公开(公告)号：US08575745B2

公开(公告)日：2013-11-05

申请号：US13223600

申请日：2011-09-01

申请人： Seiji Oka ,  Shiori Idaka ,  Hiroshi Yoshida

发明人： Seiji Oka ,  Shiori Idaka ,  Hiroshi Yoshida

IPC分类号： H01L23/48 ,  H01L23/04

CPC分类号： H05K3/325 ,  H01L2924/0002 ,  H05K2201/0311 ,  H05K2201/10166 ,  H05K2201/1031 ,  H05K2201/1059 ,  Y02P70/611 ,  H01L2924/00

摘要： A power semiconductor device includes a conductive insertion member as an external terminal projecting from a surface of the power semiconductor device facing a printed wiring board. The printed wiring board includes a conductive fitting member mounted on a pad part of the printed wiring board. The fitting member receives the insertion member therein when the power semiconductor device is connected to the printed wiring board. The insertion member has a recessed portion formed on a side surface of the insertion member. The fitting member has a projecting portion with elasticity formed on an inner side surface of the fitting member. The elasticity causes the projecting portion of the fitting member to contact the recessed portion of the insertion member under pressure when the insertion member is inserted into the fitting member.

摘要翻译： 功率半导体器件包括作为外部端子的导电插入构件，其从面向印刷线路板的功率半导体器件的表面突出。 印刷线路板包括安装在印刷线路板的焊盘部分上的导电配件。 当功率半导体器件连接到印刷线路板时，配件构件在其中容纳插入构件。 插入构件具有形成在插入构件的侧表面上的凹部。 装配构件具有形成在装配构件的内侧表面上的弹性的突出部分。 当插入构件插入到装配构件中时，弹性使得装配构件的突出部分在压力下接触插入构件的凹部。

公开(公告)号：US20130240912A1

公开(公告)日：2013-09-19

申请号：US13988535

申请日：2011-12-05

申请人： Hiroki Shiota ,  Seiji Oka ,  Yoshihiro Yamaguchi

发明人： Hiroki Shiota ,  Seiji Oka ,  Yoshihiro Yamaguchi

IPC分类号： H01L23/495 ,  H01L29/16

CPC分类号： H01L23/49568 ,  H01L23/3121 ,  H01L23/36 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/072 ,  H01L29/1602 ,  H01L29/1608 ,  H01L2224/32013 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/1203 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device including: a semiconductor element; a lead frame connected to the semiconductor element; a metal base plate mounted on the lead frame via a first insulation layer; and a second insulation layer disposed on the opposite side of the metal base plate face on which the first insulation layer is disposed; wherein the first insulation layer is an insulation layer whose heat-dissipation performance is higher than that of the second insulation layer, and the second insulation layer is an insulation layer whose insulation performance is the same as that of the first insulation layer or higher than that of the first insulation layer.

摘要翻译： 一种半导体器件，包括：半导体元件; 连接到所述半导体元件的引线框架; 通过第一绝缘层安装在引线框架上的金属基板; 以及第二绝缘层，其设置在设置有所述第一绝缘层的所述金属基板面的相对侧上; 其特征在于，所述第一绝缘层是绝热层，其绝热性能比所述第二绝缘层高，绝缘性能与所述第一绝缘层的绝缘性能相同， 的第一绝缘层。

公开(公告)号：US20130181225A1

公开(公告)日：2013-07-18

申请号：US13619353

申请日：2012-09-14

申请人： Seiji OKA ,  Kazuhiro TADA ,  Hiroshi YOSHIDA

发明人： Seiji OKA ,  Kazuhiro TADA ,  Hiroshi YOSHIDA

IPC分类号： H01L21/304 ,  H01L21/78 ,  H01L29/02

CPC分类号： H01L21/3043 ,  H01L21/561 ,  H01L21/78 ,  H01L23/142 ,  H01L23/3121 ,  H01L23/49811 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L25/072 ,  H01L25/50 ,  H01L29/02 ,  H01L2224/48227 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2224/85 ,  H01L2924/00

摘要： A semiconductor device includes a metal substrate including a metal base plate, an insulating sheet located on the metal base plate, and a wiring pattern located on the insulating sheet, and a semiconductor element located on the metal substrate. The semiconductor element is sealed with a molding resin. The molding resin extends to side surfaces of the metal substrate. On the side surfaces of the metal substrate, the insulating sheet and the wiring pattern are not exposed from the molding resin, whereas the metal base plate includes a projecting portion exposed from the molding resin.

摘要翻译： 半导体器件包括金属基板，其包括金属基板，位于金属基板上的绝缘片和位于绝缘片上的布线图案，以及位于金属基板上的半导体元件。 半导体元件用模制树脂密封。 成型树脂延伸到金属基板的侧表面。 在金属基板的侧面上，绝缘片和布线图案不会从模制树脂露出，而金属基板包括从模制树脂露出的突出部分。

公开(公告)号：US08299601B2

公开(公告)日：2012-10-30

申请号：US12535222

申请日：2009-08-04

申请人： Seiji Oka ,  Yoshiko Obiraki ,  Takeshi Oi

发明人： Seiji Oka ,  Yoshiko Obiraki ,  Takeshi Oi

IPC分类号： H01L23/48

CPC分类号： H01L23/3735 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/4006 ,  H01L23/4334 ,  H01L23/49811 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/072 ,  H01L25/50 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/01012 ,  H01L2924/01068 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015

摘要： A power semiconductor module includes: a circuit board having a metal base plate, a high thermal conductive insulating layer, and a wiring pattern; power semiconductor elements electrically connected to the wiring pattern; tubular external terminal connection bodies provided to the wiring pattern for external terminals; and a transfer mold resin body encapsulated to expose through-holes in the metal base plate and used to fixedly attach cooling fins to the face of the metal base plate on the other side with attachment members, the face of the metal base plate on the other side, and top portions of the tubular external terminal connection bodies, to form insertion holes for the attachment members communicating with the through-holes and having a larger diameter than the through-holes, and to cover the one side and side faces of the metal base plate and the power semiconductor elements.

摘要翻译： 功率半导体模块包括：具有金属基板，高导热绝缘层和布线图案的电路板; 电连接到所述布线图案的功率半导体元件; 提供给外部端子的布线图案的管状外部端子连接体; 以及转印模塑树脂体，其被封装以暴露在金属基板中的通孔，并用于将冷却翅片固定地附接到具有附接构件的另一侧上的金属基板的表面，金属基板的另一面 侧面和顶部，以形成用于与通孔连通并且具有比通孔更大的直径的附接构件的插入孔，并且覆盖金属的一侧和侧面 基板和功率半导体元件。

公开(公告)号：US20100133684A1

公开(公告)日：2010-06-03

申请号：US12535222

申请日：2009-08-04

申请人： Seiji OKA ,  Yoshiko Obiraki ,  Takeshi Oi

发明人： Seiji OKA ,  Yoshiko Obiraki ,  Takeshi Oi

IPC分类号： H01L23/34 ,  H01L21/56

CPC分类号： H01L23/3735 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/4006 ,  H01L23/4334 ,  H01L23/49811 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/072 ,  H01L25/50 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/01012 ,  H01L2924/01068 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015

摘要： A power semiconductor module includes: a circuit board having a metal base plate, a high thermal conductive insulating layer, and a wiring pattern; power semiconductor elements electrically connected to the wiring pattern; tubular external terminal connection bodies provided to the wiring pattern for external terminals; and a transfer mold resin body encapsulated to expose through-holes in the metal base plate and used to fixedly attach cooling fins to the face of the metal base plate on the other side with attachment members, the face of the metal base plate on the other side, and top portions of the tubular external terminal connection bodies, to form insertion holes for the attachment members communicating with the through-holes and having a larger diameter than the through-holes, and to cover the one side and side faces of the metal base plate and the power semiconductor elements.

摘要翻译： 功率半导体模块包括：具有金属基板，高导热绝缘层和布线图案的电路板; 电连接到所述布线图案的功率半导体元件; 提供给外部端子的布线图案的管状外部端子连接体; 以及转印模塑树脂体，其被封装以暴露在金属基板中的通孔，并用于将冷却翅片固定地附接到具有附接构件的另一侧上的金属基板的表面，金属基板的另一面 侧面和顶部，以形成用于与通孔连通并且具有比通孔更大的直径的附接构件的插入孔，并且覆盖金属的一侧和侧面 基板和功率半导体元件。

公开(公告)号：US20100133681A1

公开(公告)日：2010-06-03

申请号：US12582246

申请日：2009-10-20

申请人： Seiji OKA ,  Yoshiko OBIRAKI ,  Takeshi OI

发明人： Seiji OKA ,  Yoshiko OBIRAKI ,  Takeshi OI

IPC分类号： H01L23/538

CPC分类号： H01L23/3735 ,  H01L23/041 ,  H01L23/3121 ,  H01L23/49811 ,  H01L24/48 ,  H01L25/072 ,  H01L25/162 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A power semiconductor device includes a power semiconductor module having cylindrical conductors which are joined to a wiring pattern so as to be substantially perpendicular to the wiring pattern and whose openings are exposed at a surface of transfer molding resin, and an insert case having a ceiling portion and peripheral walls, the ceiling portion being provided with external terminals that are fitted into, and passed through, the ceiling portion, the external terminals having outer-surface-side connecting portions at the outer surface side of the ceiling portion and inner-surface-side connecting portions at the inner surface side of the ceiling portion. The power semiconductor module is set within the insert case such that the inner-surface-side connecting portions of the external terminals are inserted into the cylindrical conductors.

摘要翻译： 功率半导体器件包括功率半导体模块，该功率半导体模块具有圆柱形导体，其连接到布线图案，以便基本上垂直于布线图案，并且其开口在传输模塑树脂的表面处露出;以及插入壳体，其具有顶部 以及周壁，所述顶部设置有外部端子，所述外部端子嵌入并通过所述顶部，所述外部端子在所述顶部的外表面侧具有外表面侧连接部， 在顶棚部分的内表面侧的侧连接部分。 功率半导体模块设置在插入壳体内，使得外部端子的内表面侧连接部分插入圆柱形导体中。

公开(公告)号：US20100127383A1

公开(公告)日：2010-05-27

申请号：US12582025

申请日：2009-10-20

申请人： Seiji OKA ,  Yoshiko Obiraki ,  Takeshi Oi

发明人： Seiji OKA ,  Yoshiko Obiraki ,  Takeshi Oi

IPC分类号： H01L23/522 ,  H01L25/16 ,  H01L23/34

CPC分类号： H01L24/40 ,  H01L24/37 ,  H01L25/072 ,  H01L2224/32225 ,  H01L2224/371 ,  H01L2224/40095 ,  H01L2224/40137 ,  H01L2224/40139 ,  H01L2224/40225 ,  H01L2224/40227 ,  H01L2224/73263 ,  H01L2224/83801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： In the power semiconductor module, a wiring metal plate electrically connects between power semiconductor elements joined to the circuit pattern, and between the power semiconductor elements and the circuit pattern. Cylindrical main terminals are joined, substantially perpendicularly, to the wiring metal plate and the circuit pattern, respectively. A cylindrical control terminal is joined, substantially perpendicularly, to one of the power semiconductor elements.

摘要翻译： 在功率半导体模块中，布线金属板将连接到电路图案的功率半导体元件之间以及功率半导体元件与电路图案之间电连接。 圆柱形主端子分别基本上垂直地接合到布线金属板和电路图案。 圆柱形控制端子基本垂直地连接到功率半导体元件中的一个。

公开(公告)号：US20060286923A1

公开(公告)日：2006-12-21

申请号：US10573586

申请日：2004-09-27

申请人： Seiji Oka ,  Toru Suzuki ,  Akinori Nakai ,  Mituaki Nagamine

发明人： Seiji Oka ,  Toru Suzuki ,  Akinori Nakai ,  Mituaki Nagamine

IPC分类号： F24F13/08 ,  F24F7/00

CPC分类号： F24F1/0011 ,  F24F1/0057 ,  F24F11/30 ,  F24F11/56 ,  F24F11/84 ,  F24F2120/10 ,  F24F2120/12

摘要： An air conditioner and a method for controlling an air conditioner are provided for controlling the direction in which conditioned air is discharged during powerful operation. The air conditioner is provided with a control unit. The control unit is connected, among other things, to a compressor, a four-way switching valve, a pressure-reducing device, a remote control, a fan motor, a flap motor, a temperature sensor, and an infrared sensor. The control unit controls the compressor, the four-way switching valve, the pressure-reducing device, the fan motor, and the flap motor. When a command for powerful operation is entered from the remote control, the control unit temporarily increases the rotational speed of the cross-flow fan, the operating frequency of the compressor, and the like, enhances the air conditioning capacity, and controls the direction of the horizontal flap according to the direction in which people are present in the room.

摘要翻译： 提供一种用于控制空调的空气调节器和方法，用于在强大的操作期间控制调节空气排放的方向。 空调设有控制单元。 控制单元尤其与压缩机，四通切换阀，减压装置，遥控器，风扇马达，挡板马达，温度传感器和红外线传感器相连接。 控制单元控制压缩机，四通切换阀，减压装置，风扇马达和挡板马达。 当从遥控器输入强大操作命令时，控制单元暂时增加横流风扇的转速，压缩机的工作频率等，提高空调能力，并且控制方向 根据人们在房间中存在的方向的水平翼。

公开(公告)号：US06451710B1

公开(公告)日：2002-09-17

申请号：US09875249

申请日：2001-06-07

申请人： Seiji Oka ,  Satoshi Yanaura ,  Yasuo Kawashima ,  Takeshi Muraki

发明人： Seiji Oka ,  Satoshi Yanaura ,  Yasuo Kawashima ,  Takeshi Muraki

IPC分类号： H01L21469

CPC分类号： H01L21/486 ,  H01L23/49894 ,  H01L2924/0002 ,  H05K3/0035 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2203/0191 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917 ,  H01L2924/00

摘要： A method of manufacturing highly reliable and highly dense printed wiring board which is not warped even by the application of pressure and heat in manufacturing the multi-layer printed wiring board. The highly precise and highly dense multi-layer printed wiring board is realized by using an uncured resin sheet reinforced with fiber as an interlayer insulating layer, forming non-through holes in the uncured resin sheet using a laser beam, filling the non-through holes with a conductive paste, half-curing the conductive paste to form a wiring material, and sticking the wiring material onto the wiring substrate by application of pressure and heat, without causing a deviation in position even in applying pressure and heat.

摘要翻译： 一种制造高可靠性和高密度印刷线路板的方法，即使在制造多层印刷线路板时，即使通过施加压力和热也不翘曲。 通过使用由纤维增强的未固化树脂片作为层间绝缘层，通过使用激光束在未固化的树脂片中形成非通孔，填充非通孔来实现高精度和高密度的多层印刷线路板 通过导电膏将半导电糊剂半固化以形成布线材料，并且通过施加压力和热量将布线材料粘附到布线基板上，即使在施加压力和热量的同时也不会引起位置偏差。

公开(公告)号：US5983059A

公开(公告)日：1999-11-09

申请号：US925146

申请日：1997-09-08

申请人： Seiji Oka ,  Yasushi Akiba ,  Masumi Ikesue ,  Masakazu Nakada ,  Hiroyasu Itou

发明人： Seiji Oka ,  Yasushi Akiba ,  Masumi Ikesue ,  Masakazu Nakada ,  Hiroyasu Itou

IPC分类号： G03G15/08

CPC分类号： G03G15/0894 ,  G03G15/0855 ,  G03G15/0865 ,  G03G15/087 ,  G03G15/0872 ,  G03G2215/00987 ,  G03G2215/0675 ,  G03G2215/0678

摘要： A recyclable toner container having a hollow cylindrical body, a toner outlet at one end of the container, and a removable cap fitted in the toner outlet. The cap have a plurality of circumferential protuberances on an outer periphery thereof and contacting the inner periphery of the toner outlet. The diameters of the plurality of protuberances are sequentially increased from a downstream side toward an upstream side in a direction in which the cap is inserted into the toner outlet.

摘要翻译： 具有中空圆筒体的可回收调色剂容器，容器一端的调色剂出口以及装在调色剂出口中的可拆卸盖。 盖在其外周上具有多个周向突起并与调色剂出口的内周接触。 多个突起的直径在帽被插入调色剂出口的方向上从下游侧向上游侧依次增加。