SEMICONDUCTOR DEVICE INCLUDING SOURCE/DRAIN REGION

    公开(公告)号:US20220102497A1

    公开(公告)日:2022-03-31

    申请号:US17546326

    申请日:2021-12-09

    Abstract: A semiconductor device including an active region defined in a substrate; at least one channel layer on the active region; a gate electrode intersecting the active region and on the active region and surrounding the at least one channel layer; and a pair of source/drain regions adjacent to both sides of the gate electrode, on the active region, and in contact with the at least one channel layer, wherein the pair of source/drain regions includes a selective epitaxial growth (SEG) layer, and a maximum width of each of the pair of source/drain regions in a first direction is 1.3 times or less a width of the active region in the first direction.

    SEMICONDUCTOR DEVICE INCLUDING SOURCE/DRAIN REGION

    公开(公告)号:US20200152740A1

    公开(公告)日:2020-05-14

    申请号:US16386459

    申请日:2019-04-17

    Abstract: A semiconductor device including an active region defined in a substrate; at least one channel layer on the active region; a gate electrode intersecting the active region and on the active region and surrounding the at least one channel layer; and a pair of source/drain regions adjacent to both sides of the gate electrode, on the active region, and in contact with the at least one channel layer, wherein the pair of source/drain regions includes a selective epitaxial growth (SEG) layer, and a maximum width of each of the pair of source/drain regions in a first direction is 1.3 times or less a width of the active region in the first direction.

    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES

    公开(公告)号:US20250022959A1

    公开(公告)日:2025-01-16

    申请号:US18901222

    申请日:2024-09-30

    Abstract: A semiconductor device includes an active region extending in a first direction on a substrate, channel layers on the active region and spaced apart vertically, a gate structure intersecting the active region and the channel layers, the gate structure extending in a second direction and surrounding the channel layers, and a source/drain region on the active region at a side of the gate structure, the source/drain region contacting the channel layers, the source/drain region including first epitaxial layers having a first composition and including first layers on side surfaces of the channel layers and a second layer on the active region at a lower end of the source/drain region, and a second epitaxial layer having a second composition different from the first composition, the second epitaxial layer being between the first epitaxial layers in the first direction and being between the first epitaxial layers vertically in a third direction.

    SEMICONDUCTOR DEVICE WITH DEEP SILICIDE FILM

    公开(公告)号:US20230395668A1

    公开(公告)日:2023-12-07

    申请号:US18296329

    申请日:2023-04-05

    Abstract: A semiconductor device includes a substrate; an active pattern disposed on the substrate and extending in a first direction; a plurality of gate structures, wherein the plurality of gate structures is disposed on the active pattern and arranged in the first direction, wherein each of the plurality of gate structures includes a gate electrode and a gate insulating film, and wherein the gate electrode extends in a second direction; a source/drain pattern disposed between adjacent gate structures of the plurality of gate structures; a source/drain contact connected to the source/drain pattern; and a contact silicide film disposed between the source/drain pattern and the source/drain contact, wherein the contact silicide film includes a bowl region that wraps a lower portion of the source/drain contact, and a protruding region that protrudes from the bowl region of the contact silicide film.

    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES

    公开(公告)号:US20230307545A1

    公开(公告)日:2023-09-28

    申请号:US18204469

    申请日:2023-06-01

    CPC classification number: H01L29/7851 H01L29/0847 H01L29/78696 H01L29/42392

    Abstract: A semiconductor device includes an active region extending in a first direction on a substrate, channel layers on the active region and spaced apart vertically, a gate structure intersecting the active region and the channel layers, the gate structure extending in a second direction and surrounding the channel layers, and a source/drain region on the active region at a side of the gate structure, the source/drain region contacting the channel layers, the source/drain region including first epitaxial layers having a first composition and including first layers on side surfaces of the channel layers and a second layer on the active region at a lower end of the source/drain region, and a second epitaxial layer having a second composition different from the first composition, the second epitaxial layer being between the first epitaxial layers in the first direction and being between the first epitaxial layers vertically in a third direction.

    SEMICONDUCTOR DEVICE INCLUDING FIN FIELD EFFECT TRANSISTOR AND METHOD OF MANUFACTURING THE SAME

    公开(公告)号:US20190296144A1

    公开(公告)日:2019-09-26

    申请号:US16162510

    申请日:2018-10-17

    Abstract: A semiconductor device and a method of manufacturing a semiconductor device, the device including an active pattern protruding from a substrate; a plurality of gate structures each including a gate electrode and crossing the active pattern; and a source/drain region between the plurality of gate structures, wherein the source/drain region includes a high concentration doped layer in contact with a bottom surface of a recessed region in the active pattern, a first epitaxial layer in contact with an upper surface of the high concentration doped layer and a sidewall of the recessed region, and a second epitaxial layer on the first epitaxial layer, and the high concentration doped layer has a first area in contact with the bottom surface of the recessed region and a second area in contact with the sidewall of the recessed region, the first area being wider than the second area.

    SEMICONDUCTOR DEVICES
    9.
    发明申请

    公开(公告)号:US20220157990A1

    公开(公告)日:2022-05-19

    申请号:US17587402

    申请日:2022-01-28

    Abstract: A semiconductor device including an active region extending in a first direction on a substrate; a gate structure intersecting the active region and extending in a second direction on the substrate; and a source/drain region on the active region and at least one side of the gate structure, wherein the source/drain region includes a plurality of first epitaxial layers spaced apart from each other in the first direction, the plurality of first epitaxial layers including first impurities of a first conductivity type; and a second epitaxial layer filling a space between the plurality of first epitaxial layers, the second epitaxial layer including second impurities of the first conductivity type.

    SEMICONDUCTOR DEVICES
    10.
    发明申请

    公开(公告)号:US20210296499A1

    公开(公告)日:2021-09-23

    申请号:US17337759

    申请日:2021-06-03

    Abstract: A semiconductor device includes an active region extending in a first direction on a substrate, channel layers on the active region and spaced apart vertically, a gate structure intersecting the active region and the channel layers, the gate structure extending in a second direction and surrounding the channel layers, and a source/drain region on the active region at a side of the gate structure, the source/drain region contacting the channel layers, the source/drain region including first epitaxial layers having a first composition and including first layers on side surfaces of the channel layers and a second layer on the active region at a lower end of the source/drain region, and a second epitaxial layer having a second composition different from the first composition, the second epitaxial layer being between the first epitaxial layers in the first direction and being between the first epitaxial layers vertically in a third direction.

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