first test pad, and a first insulating layer, the first bonding pad penetrates the first insulating layer. The structure may further include a wafer having a second test pad, a second bonding pad formed on the second test pad, and a second insulating layer, the second bonding pad penetrates the second insulating layer. The structure may further include a polymer layer surrounding all side surfaces of the first bonding pad and all side surfaces of the second bonding pad, the polymer layer being arranged between the die and the wafer. Additionally, the wafer and the die may be bonded together.
-
公开(公告)号：US20230395403A1
公开(公告)日：2023-12-07
申请号：US18134718
申请日：2023-04-14
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jinwoo Park , Myungsung Kang , Jaekyung Yoo , Unbyoung Kang , Chungsun Lee
IPC: H01L21/67
CPC classification number: H01L21/67126
Abstract: A molding apparatus for a semiconductor package includes a chamber including a lower mold configured to hold a substrate including a plurality of molding targets, an upper mold configured to move up and down with respect to the lower mold and define a cavity between the upper mold and the lower mold, and a port configured to provide a passage communicating with the cavity, a molding material supplier configured to supply a molding material to the port, a plunger configured to pressurize the molding material inside the port, a plunger actuator configured to apply a first pressure to the plunger such that the molding material provided in the port is supplied to the cavity, and a mold actuator configured to control actuation of the upper mold. The plunger actuator is configured to supply the molding material to the cavity by applying the first pressure to the plunger, and the mold actuator is configured to pressurize the molding material in the cavity by applying a second pressure to the upper mold. The mold apparatus further includes a controller configured to control the plunger actuator to reduce the first pressure applied to the plunger after the mold actuator begins applying the second pressure to the upper mold.
-
公开(公告)号：US11658141B2
公开(公告)日：2023-05-23
申请号：US17680477
申请日：2022-02-25
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jiseok Hong , Unbyoung Kang , Myungsung Kang , Taehun Kim , Sangcheon Park , Hyuekjae Lee , Jihwan Hwang
CPC classification number: H01L24/08 , H01L22/22 , H01L24/05 , H01L24/06 , H01L24/29 , H01L24/32 , H01L24/92 , H01L25/0657 , H01L25/50 , H01L23/481 , H01L2224/05124 , H01L2224/05564 , H01L2224/05647 , H01L2224/06051 , H01L2224/08145 , H01L2224/2919 , H01L2224/29028 , H01L2224/32145 , H01L2224/9211
Abstract: According to an aspect of the inventive concept, there is provided a die-to-wafer bonding structure including a die having a first test pad, a first bonding pad formed on the first test pad, and a first insulating layer, the first bonding pad penetrates the first insulating layer. The structure may further include a wafer having a second test pad, a second bonding pad formed on the second test pad, and a second insulating layer, the second bonding pad penetrates the second insulating layer. The structure may further include a polymer layer surrounding all side surfaces of the first bonding pad and all side surfaces of the second bonding pad, the polymer layer being arranged between the die and the wafer. Additionally, the wafer and the die may be bonded together.
-
公开(公告)号：US20220181285A1
公开(公告)日：2022-06-09
申请号：US17680477
申请日：2022-02-25
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jiseok Hong , Unbyoung Kang , Myungsung Kang , Taehun Kim , Sangcheon Park , Hyuekjae Lee , Jihwan Hwang
IPC: H01L23/00 , H01L21/66 , H01L25/065 , H01L25/00
Abstract: According to an aspect of the inventive concept, there is provided a die-to-wafer bonding structure including a die having a first test pad, a first bonding pad formed on the first test pad, and a first insulating layer, the first bonding pad penetrates the first insulating layer. The structure may further include a wafer having a second test pad, a second bonding pad formed on the second test pad, and a second insulating layer, the second bonding pad penetrates the second insulating layer. The structure may further include a polymer layer surrounding all side surfaces of the first bonding pad and all side surfaces of the second bonding pad, the polymer layer being arranged between the die and the wafer. Additionally, the wafer and the die may be bonded together.
-
公开(公告)号：US20210104482A1
公开(公告)日：2021-04-08
申请号：US16985445
申请日：2020-08-05
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jiseok Hong , Unbyoung Kang , Myungsung Kang , Taehun Kim , Sangcheon Park , Hyuekjae Lee , Jihwan Hwang
IPC: H01L23/00 , H01L21/66 , H01L25/00 , H01L25/065
Abstract: According to an aspect of the inventive concept, there is provided a die-to-wafer bonding structure including a die having a first test pad, a first bonding pad formed on the first test pad, and a first insulating layer, the first bonding pad penetrates the first insulating layer. The structure may further include a wafer having a second test pad, a second bonding pad formed on the second test pad, and a second insulating layer, the second bonding pad penetrates the second insulating layer. The structure may further include a polymer layer surrounding all side surfaces of the first bonding pad and all side surfaces of the second bonding pad, the polymer layer being arranged between the die and the wafer. Additionally, the wafer and the die may be bonded together.
-
-
-
-
Search Results
5
records
(took 0.02 seconds)
