公开(公告)号：US20080196931A1

公开(公告)日：2008-08-21

申请号：US12010194

申请日：2008-01-22

申请人： Sang-Chul Lee ,  Won-Cheol Bae ,  Kwan-Kyu Kim ,  Doo-Hwan Lee

发明人： Sang-Chul Lee ,  Won-Cheol Bae ,  Kwan-Kyu Kim ,  Doo-Hwan Lee

IPC分类号： H05K1/02 ,  H05K3/36

CPC分类号： H05K1/185 ,  H01L21/568 ,  H01L23/49822 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/82 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/32145 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/18162 ,  H01L2924/351 ,  H05K3/4602 ,  H05K3/4688 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2203/061 ,  Y10T29/49126 ,  H01L2224/82 ,  H01L2924/00

摘要： A printed circuit board having embedded components and a method for the manufacturing of the printed circuit board are disclosed. The printed circuit board includes: an intermediary insulation layer; a first core board, in which a first component having at least one electrode formed on one side is embedded, stacked on one side of the intermediary insulation layer; a first insulation layer stacked on the first core board such that the first component is covered; a second core board, in which a second component having at least one electrode formed on one side is embedded, stacked on the other side of the intermediary insulation layer; a second insulation layer stacked on the second core board such that the second component is covered; and a first via, which penetrates the first core board and the second core board. The use of this printed circuit board allows highly integrated designs.

摘要翻译： 公开了一种具有嵌入部件的印刷电路板和印刷电路板的制造方法。 印刷电路板包括：中间绝缘层; 第一芯板，其中嵌入有在一侧形成的至少一个电极的第一部件，堆叠在中间绝缘层的一侧上; 第一绝缘层，堆叠在所述第一芯板上，使得所述第一部件被覆盖; 第二芯板，其中嵌入有形成在一侧上的至少一个电极的第二部件，堆叠在中间绝缘层的另一侧上; 第二绝缘层，堆叠在所述第二芯板上，使得所述第二部件被覆盖; 以及穿过第一芯板和第二芯板的第一通孔。 该印刷电路板的使用允许高度集成的设计。

公开(公告)号：US07886433B2

公开(公告)日：2011-02-15

申请号：US12007795

申请日：2008-01-15

申请人： Won-Cheol Bae ,  Je-Gwang Yoo ,  Sang-Chul Lee ,  Doo-Hwan Lee

发明人： Won-Cheol Bae ,  Je-Gwang Yoo ,  Sang-Chul Lee ,  Doo-Hwan Lee

IPC分类号： H05K3/02 ,  H05K3/10

CPC分类号： H05K1/185 ,  B32B3/06 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/82 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H05K2201/09509 ,  H05K2203/308 ,  Y10T29/49126 ,  Y10T29/49139 ,  Y10T29/49155 ,  Y10T156/1056 ,  Y10T428/22 ,  H01L2224/82

摘要： A component-embedded PCB and a method of manufacturing the PCB are disclosed. Using a method that includes perforating a cavity in a core substrate; inserting a component in the cavity; stacking a film layer over the core substrate; forming at least one post by selectively leaving behind the film layer in correspondence to a position of at least one electrode of the component; covering an insulation layer over the core substrate such that the post penetrates the insulation layer to be exposed at a surface of the insulation layer; and forming at least one via hole by removing the post, can provide increased precision and finer pitch. Also, since laser is not used when processing the vias, damage to the component that may occur due to the laser is prevented. Furthermore, tolerance defects may be decreased, as well as defects caused by residue left after processing.

摘要翻译： 公开了一种组件嵌入式PCB及其制造方法。 使用包括在芯基板中穿孔的方法; 将部件插入腔中; 在芯基板上堆叠薄膜层; 通过选择性地将所述膜层留在所述元件的至少一个电极的位置上而形成至少一个柱; 覆盖所述芯基板上的绝缘层，使得所述柱穿透所述绝缘层以在所述绝缘层的表面上暴露; 并且通过去除柱形成至少一个通孔，可以提供更高的精度和更细的间距。 此外，由于在加工通孔时不使用激光，因此防止了由于激光而可能发生的部件的损坏。 此外，可能会降低公差缺陷，以及加工后残留物造成的缺陷。

公开(公告)号：US20080171172A1

公开(公告)日：2008-07-17

申请号：US12007795

申请日：2008-01-15

申请人： Won-Cheol Bae ,  Je-Gwang Yoo ,  Sang-Chul Lee ,  Doo-Hwan Lee

发明人： Won-Cheol Bae ,  Je-Gwang Yoo ,  Sang-Chul Lee ,  Doo-Hwan Lee

IPC分类号： H05K1/11 ,  B32B3/06

CPC分类号： H05K1/185 ,  B32B3/06 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/82 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H05K2201/09509 ,  H05K2203/308 ,  Y10T29/49126 ,  Y10T29/49139 ,  Y10T29/49155 ,  Y10T156/1056 ,  Y10T428/22 ,  H01L2224/82

摘要： A component-embedded PCB and a method of manufacturing the PCB are disclosed. Using a method that includes perforating a cavity in a core substrate; inserting a component in the cavity; stacking a film layer over the core substrate; forming at least one post by selectively leaving behind the film layer in correspondence to a position of at least one electrode of the component; covering an insulation layer over the core substrate such that the post penetrates the insulation layer to be exposed at a surface of the insulation layer; and forming at least one via hole by removing the post, can provide increased precision and finer pitch. Also, since laser is not used when processing the vias, damage to the component that may occur due to the laser is prevented. Furthermore, tolerance defects may be decreased, as well as defects caused by residue left after processing.

摘要翻译： 公开了一种组件嵌入式PCB及其制造方法。 使用包括在芯基板中穿孔的方法; 将部件插入腔中; 在芯基板上堆叠薄膜层; 通过选择性地将所述膜层留在所述元件的至少一个电极的位置上而形成至少一个柱; 覆盖所述芯基板上的绝缘层，使得所述柱穿透所述绝缘层以在所述绝缘层的表面上暴露; 并且通过去除柱形成至少一个通孔，可以提供更高的精度和更细的间距。 此外，由于在加工通孔时不使用激光，因此防止了由于激光而可能发生的部件的损坏。 此外，可能会降低公差缺陷，以及加工后残留物造成的缺陷。

公开(公告)号：US20110123808A1

公开(公告)日：2011-05-26

申请号：US12774432

申请日：2010-05-05

申请人： Sang-Chul Lee ,  Yul-Kyo Chung ,  Doo-hwan Lee ,  Sang-Jin Baek

发明人： Sang-Chul Lee ,  Yul-Kyo Chung ,  Doo-hwan Lee ,  Sang-Jin Baek

IPC分类号： B32B9/04 ,  B29C65/52 ,  B32B27/00

CPC分类号： H05K1/185 ,  H01L21/568 ,  H05K3/4602 ,  H05K2201/0195 ,  Y10T156/10 ,  Y10T428/31504

摘要： An insulator and a manufacturing method of an electronic component embedded printed circuit board using the insulator are disclosed. The method includes providing a core board having a circuit pattern formed on a surface thereof, in which the core board is penetrated by a cavity, adhering an adhesive layer covering the cavity to a lower surface of the core board, disposing an electronic component on an upper surface of the adhesive layer, in which the upper surface corresponds to the cavity, and stacking an insulator on an upper surface of the core board so as to fill the cavity, in which the insulator has an upper resin layer and a lower resin layer formed on an upper surface and a lower surface of a reinforcing material, respectively. The insulator has an asymmetric structure in which the lower resin layer is thicker than the upper resin layer.

摘要翻译： 公开了一种使用绝缘体的电子部件嵌入式印刷电路板的绝缘体和制造方法。 该方法包括提供具有形成在其表面上的电路图案的芯板，其中芯板被腔体穿透，将覆盖空腔的粘合剂层粘附到芯板的下表面，将电子部件放置在 粘合剂层的上表面，其上表面对应于空腔，并且在芯板的上表面上堆叠绝缘体以填充空腔，绝缘体具有上树脂层和下树脂层 分别形成在增强材料的上表面和下表面上。 绝缘体具有不对称结构，其中下树脂层比上树脂层厚。

公开(公告)号：US20110216513A1

公开(公告)日：2011-09-08

申请号：US12877684

申请日：2010-09-08

申请人： Doo-Hwan LEE ,  Sang-Jin Baek ,  Jin-Soo Jeong ,  Sang-Chul Lee ,  Jong-Yun Lee ,  Jae-Kul Lee

发明人： Doo-Hwan LEE ,  Sang-Jin Baek ,  Jin-Soo Jeong ,  Sang-Chul Lee ,  Jong-Yun Lee ,  Jae-Kul Lee

IPC分类号： H05K1/18 ,  H05K3/30

CPC分类号： H05K1/185 ,  H01L21/568 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2924/19105 ,  H01L2924/3511 ,  H05K3/4602 ,  H05K3/465 ,  H05K3/4697 ,  Y10T29/4913 ,  Y10T29/49139

摘要： An electro device embedded printed circuit board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, a printed circuit board embedded with an electro device, in which a pair of electrodes are formed on either end, includes: a core substrate in which a first cavity is formed; a first passive device embedded in the first cavity and being thinner than the core substrate; and a second passive device stacked on an upper side of the first passive device such that the second passive device is embedded in the first cavity. The first passive device and the second passive device are stacked to cross each other.

摘要翻译： 公开了电子装置嵌入式印刷电路板及其制造方法。 根据本发明的实施例，嵌入电气装置的印刷电路板，其中一端形成一对电极，包括：形成有第一空腔的芯基板; 第一无源器件，其嵌入在所述第一腔中并且比所述芯基板更薄; 以及堆叠在所述第一无源器件的上侧上的第二无源器件，使得所述第二无源器件嵌入在所述第一腔中。 第一无源器件和第二无源器件被堆叠以彼此交叉。

公开(公告)号：US08284562B2

公开(公告)日：2012-10-09

申请号：US12877684

申请日：2010-09-08

申请人： Doo-Hwan Lee ,  Sang-Jin Baek ,  Jin-Soo Jeong ,  Sang-Chul Lee ,  Jong-Yun Lee ,  Jae-Kul Lee

发明人： Doo-Hwan Lee ,  Sang-Jin Baek ,  Jin-Soo Jeong ,  Sang-Chul Lee ,  Jong-Yun Lee ,  Jae-Kul Lee

IPC分类号： H05K1/18

CPC分类号： H05K1/185 ,  H01L21/568 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2924/19105 ,  H01L2924/3511 ,  H05K3/4602 ,  H05K3/465 ,  H05K3/4697 ,  Y10T29/4913 ,  Y10T29/49139

摘要： An electro device embedded printed circuit board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, a printed circuit board embedded with an electro device, in which a pair of electrodes are formed on either end, includes: a core substrate in which a first cavity is formed; a first passive device embedded in the first cavity and being thinner than the core substrate; and a second passive device stacked on an upper side of the first passive device such that the second passive device is embedded in the first cavity. The first passive device and the second passive device are stacked to cross each other.

摘要翻译： 公开了电子装置嵌入式印刷电路板及其制造方法。 根据本发明的实施例，嵌入电气装置的印刷电路板，其中一端形成一对电极，包括：形成有第一空腔的芯基板; 第一无源器件，其嵌入在所述第一腔中并且比所述芯基板更薄; 以及堆叠在所述第一无源器件的上侧上的第二无源器件，使得所述第二无源器件嵌入在所述第一腔中。 第一无源器件和第二无源器件被堆叠以彼此交叉。

公开(公告)号：US20130263383A1

公开(公告)日：2013-10-10

申请号：US13597684

申请日：2012-08-29

申请人： Gun Kang ,  Mi Jung Yun ,  Won-Ju Kim ,  Sang-Chul Lee ,  Eun-Chul Shin

发明人： Gun Kang ,  Mi Jung Yun ,  Won-Ju Kim ,  Sang-Chul Lee ,  Eun-Chul Shin

IPC分类号： C14C11/00

CPC分类号： C14C3/28 ,  C14C9/02

摘要： Disclosed is a method of fabricating an automotive seat cover leather. The method includes a preparing process, a tanning process, a neutralizing process, a retanning process, an elastic material adding process, a dyeing/fatliquoring process, and a surface fixing process. After the leather has gone through the tanning process and neutralizing process, the retanning process adds a tanning agent to the leather. The elastic material adding process adds a silicon-based elastic material to induce elasticity in the retanned leather. The dyeing/fatliquoring process adds a dye to the leather in which the elastic material has been added and adds an anion fatliquoring agent to the leather to provide flexibility. The surface fixing process fixes the elastic material, dye, and fatliquoring agent on and in the leather.

摘要翻译： 公开了一种制造汽车座椅护罩皮革的方法。 该方法包括制备过程，鞣制过程，中和过程，复鞣过程，弹性材料添加过程，染色/加油过程和表面定影过程。 皮革经过鞣制工艺和中和工序后，复鞣工艺为皮革添加了鞣制剂。 弹性材料添加工艺增加了硅基弹性材料，以在复鞣革中引起弹性。 染色/加脂过程在已加入弹性材料的皮革中加入染料，并向皮革添加阴离子加油剂以提供柔韧性。 表面固着工艺将弹性材料，染料和加脂剂固定在皮革上和皮革上。

公开(公告)号：US20120266172A1

公开(公告)日：2012-10-18

申请号：US13446988

申请日：2012-04-13

申请人： Ji-Woong Byun ,  Jae-Wook Jeo ,  Seong-Jin Cho ,  Jong-Hyun Park ,  Sang-Chul Lee ,  Hae-II Hyun

发明人： Ji-Woong Byun ,  Jae-Wook Jeo ,  Seong-Jin Cho ,  Jong-Hyun Park ,  Sang-Chul Lee ,  Hae-II Hyun

IPC分类号： G06F9/455

CPC分类号： G06F9/45516

摘要： The present disclosure relates to an apparatus for controlling a virtual machine in a device. The apparatus comprises a virtualization requesting part and a controlling part. The virtualization requesting part is configured to transmit a first instruction word for controlling the virtual machine to an independent virtualization apparatus. The controlling part is configured to execute an operation corresponding to a second instruction word received from the virtualization apparatus.

摘要翻译： 本公开涉及一种用于控制设备中的虚拟机的装置。 该装置包括虚拟化请求部分和控制部分。 虚拟化请求部分被配置为向独立虚拟化设备发送用于控制虚拟机的第一指令字。 控制部被配置为执行与从虚拟化装置接收的第二指令字对应的动作。

公开(公告)号：US07977595B2

公开(公告)日：2011-07-12

申请号：US12038858

申请日：2008-02-28

申请人： Sang-Chul Lee ,  Ki-Hwan Kim ,  Hong-Ik Yang ,  Kil-Young Ahn

发明人： Sang-Chul Lee ,  Ki-Hwan Kim ,  Hong-Ik Yang ,  Kil-Young Ahn

IPC分类号： H01H5/00

CPC分类号： H01H3/3015 ,  H01H33/40 ,  H01H2003/3089 ,  H02B11/133

摘要： Provided are an air circuit breaker capable of allowing a closing spring to be automatically discharged at a pulled-out position in a pull-out type air circuit breaker and an automatic discharging apparatus for the closing spring in the air circuit breaker, the automatic discharging apparatus for the closing spring comprising a cam shaft rotation preventing unit installed on a cam shaft allowing the closing spring to be charged or discharged and configured to restrict the rotation of the cam shaft by an elastic restoring force of the closing spring, and a unit for releasing the cam shaft rotation preventing unit connected to the cam shaft rotation preventing unit and configured to allow the cam shaft to be rotated by the elastic restoring force of the closing spring according to positions where a main body of the air circuit breaker is pulled out of a cradle.

摘要翻译： 提供一种空气断路器，其能够使闭合弹簧在拉出型空气断路器中的拉出位置自动排出，以及用于空气断路器中的闭合弹簧的自动排出装置，自动排出装置 所述闭合弹簧包括安装在凸轮轴上的凸轮轴旋转防止单元，所述凸轮轴允许所述闭合弹簧被充放电并且被构造成通过所述闭合弹簧的弹性恢复力来限制所述凸轮轴的旋转;以及用于释放的单元 所述凸轮轴旋转防止单元连接到所述凸轮轴旋转防止单元，并且被构造成根据所述关闭弹簧的弹性恢复力使所述凸轮轴旋转，其中所述位置将所述空气断路器的主体从 摇篮。

公开(公告)号：US20100140747A1

公开(公告)日：2010-06-10

申请号：US12592924

申请日：2009-12-04

申请人： Seung-Man Choi ,  Soon-Sik Hwang ,  Ki-Chul Park ,  Gi-Bum Kim ,  Ki-Su Kim ,  Sang-Chul Lee ,  Bae-Kyoung Kim

发明人： Seung-Man Choi ,  Soon-Sik Hwang ,  Ki-Chul Park ,  Gi-Bum Kim ,  Ki-Su Kim ,  Sang-Chul Lee ,  Bae-Kyoung Kim

IPC分类号： H01L23/58 ,  H01L23/522 ,  H01L21/768

CPC分类号： H01L23/585 ,  H01L24/02 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/05042

摘要： In a method of manufacturing a semiconductor device, a pad including at least one insulating interlayer and at least one conductive wiring may be formed in a pad area of a substrate. At least one wiring may be formed adjacent to the conductive wiring. At least one insulation layer may be formed adjacent to the insulating interlayer. At least one crack preventing structure may be formed in the insulation layer. The crack preventing structure may continuously extend in the insulation layer and portions of the insulation layer may also be continuous. When a semiconductor device includes at least one crack preventing structure disposed adjacent to a pad, a degradation of the semiconductor chip caused by an external impact and/or a stress may be efficiently prevented by the crack preventing structure.

摘要翻译： 在制造半导体器件的方法中，可以在衬底的焊盘区域中形成包括至少一个绝缘中间层和至少一个导电布线的焊盘。 可以在导电布线附近形成至少一个布线。 可以在绝缘中间层附近形成至少一个绝缘层。 至少一个防裂结构可以形成在绝缘层中。 防裂结构可以在绝缘层中连续延伸，并且绝缘层的部分也可以是连续的。 当半导体器件包括邻近焊盘设置的至少一个防裂结构时，可以通过防裂结构有效地防止由外部冲击和/或应力引起的半导体芯片的劣化。