公开(公告)号：US20120015484A1

公开(公告)日：2012-01-19

申请号：US13246615

申请日：2011-09-27

申请人： Shan GAO ,  Seog Moon CHOI ,  Tae Hyun KIM ,  Ju Pyo HONG ,  Bum Sik JANG ,  Ji Hyun PARK

发明人： Shan GAO ,  Seog Moon CHOI ,  Tae Hyun KIM ,  Ju Pyo HONG ,  Bum Sik JANG ,  Ji Hyun PARK

IPC分类号： H01L21/50

CPC分类号： H01L25/072 ,  H01L23/3121 ,  H01L23/3735 ,  H01L23/427 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/071 ,  H01L25/50 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/4846 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： Disclosed herein is a power semiconductor module. The module includes metal plates each having a first through hole, with an anodic oxidation layer formed on a surface of metal plates and an interior of the first through hole. A cooling member has a second through hole at a position corresponding to the first through hole, and the metal plates are attached to both sides of the cooling member. A circuit layer is formed on the anodic oxidation layer and performs an interlayer connection through a via formed in the first and second through holes. A power device is connected to the circuit layer. A resin encapsulant encloses the circuit layer and the power device. A housing is installed to each of the metal plates to form a sealing space for the resin encapsulant.

摘要翻译： 这里公开了功率半导体模块。 模块包括各自具有第一通孔的金属板，阳极氧化层形成在金属板的表面和第一通孔的内部。 冷却构件在与第一通孔对应的位置具有第二通孔，并且金属板附接到冷却构件的两侧。 在阳极氧化层上形成电路层，通过在第一和第二通孔中形成的通孔进行层间连接。 电源设备连接到电路层。 树脂密封剂包围电路层和功率器件。 每个金属板上安装有一个壳体，以形成树脂密封剂的密封空间。

公开(公告)号：US20120084977A1

公开(公告)日：2012-04-12

申请号：US13268252

申请日：2011-10-07

申请人： Seung Wook PARK ,  Young Do KWEON ,  Ju Pyo HONG ,  Seung Wan SHIN ,  Kyung Seob OH

发明人： Seung Wook PARK ,  Young Do KWEON ,  Ju Pyo HONG ,  Seung Wan SHIN ,  Kyung Seob OH

IPC分类号： H05K3/30

CPC分类号： H05K3/284 ,  H01L23/49531 ,  H01L23/552 ,  H01L2224/16225 ,  H01L2924/09701 ,  H05K3/202 ,  H05K3/363 ,  H05K2201/0715 ,  H05K2201/10924 ,  H05K2203/1316 ,  Y10T29/4913

摘要： Disclosed herein is a method of manufacturing a block module including: mounting an electronic part on a base substrate on which a ground terminal is formed; forming a lead frame to extend to the outside of the base substrate from the ground terminal; connecting a flexible printed circuit to a circuit layer on the base substrate; forming a mold to surround the base substrate; cutting the lead frame and exposing the cut surface of the lead frame to the outside of the mold; and forming a metal coating layer connected to the lead frame on the mold, whereby the metal coating layer is formed to surround the mold to interrupt the electromagnetic waves and the metal coating layer is connected to the ground terminal by the lead frame to make the process simple.

摘要翻译： 本文公开了一种制造块模块的方法，包括：将电子部件安装在其上形成有接地端子的基底基板上; 形成引线框架，从接地端子延伸到基底基板的外部; 将柔性印刷电路连接到基底基板上的电路层; 形成包围所述基底基板的模具; 切割引线框架并将引线框架的切割表面暴露于模具的外部; 并且形成与模具上的引线框架连接的金属涂层，由此形成金属涂层以围绕模具以中断电磁波，并且金属涂层通过引线框架连接到接地端子，以使该工艺 简单。

公开(公告)号：US20110156241A1

公开(公告)日：2011-06-30

申请号：US12712044

申请日：2010-02-24

申请人： Ju Pyo HONG ,  Young Do Kweon ,  Jin Gu Kim ,  Seung Wook Park ,  Hee Kon Lee

发明人： Ju Pyo HONG ,  Young Do Kweon ,  Jin Gu Kim ,  Seung Wook Park ,  Hee Kon Lee

IPC分类号： H01L23/498 ,  H01L21/60

CPC分类号： H01L23/3128 ,  H01L23/3135 ,  H01L23/3677 ,  H01L23/49816 ,  H01L23/5389 ,  H01L23/562 ,  H01L24/16 ,  H01L24/19 ,  H01L24/48 ,  H01L24/73 ,  H01L2221/68345 ,  H01L2224/24 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85455 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/19107 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Disclosed herein are a package substrate and a method of fabricating the same. The package substrate includes a base part that includes a chip, a mold part surrounding the chip, and a connection unit formed inside the mold part to connect the chip to a terminal part formed on the outer surface of the mold part, and a buildup layer that is formed on one surface of the base part on which the terminal part is formed, including the side surfaces of the base part, but includes a circuit layer connected to the terminal part, thereby making it possible to minimize stress applied to chips during a buildup process and easily replace malfunctioning chips.

摘要翻译： 本文公开了封装衬底及其制造方法。 封装基板包括基部，该基部包括芯片，围绕芯片的模具部分和形成在模具部分内的连接单元，以将芯片连接到形成在模具部件的外表面上的端子部分，以及累积层 形成在其上形成有端子部的基部的一个表面上，包括基部的侧表面，但是包括连接到端子部的电路层，从而使得可以最小化在一个 积累过程，轻松替代故障芯片。