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14 条记录 (耗时 0.023 秒)

    Apparatus for inspecting a printed circuit board
    1.
    发明授权
    Apparatus for inspecting a printed circuit board 失效
    用于检查印刷电路板的装置

    公开(公告)号：US06633376B1

    公开(公告)日：2003-10-14

    申请号：US09719610

    申请日：2000-12-12

    申请人： Satoshi Nishida ,  Masanori Mizuno ,  Miki Kurosawa ,  Shozui Takeno ,  Masaharu Moriyasu

    发明人： Satoshi Nishida ,  Masanori Mizuno ,  Miki Kurosawa ,  Shozui Takeno ,  Masaharu Moriyasu

    IPC分类号： G01N2158

    CPC分类号： G01R31/309 ,  G01N21/88 ,  G01N21/8901 ,  G01N21/956

    摘要： As a scanning device for positioning the irradiation position of the laser beam emitted from a laser oscillator at a position of arbitrary coordinates in the commanded mutually orthogonal X-axis direction and Y-axis direction, two galvanomirrors having mutually orthogonal rotary axes and a scan lens are provided, and the light generated from a printed circuit board irradiated with laser beam is detected by a detector, and approval or rejection of inspection result at each position of coordinates is judged on the basis of the output signal of the detector.

    摘要翻译： 作为用于将从激光振荡器发射的激光束的照射位置定位在指令的相互正交的X轴方向和Y轴方向上的任意坐标的位置的扫描装置，具有相互正交的旋转轴的两个电流计镜和扫描透镜 并且由检测器检测从用激光束照射的印刷电路板产生的光，并且基于检测器的输出信号来判断在坐标的每个位置处的检查结果的批准或拒绝。

    Pulsed laser beam machining method and apparatus for machining a wiring board at multiple locations
    3.
    发明申请
    Pulsed laser beam machining method and apparatus for machining a wiring board at multiple locations 审中-公开
    脉冲激光束加工方法和装置，用于在多个位置加工布线板

    公开(公告)号：US20050184035A1

    公开(公告)日：2005-08-25

    申请号：US11087568

    申请日：2005-03-24

    申请人： Miki Kurosawa ,  Tsukasa Fukushima ,  Masanori Mizuno ,  Shozui Takeno ,  Masaharu Moriyasu ,  Masayuki Kaneko

    发明人： Miki Kurosawa ,  Tsukasa Fukushima ,  Masanori Mizuno ,  Shozui Takeno ,  Masaharu Moriyasu ,  Masayuki Kaneko

    IPC分类号： B23K26/38 ,  H05K3/00

    CPC分类号： H05K3/0032 ,  B23K26/389 ,  H05K2203/0554 ,  H05K2203/081

    摘要： In a laser beam machining method for a wiring board, a machined portion of the wiring board is irradiated with a pulsed laser beam for a beam irradiation time ranging from about 10 to 200 μs and with energy density of about 20 J/cm2 or more, thereby machining the wiring board, for example, drilling for a through-hole and a blind via hole, grooving, and cutting for an outside shape. The laser beam operates at a frequency of more than 67 Hz, and the spot of the laser beam is sequentially moved to different drilling positions for each pulse. After all of many drilling positions in the range of a scan vision are irradiated with the laser beam pulse by pulse, or after the elapse of a time of 15 ms or more from irradiation of the first drilling position, the laser spot is returned to the first drilling position. The spot is sequentially moved once again, and the movement is repeated several times. A pause of 15 ms or more is required between pulses directed to the same drilling position to avoid formation of a thick char layer and projection of glass cloth into the hole.

    摘要翻译： 在布线基板的激光加工方法中，对于线束板的加工部照射约10〜200μm的束照射时间的脉冲激光束，能量密度约为20J / 2以上，从而对布线板进行加工，例如钻孔，通孔和盲孔，切槽和切割成外形。 激光束以大于67Hz的频率工作，并且激光束的光点顺序地移动到每个脉冲的不同的钻孔位置。 在扫描视野范围内的所有许多钻孔位置用脉冲照射激光束脉冲之后，或者在从第一钻孔位置照射经过15ms以上的时间之后，激光点返回到 第一钻孔位置。 点再次依次移动，运动重复多次。 在指向相同钻孔位置的脉冲之间需要15ms或更长的暂停，以避免形成厚的炭层并将玻璃布投射到孔中。

    Laser machining device
    5.
    发明授权
    Laser machining device 有权
    激光加工装置

    公开(公告)号：US06875951B2

    公开(公告)日：2005-04-05

    申请号：US10111611

    申请日：2001-07-27

    申请人： Masahiko Sakamoto ,  Shozui Takeno ,  Yasuhiko Iwai ,  Toshiyuki Hokodate ,  Miki Kurosawa

    发明人： Masahiko Sakamoto ,  Shozui Takeno ,  Yasuhiko Iwai ,  Toshiyuki Hokodate ,  Miki Kurosawa

    IPC分类号： B23K26/06 ,  B23K26/067 ,  B23K26/08 ,  B23K26/38

    CPC分类号： B23K26/0608 ,  B23K26/0643 ,  B23K26/0648 ,  B23K26/067 ,  B23K26/08 ,  B23K26/082 ,  B23K26/382 ,  B23K2103/50

    摘要： A laser machining device according to the invention is provided with a laser oscillator for generating a laser beam, a main deflecting galvannometer mirror, an Fθ lens, and a sub-deflecting means arranged in an optical path between the laser oscillator and the main deflecting galvanometer mirror. A means for splitting a laser beam is provided, and the sub-deflecting means is inserted into the optical path of one of the split laser beams. At the same time, both the split laser beams are incident from the same main deflecting galvannometer mirror to the Fθ lens, and a numerical aperture in the optical system constituted by the main deflecting galvannometer mirror, the Fθ lens, and an object is set to be not more than 0.08.

    摘要翻译： 根据本发明的激光加工装置设置有用于产生激光束的激光振荡器，主偏转电流计镜，Ftheta透镜和布置在激光振荡器和主偏转电流计之间的光路中的副偏转装置 镜子。 提供了用于分割激光束的装置，并且将副偏转装置插入到一个分割激光束的光路中。 同时，分离的激光束都从相同的主偏转加速计反射镜入射到Ftheta透镜，并且由主偏转加速计镜，Ftheta透镜和物体构成的光学系统中的数值孔径被设置为 不超过0.08。

    Laser machining apparatus
    8.
    发明授权
    Laser machining apparatus 失效
    激光加工设备

    公开(公告)号：US6107600A

    公开(公告)日：2000-08-22

    申请号：US106767

    申请日：1998-06-30

    申请人： Miki Kurosawa

    发明人： Miki Kurosawa

    IPC分类号： B23K26/06 ,  B23K26/08 ,  B23K26/38 ,  B23K101/42 ,  G02B26/10 ,  H01S3/00 ,  H05K3/00 ,  B23K26/00

    CPC分类号： G02B26/101 ,  B23K26/08 ,  B23K26/082 ,  H05K3/0017

    摘要： A laser machining apparatus comprises a laser oscillator for emitting a laser beam, a deflecting mirror for reflecting the laser beam emitted from the laser oscillator, a galvanometer scanner for swinging the deflecting mirror, and a mounting/holding mechanism for a galvanometer scanner capable of adjusting a mounting angular position of the galvanometer scanner around a shaft of the deflecting mirror.

    摘要翻译： 激光加工装置包括用于发射激光束的激光振荡器，用于反射从激光振荡器发射的激光束的偏转镜，用于摆动偏转镜的电流计扫描器，以及用于能够调节的电流计扫描器的安装/保持机构 电流计扫描器围绕偏转镜的轴的安装角度位置。