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公开(公告)号:US20110260315A1
公开(公告)日:2011-10-27
申请号:US13008470
申请日:2011-01-18
申请人: Yoshihiro YAMAGUCHI , Seiji Oka , Osamu Usui , Takeshi Oi
发明人: Yoshihiro YAMAGUCHI , Seiji Oka , Osamu Usui , Takeshi Oi
IPC分类号: H01L23/492 , H01L23/02
CPC分类号: H01L24/49 , H01L23/3121 , H01L24/32 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/072 , H01L2224/32225 , H01L2224/40225 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/49111 , H01L2224/49175 , H01L2224/4943 , H01L2224/73265 , H01L2224/83801 , H01L2224/84801 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01068 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/181 , H01L2924/1815 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要: A power block includes an insulating substrate, a conductive pattern formed on the insulating substrate, a power semiconductor chip bonded onto the conductive pattern by lead-free solder, a plurality of electrodes electrically connected to the power semiconductor chip and extending upwardly away from the insulating substrate, and a transfer molding resin covering the conductive pattern, the lead-free solder, the power semiconductor chip, and the plurality of electrodes, wherein surfaces of the plurality of electrodes are exposed at an outer surface of the transfer molding resin and lie in the same plane as the outer surface, the outer surface being located directly above the conductive pattern.
摘要翻译: 功率块包括绝缘衬底,形成在绝缘衬底上的导电图案,通过无铅焊料接合到导电图案上的功率半导体芯片,多个电极,电连接到功率半导体芯片并向上远离绝缘体 基板和覆盖导电图案的传递模塑树脂,无铅焊料,功率半导体芯片和多个电极,其中多个电极的表面在转印模制树脂的外表面处露出,并且位于 与外表面相同的平面,外表面位于导电图案的正上方。
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公开(公告)号:US20110049531A1
公开(公告)日:2011-03-03
申请号:US12790254
申请日:2010-05-28
申请人: Seiji OKA , Yoshihiro YAMAGUCHI
发明人: Seiji OKA , Yoshihiro YAMAGUCHI
CPC分类号: H01L23/3121 , H01L21/565 , H01L24/28 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/072 , H01L2224/32225 , H01L2224/45124 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48237 , H01L2224/49 , H01L2224/73265 , H01L2224/92247 , H01L2924/01013 , H01L2924/01014 , H01L2924/01068 , H01L2924/01079 , H01L2924/014 , H01L2924/10272 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要: Provided is a power semiconductor device including: an insulating substrate; a circuit pattern formed on an upper surface of the insulating substrate; a power semiconductor formed on the circuit pattern; a plurality of metal socket electrode terminals formed perpendicularly to the circuit pattern or the power semiconductor so as to be in conduction with external terminals; an integral resin sleeve in which a plurality of sleeve parts are integrated, the plurality of sleeve parts being fitted with the plurality of metal socket electrode terminals from above the plurality of metal socket electrode terminals and having openings at both ends thereof; and a molding resin covering the insulating substrate, the circuit pattern, the power semiconductor, the electrode terminals, and the integral resin sleeve.
摘要翻译: 提供一种功率半导体器件,包括:绝缘基板; 形成在所述绝缘基板的上表面上的电路图案; 形成在电路图案上的功率半导体; 多个金属插座电极端子,垂直于电路图形或功率半导体形成,以便与外部端子导通; 其中多个套筒部分一体形成的整体树脂套筒,多个套筒部分从多个金属插座电极端子上方装配有多个金属插座电极端子,并在其两端具有开口; 以及覆盖绝缘基板,电路图案,功率半导体,电极端子和一体树脂套筒的成型树脂。
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公开(公告)号:US20140035123A1
公开(公告)日:2014-02-06
申请号:US13829494
申请日:2013-03-14
申请人: Seiji OKA , Yoshihiro YAMAGUCHI
发明人: Seiji OKA , Yoshihiro YAMAGUCHI
CPC分类号: H01L23/36 , H01L21/50 , H01L23/053 , H01L23/367 , H01L23/3735 , H01L23/3736 , H01L23/49811 , H01L25/072 , H01L2224/45124 , H01L2224/48137 , H01L2224/48227 , H01L2924/16195 , H01L2924/3025 , H01L2924/00
摘要: A semiconductor device includes: a semiconductor element; a substrate; a metal plate; and a plurality of spherical particles. The substrate has the semiconductor element mounted thereon. The metal plate has one surface and the other surface that face each other, and the substrate is provided on the one surface. The plurality of spherical particles each has a spherical outer shape, and a part of the spherical outer shape is buried in the other surface of the metal plate. With such a configuration, there can be obtained a semiconductor device that allows promotion of heat dissipation from the semiconductor element, and a method for manufacturing the semiconductor device.
摘要翻译: 半导体器件包括:半导体元件; 底物; 金属板; 和多个球形颗粒。 衬底上安装有半导体元件。 金属板具有一个表面,另一个表面彼此面对,并且基板设置在一个表面上。 多个球状颗粒各自具有球形外形,并且球形外形的一部分被埋在金属板的另一个表面中。 通过这样的结构,可以获得能够促进半导体元件的散热的半导体装置及半导体装置的制造方法。
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公开(公告)号:US20100013010A1
公开(公告)日:2010-01-21
申请号:US12502759
申请日:2009-07-14
IPC分类号: H01L29/78
CPC分类号: H01L29/7813 , H01L29/1095 , H01L29/41766
摘要: An impurity concentration profile in a vertical direction of a p type base contact layer of a power semiconductor device has a two-stage configuration. In other word, the impurity concentration profile is highest at an upper face of the p type base contact layer, has a local minimum value at a position other than the upper face and a lower face of the base contact layer, and has a local maximum value at a position lower than the position of the local minimum value.
摘要翻译: 功率半导体器件的p型基极接触层的垂直方向的杂质浓度分布具有两级结构。 换句话说,杂质浓度分布在p型基底接触层的上表面处最高,在基底接触层的上表面和下表面以外的位置处具有局部最小值,并且具有局部最大值 在低于局部最小值的位置的位置处的值。
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公开(公告)号:US20120205860A1
公开(公告)日:2012-08-16
申请号:US13355700
申请日:2012-01-23
申请人: Yoshihiro YAMAGUCHI
发明人: Yoshihiro YAMAGUCHI
IPC分类号: B65H1/08
CPC分类号: B65H1/04 , B65H2405/32 , B65H2405/331 , B65H2511/10 , B65H2220/01 , B65H2220/04
摘要: A sheet storage apparatus 10a (10b) includes a sheet storage portion 31 that loads and stores a plurality of sheets P, and an end cursor (a restriction member) 50 that is disposed in the sheet storage portion 31 and restricts a sheet position. The end cursor 50 is composed of two or more members so as to be foldable and removably fixed in the sheet storage portion 31.
摘要翻译: 片材存储装置10a(10b)包括装载和存储多个片材P的片材存储部分31和布置在片材存储部分31中并限制片材位置的结束光标(限制部件)50。 结束光标50由两个以上的构件构成,以便可折叠地和可移除地固定在片材存储部31中。
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公开(公告)号:US20120073643A1
公开(公告)日:2012-03-29
申请号:US13303326
申请日:2011-11-23
IPC分类号: H01L31/0224 , H01L31/18
CPC分类号: H01G9/2022 , H01G9/2031 , H01G9/2059 , Y02E10/542 , Y02P70/521
摘要: A dye-sensitized solar cell is provided, wherein it can be produced by a relatively easy and simple process and ensures high conversion efficiency even in cases where the thickness of the porous semiconductor layer is increased. The dye-sensitized solar cell 10 includes, in the interior of or on the conductive-substrate-side surface of the porous semiconductor layer 16, conductive metal film 20, such as a film of tungsten, having a large number of randomly located penetrations 24. Penetrations 24 of the conductive metal film 20 are formed by forming a fine-particle layer on the surface of the porous semiconductor layer, forming a conductive metal film on the surface of the fine-particle layer, and making the fine-particle layer disappear by heating or solvent-cleaning.
摘要翻译: 提供了一种染料敏化太阳能电池,其中其可以通过相对简单和简单的方法制造,并且即使在多孔半导体层的厚度增加的情况下也确保高转换效率。 染料敏化太阳能电池10在多孔半导体层16的内部或导电性基板侧表面上包括具有大量随机定位的穿透件24的导电金属膜20(例如钨膜) 通过在多孔半导体层的表面形成微粒层,在微粒层的表面形成导电性金属膜,使微粒层消失,形成导电性金属膜20的穿透部24 通过加热或溶剂清洗。
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公开(公告)号:US20110199744A1
公开(公告)日:2011-08-18
申请号:US13024348
申请日:2011-02-10
申请人: Yoshihiro YAMAGUCHI , Tomonori ITO
发明人: Yoshihiro YAMAGUCHI , Tomonori ITO
IPC分类号: H05K7/02
CPC分类号: H05K3/3426 , H05K1/111 , H05K3/341 , H05K2201/09381 , H05K2201/10371 , H05K2201/1084 , H05K2203/046 , Y02P70/613
摘要: A circuit module includes a substrate, a component land provided on the substrate, an electronic component bonded to the component land, a case land provided on the substrate, and a case bonded to the case land so as to cover the electronic component. The case includes a top plate, and a leg that extends from a peripheral edge of the top plate in a direction substantially perpendicular to the top plate and that includes a groove in an end surface thereof that is bonded to the case land.
摘要翻译: 电路模块包括基板,设置在基板上的部件焊盘,接合到部件焊盘的电子部件,设置在基板上的壳体焊盘,以及覆盖电子部件的壳体。 壳体包括顶板和腿部,其从顶板的周缘沿基本上垂直于顶板的方向延伸,并且在其端面中包括接合到壳体平台的凹槽。
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公开(公告)号:US20140116503A9
公开(公告)日:2014-05-01
申请号:US13303326
申请日:2011-11-23
IPC分类号: H01L31/0224 , H01L31/18
CPC分类号: H01G9/2022 , H01G9/2031 , H01G9/2059 , Y02E10/542 , Y02P70/521
摘要: A dye-sensitized solar cell is provided, wherein it can be produced by a relatively easy and simple process and ensures high conversion efficiency even in cases where the thickness of the porous semiconductor layer is increased. The dye-sensitized solar cell 10 includes, in the interior of or on the conductive-substrate-side surface of the porous semiconductor layer 16, conductive metal film 20, such as a film of tungsten, having a large number of randomly located penetrations 24. Penetrations 24 of the conductive metal film 20 are formed by forming a fine-particle layer on the surface of the porous semiconductor layer, forming a conductive metal film on the surface of the fine-particle layer, and making the fine-particle layer disappear by heating or solvent-cleaning.
摘要翻译: 提供了一种染料敏化太阳能电池,其中其可以通过相对简单和简单的方法制造,并且即使在多孔半导体层的厚度增加的情况下也确保高转换效率。 染料敏化太阳能电池10在多孔半导体层16的内部或导电性基板侧表面上包括具有大量随机定位的穿透件24的导电金属膜20(例如钨膜) 通过在多孔半导体层的表面形成微粒层,在微粒层的表面形成导电性金属膜,使微粒层消失,形成导电性金属膜20的穿透部24 通过加热或溶剂清洗。
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公开(公告)号:US20120205861A1
公开(公告)日:2012-08-16
申请号:US13328854
申请日:2011-12-16
申请人: Yoshihiro YAMAGUCHI
发明人: Yoshihiro YAMAGUCHI
IPC分类号: B65H1/12
CPC分类号: B65H1/266 , B65H1/14 , B65H2402/545 , B65H2403/544 , B65H2403/732 , B65H2405/15
摘要: When a sheet cassette (10a) is pulled out of the body of an image forming apparatus (100), winding pulleys (40a and 40b) are rotated by the weight of a lift plate. An idle gear (47) also is rotated by a predetermined amount, so that the engagement portion (47b) thereof engages with a second arm portion (50c) of a torsion spring (50). Since a force exerted by the torsion spring (50) is set greater than the force that rotates the idle gear (47) by downward movement of lift plate (30), rotation of the idle gear (47) and winding pulley (40a) is regulated, and thus the upper surface of lift plate (30) stops in a substantially constant position with respect to sheet supply opening portions (31a and 31b).
摘要翻译: 当片材盒(10a)从图像形成装置(100)的主体中拉出时,卷取带轮(40a和40b)由提升板的重量旋转。 空转齿轮(47)也旋转预定量,使得其接合部分(47b)与扭力弹簧(50)的第二臂部分(50c)接合。 由于由扭力弹簧(50)施加的力被设定为大于通过升降板(30)的向下运动使空转齿轮(47)旋转的力,空转齿轮(47)和卷取滑轮(40a)的旋转是 因此升降板30的上表面相对于供纸口部31a和31b停止在基本恒定的位置。
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公开(公告)号:US20090171230A1
公开(公告)日:2009-07-02
申请号:US12342178
申请日:2008-12-23
申请人: Yoshihiro YAMAGUCHI , Hidetoshi Oya
发明人: Yoshihiro YAMAGUCHI , Hidetoshi Oya
IPC分类号: A61B5/0402
CPC分类号: A61N1/3925 , A61B5/04012 , A61B5/0428 , A61B5/0452 , Y10S128/901
摘要: Electrocardiogram wave data in which a component of cardiac massage is removed from the electrocardiogram wave data is generated, so that the electrocardiogram wave at the time of cardiopulmonary resuscitation is identified. An electrocardiogram wave processing system of obtaining and processing the electrocardiogram wave data includes a wave identification unit that identifies an electrocardiogram wave from the obtained electrocardiogram wave data, a feature selection unit that selects a feature pattern including a feature when a cardiac massage has been performed with respect to the electrocardiogram wave data identified by the wave identification unit, a generation unit that generates a component of the cardiac massage using the feature pattern selected by the feature selection unit, and a removal unit that removes, from the obtained electrocardiogram wave data, the component of the cardiac massage generated by the generation unit.
摘要翻译: 产生其中从心电图波数据中去除心脏按摩的成分的心电图波数据,从而识别心肺复苏时的心电图波。 获取和处理心电图波数据的心电图波处理系统包括从所获得的心电图波数据中识别心电图波的波识别单元,特征选择单元,当进行心脏按摩时选择包括特征的特征图案,特征选择单元, 相对于由波识别单元识别的心电图波数据,使用由特征选择单元选择的特征图案生成心脏按摩的分量的生成单元,以及从所获得的心电图波数据中除去心脏按摩 由生成单元产生的心脏按摩的组成部分。
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