公开(公告)号：US20170133277A1

公开(公告)日：2017-05-11

申请号：US15411095

申请日：2017-01-20

申请人： Seiyon KIM ,  Kelin J. KUHN ,  Tahir GHANI ,  Anand S. MURTHY ,  Annalisa CAPPELLANI ,  Stephen M. CEA ,  Rafael RIOS ,  Glenn A. GLASS

发明人： Seiyon KIM ,  Kelin J. KUHN ,  Tahir GHANI ,  Anand S. MURTHY ,  Annalisa CAPPELLANI ,  Stephen M. CEA ,  Rafael RIOS ,  Glenn A. GLASS

IPC分类号： H01L21/8238 ,  H01L29/423 ,  H01L27/12 ,  H01L29/06 ,  H01L27/092 ,  H01L21/84

CPC分类号： H01L21/823821 ,  B82Y10/00 ,  H01L21/8238 ,  H01L21/823807 ,  H01L21/823828 ,  H01L21/84 ,  H01L21/845 ,  H01L27/092 ,  H01L27/0924 ,  H01L27/12 ,  H01L27/1203 ,  H01L27/1211 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/1033 ,  H01L29/42356 ,  H01L29/42392 ,  H01L29/66439 ,  H01L29/775 ,  H01L29/7853

摘要： Complimentary metal-oxide-semiconductor nanowire structures are described. For example, a semiconductor structure includes a first semiconductor device. The first semiconductor device includes a first nanowire disposed above a substrate. The first nanowire has a mid-point a first distance above the substrate and includes a discrete channel region and source and drain regions on either side of the discrete channel region. A first gate electrode stack completely surrounds the discrete channel region of the first nanowire. The semiconductor structure also includes a second semiconductor device. The second semiconductor device includes a second nanowire disposed above the substrate. The second nanowire has a mid-point a second distance above the substrate and includes a discrete channel region and source and drain regions on either side of the discrete channel region. The first distance is different from the second distance. A second gate electrode stack completely surrounds the discrete channel region of the second nanowire.

公开(公告)号：US20170141239A1

公开(公告)日：2017-05-18

申请号：US15405899

申请日：2017-01-13

申请人： Stephen M. CEA ,  Annalisa CAPPELLANI ,  Martin D. GILES ,  Rafael RIOS ,  Seiyon KIM ,  Kelin J. KUHN

发明人： Stephen M. CEA ,  Annalisa CAPPELLANI ,  Martin D. GILES ,  Rafael RIOS ,  Seiyon KIM ,  Kelin J. KUHN

IPC分类号： H01L29/786 ,  H01L29/423 ,  H01L29/66 ,  H01L29/06

CPC分类号： H01L29/78618 ,  B82Y40/00 ,  H01L21/268 ,  H01L29/0673 ,  H01L29/0847 ,  H01L29/42356 ,  H01L29/42392 ,  H01L29/66477 ,  H01L29/66742 ,  H01L29/66787 ,  H01L29/66977 ,  H01L29/7839 ,  H01L29/7845 ,  H01L29/7848 ,  H01L29/78651 ,  H01L29/78684 ,  H01L29/78696

摘要： Nanowire structures having non-discrete source and drain regions are described. For example, a semiconductor device includes a plurality of vertically stacked nanowires disposed above a substrate. Each of the nanowires includes a discrete channel region disposed in the nanowire. A gate electrode stack surrounds the plurality of vertically stacked nanowires. A pair of non-discrete source and drain regions is disposed on either side of, and adjoining, the discrete channel regions of the plurality of vertically stacked nanowires.

公开(公告)号：US20150325648A1

公开(公告)日：2015-11-12

申请号：US14803919

申请日：2015-07-20

申请人： Stephen M. CEA ,  Annalisa CAPPELLANI ,  Martin D. GILES ,  Rafael RIOS ,  Seiyon KIM ,  Kelin J. KUHN

发明人： Stephen M. CEA ,  Annalisa CAPPELLANI ,  Martin D. GILES ,  Rafael RIOS ,  Seiyon KIM ,  Kelin J. KUHN

IPC分类号： H01L29/06 ,  H01L29/423 ,  H01L29/08 ,  H01L29/66 ,  H01L21/268

CPC分类号： H01L29/78618 ,  B82Y40/00 ,  H01L21/268 ,  H01L29/0673 ,  H01L29/0847 ,  H01L29/42356 ,  H01L29/42392 ,  H01L29/66477 ,  H01L29/66742 ,  H01L29/66787 ,  H01L29/66977 ,  H01L29/7839 ,  H01L29/7845 ,  H01L29/7848 ,  H01L29/78651 ,  H01L29/78684 ,  H01L29/78696

摘要： Nanowire structures having non-discrete source and drain regions are described. For example, a semiconductor device includes a plurality of vertically stacked nanowires disposed above a substrate. Each of the nanowires includes a discrete channel region disposed in the nanowire. A gate electrode stack surrounds the plurality of vertically stacked nanowires. A pair of non-discrete source and drain regions is disposed on either side of, and adjoining, the discrete channel regions of the plurality of vertically stacked nanowires.

摘要翻译： 描述了具有非离散源极和漏极区域的纳米线结构。 例如，半导体器件包括设置在衬底上方的多个垂直堆叠的纳米线。 每个纳米线包括设置在纳米线中的离散通道区域。 栅电极堆叠围绕多个垂直堆叠的纳米线。 一对非离散源极和漏极区域设置在多个垂直堆叠的纳米线的离散沟道区域的两侧并邻接。

公开(公告)号：US20140326952A1

公开(公告)日：2014-11-06

申请号：US14274592

申请日：2014-05-09

申请人： Kelin J. KUHN ,  Seiyon KIM ,  Rafael RIOS ,  Stephen M. Cea ,  Martin D. GILES ,  Annalisa CAPPELLANI ,  Titash RAKSHIT ,  Peter CHANG ,  Willy RACHMADY

发明人： Kelin J. KUHN ,  Seiyon KIM ,  Rafael RIOS ,  Stephen M. Cea ,  Martin D. GILES ,  Annalisa CAPPELLANI ,  Titash RAKSHIT ,  Peter CHANG ,  Willy RACHMADY

IPC分类号： H01L29/06 ,  H01L29/66 ,  H01L29/165 ,  H01L29/78

CPC分类号： H01L29/0673 ,  B82Y10/00 ,  H01L21/76224 ,  H01L27/0922 ,  H01L27/1203 ,  H01L29/0676 ,  H01L29/1033 ,  H01L29/16 ,  H01L29/165 ,  H01L29/41733 ,  H01L29/42392 ,  H01L29/66439 ,  H01L29/66742 ,  H01L29/66795 ,  H01L29/775 ,  H01L29/7848 ,  H01L29/785 ,  H01L29/78618 ,  H01L29/78654 ,  H01L29/78684 ,  H01L29/78696

摘要： Methods of forming microelectronic structures are described. Embodiments of those methods include forming a nanowire device comprising a substrate comprising source/drain structures adjacent to spacers, and nanowire channel structures disposed between the spacers, wherein the nanowire channel structures are vertically stacked above each other.

摘要翻译： 描述形成微电子结构的方法。 这些方法的实施例包括形成纳米线装置，其包括基板，该基板包括与间隔物相邻的源极/漏极结构，以及设置在间隔物之间​​的纳米线通道结构，其中纳米线通道结构在彼此之上垂直堆叠。

公开(公告)号：US20190393232A1

公开(公告)日：2019-12-26

申请号：US16016375

申请日：2018-06-22

申请人： Sou-Chi CHANG ,  Uygar E. AVCI ,  Daniel H. MORRIS ,  Seiyon KIM ,  Ashish V. PENUMATCHA ,  Ian A. YOUNG

发明人： Sou-Chi CHANG ,  Uygar E. AVCI ,  Daniel H. MORRIS ,  Seiyon KIM ,  Ashish V. PENUMATCHA ,  Ian A. YOUNG

IPC分类号： H01L27/11507 ,  H01L49/02 ,  G11C11/22

摘要： Embodiments herein describe techniques for an integrated circuit (IC). The IC may include a capacitor. The capacitor may include a first electrode, a second electrode, and a paraelectric layer between the first electrode and the second electrode. A first interface with a first work function exists between the paraelectric layer and the first electrode. A second interface with a second work function exists between the paraelectric layer and the second electrode. The paraelectric layer may include a ferroelectric material or an anti-ferroelectric material. A built-in electric field associated with the first work function and the second work function may exist between the first electrode and the second electrode. The built-in electric field may be at a voltage value where the capacitor may operate at a center of a memory window of a polarization-voltage hysteresis loop of the capacitor. Other embodiments may be described and/or claimed.

公开(公告)号：US20200006346A1

公开(公告)日：2020-01-02

申请号：US16024578

申请日：2018-06-29

申请人： Uygar AVCI ,  Ian YOUNG ,  Daniel MORRIS ,  Seiyon KIM ,  Yih WANG ,  Ruth BRAIN

发明人： Uygar AVCI ,  Ian YOUNG ,  Daniel MORRIS ,  Seiyon KIM ,  Yih WANG ,  Ruth BRAIN

IPC分类号： H01L27/108 ,  H01L49/02 ,  H01L21/768 ,  H01L23/522

摘要： Embodiments include an embedded dynamic random access memory (DRAM) device, a method of forming an embedded DRAM device, and a memory device. An embedded DRAM device includes a dielectric having a logic area and a memory area, and a trace and a via disposed in the logic area of dielectric. The embedded DRAM device further includes ferroelectric capacitors disposed in the memory area of dielectric, where each ferroelectric capacitor includes a first electrode, a ferroelectric layer, and a second electrode, and where the ferroelectric layer surrounds the first electrode of each ferroelectric capacitor and extends along a top surface of the dielectric in the memory area. The embedded DRAM device includes an etch stop layer above the dielectric. The second etch stop in the logic area may have a z-height that is approximately equal to a z-height of a top surface of the second etch stop in the memory area.

公开(公告)号：US20200006352A1

公开(公告)日：2020-01-02

申请号：US16021019

申请日：2018-06-28

申请人： Uygar AVCI ,  Daniel MORRIS ,  Seiyon KIM ,  Yih WANG ,  Ruth BRAIN ,  Ian YOUNG

发明人： Uygar AVCI ,  Daniel MORRIS ,  Seiyon KIM ,  Yih WANG ,  Ruth BRAIN ,  Ian YOUNG

IPC分类号： H01L27/11 ,  H01L23/528 ,  H01L23/522 ,  H01L49/02 ,  H01L21/768 ,  H01L21/311

摘要： Embodiments include a memory array and a method of forming the memory array. A memory array includes a first dielectric over first metal traces, where first metal traces extend along a first direction, second metal traces on the first dielectric, where second metal traces extend along a second direction perpendicular to the first direction, and third metal traces on the second dielectric, where third metal traces extend along the first direction. The memory array includes a ferroelectric capacitor positioned in a trench having sidewalls and bottom surface, where the trench has a depth defined from a top surface of first metal trace to the top surface of third metal trace. The memory array further includes an insulating sidewall, a first electrode, a ferroelectric, and a second electrode disposed in the trench, where the trench has a rectangular cylinder shape defined by the first, second, and third metal traces.

公开(公告)号：US20200006516A1

公开(公告)日：2020-01-02

申请号：US16024719

申请日：2018-06-29

申请人： Sasikanth MANIPATRUNI ,  Uygar AVCI ,  Seiyon KIM ,  Ian YOUNG

发明人： Sasikanth MANIPATRUNI ,  Uygar AVCI ,  Seiyon KIM ,  Ian YOUNG

IPC分类号： H01L29/51 ,  H01L29/49 ,  H01L29/78 ,  H01L29/423 ,  H01L21/28 ,  H01L29/66 ,  H01L21/02 ,  H01L29/24 ,  H01L49/02 ,  H01L29/786

摘要： An integrated circuit structure comprises a substrate. An antiferroelectric gate oxide is above the substrate, the antiferroelectric gate oxide comprising a perovskite material. A gate electrode is over at least a portion of the gate oxide.