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公开(公告)号:US06566728B1
公开(公告)日:2003-05-20
申请号:US09678555
申请日:2000-10-04
申请人: Shigeaki Okawa , Toshiyuki Ohkoda , Yoshiaki Ohbayashi , Mamoru Yasuda , Shinichi Saeki , Shuji Osawa
发明人: Shigeaki Okawa , Toshiyuki Ohkoda , Yoshiaki Ohbayashi , Mamoru Yasuda , Shinichi Saeki , Shuji Osawa
IPC分类号: H01L2900
CPC分类号: H04R19/005 , H04R19/04
摘要: First, a stationary electrode layer is formed over a semiconductor substrate and an integrated network is composed in a circuit element area around the stationary electrode layer by electrode wiring forming each circuit element. A spacer is arranged on a passivation film in plural places. A dummy island is formed in an area between the circuit element area and the stationary electrode layer area. Supply potential Vcc is applied to the dummy island and ground potential GND is applied to a P+-type separated area.
摘要翻译: 首先,在半导体衬底上形成固定电极层,并且通过形成每个电路元件的电极布线,在固定电极层周围的电路元件区域中形成集成网络。 在多个位置上在隔离膜上设置间隔物。 在电路元件区域和固定电极层区域之间的区域中形成虚设的岛。 将供电电位Vcc施加到虚拟岛,将接地电位GND施加到P +型分离区域。
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公开(公告)号:US06522012B2
公开(公告)日:2003-02-18
申请号:US10119711
申请日:2002-04-11
申请人: Shigeaki Okawa , Toshiyuki Ohkoda
发明人: Shigeaki Okawa , Toshiyuki Ohkoda
IPC分类号: H01L2348
CPC分类号: H01L24/05 , H01L21/761 , H01L22/32 , H01L23/5222 , H01L24/02 , H01L27/0635 , H01L27/098 , H01L2224/05624 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01033 , H01L2924/01051 , H01L2924/014 , H01L2924/12036 , H01L2924/1305 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/3011 , H01L2924/00014 , H01L2924/00
摘要: The present invention is a semiconductor device, which is able to provide a desired output voltage of an ECM without signal loss caused by parasitic capacitances. Such a semiconductor device comprises a semiconductor substrate; integrated network elements including an input transistor being integrated on the semiconductor substrate, the input transistor having an input terminal; a first bonding pad connected to the input terminal of the input transistor for testing properties of the input transistor; a second bonding pad connected to one of the integrated network elements for external connection; and a surface area of the first coding pad being smaller than that of the second bonding pad.
摘要翻译: 本发明是一种半导体器件,其能够提供ECM的期望的输出电压,而不会由寄生电容引起信号损失。 这种半导体器件包括半导体衬底; 集成的网络元件包括集成在半导体衬底上的输入晶体管,输入晶体管具有输入端; 连接到输入晶体管的输入端的第一焊盘,用于测试输入晶体管的特性; 连接到所述集成网络元件之一用于外部连接的第二焊盘; 并且所述第一编码焊盘的表面积小于所述第二焊盘的表面积。
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公开(公告)号:US06417560B1
公开(公告)日:2002-07-09
申请号:US09679117
申请日:2000-10-04
申请人: Shigeaki Okawa , Toshiyuki Ohkoda , Yoshiaki Ohbayashi , Mamoru Yasuda , Shinichi Saeki , Shuji Osawa
发明人: Shigeaki Okawa , Toshiyuki Ohkoda , Yoshiaki Ohbayashi , Mamoru Yasuda , Shinichi Saeki , Shuji Osawa
IPC分类号: H01L23552
CPC分类号: H04R19/005 , H04R19/04
摘要: A fixed electrode layer 12 is formed on a semiconductor substrate 11. A vibrating film is formed on the fixed electrode layer through a spacer 14. Since the vibrating film is a light-permeable film, in order to prevent the malfunction of an electronic circuit formed in the semiconductor substrate by incident light, the region where the electronic circuit is to be formed is covered with a shield metal 33.
摘要翻译: 固定电极层12形成在半导体基板11上。通过间隔件14在固定电极层上形成振动膜。由于振动膜是透光膜,为了防止形成电子电路的故障 在通过入射光在半导体衬底中,要形成电子电路的区域被屏蔽金属33覆盖。
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公开(公告)号:US06392307B1
公开(公告)日:2002-05-21
申请号:US09534872
申请日:2000-03-24
申请人: Shigeaki Okawa , Toshiyuki Ohkoda
发明人: Shigeaki Okawa , Toshiyuki Ohkoda
IPC分类号: H01L2348
CPC分类号: H01L24/05 , H01L21/761 , H01L22/32 , H01L23/5222 , H01L24/02 , H01L27/0635 , H01L27/098 , H01L2224/05624 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01033 , H01L2924/01051 , H01L2924/014 , H01L2924/12036 , H01L2924/1305 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/3011 , H01L2924/00014 , H01L2924/00
摘要: The present invention is a semiconductor device, which is able to provide a desired output voltage of an ECM without signal loss caused by parasitic capacitances. Such a semiconductor device comprises a semiconductor substrate; integrated network elements including an input transistor being integrated on the semiconductor substrate, the input transistor having an input terminal; a first bonding pad connected to the input terminal of the input transistor for testing properties of the input transistor; a second bonding pad connected to one of the integrated network elements for external connection; and a surface area of the first coding pad being smaller than that of the second bonding pad.
摘要翻译: 本发明是一种半导体器件,其能够提供ECM的期望的输出电压,而不会由寄生电容引起信号损失。 这种半导体器件包括半导体衬底; 集成的网络元件包括集成在半导体衬底上的输入晶体管,输入晶体管具有输入端; 连接到输入晶体管的输入端的第一焊盘,用于测试输入晶体管的特性; 连接到所述集成网络元件之一用于外部连接的第二焊盘; 并且所述第一编码焊盘的表面积小于所述第二焊盘的表面积。
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公开(公告)号:US06479878B1
公开(公告)日:2002-11-12
申请号:US09660061
申请日:2000-09-12
申请人: Shigeaki Okawa , Toshiyuki Ohkoda , Yoshiaki Ohbayashi , Mamoru Yasuda , Shinichi Saeki , Shuji Osawa
发明人: Shigeaki Okawa , Toshiyuki Ohkoda , Yoshiaki Ohbayashi , Mamoru Yasuda , Shinichi Saeki , Shuji Osawa
IPC分类号: H01L2982
CPC分类号: H04R7/16 , H04R19/005 , H04R19/04
摘要: A stationary electrode layer 12 is formed on a semiconductor substrate 11, and a vibrating diaphragm 16 is disposed on spacers 14. The vibrating diaphragm 16 is placed so as to protrude from an end of the semiconductor substrate 11, and terminal pads 20 to 23 are placed with being exposed from the vibrating diaphragm 16.
摘要翻译: 固定电极层12形成在半导体衬底11上,振动膜16设置在间隔件14上。振动膜16被放置成从半导体衬底11的一端突出,端子衬垫20至23为 放置在从振动膜16暴露的位置。
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公开(公告)号:US06420203B1
公开(公告)日:2002-07-16
申请号:US10032632
申请日:2001-12-28
申请人: Shigeaki Okawa , Toshiyuki Ohkoda , Yoshiaki Ohbayashi , Mamoru Yasuda , Shinichi Saeki , Shuji Osawa
发明人: Shigeaki Okawa , Toshiyuki Ohkoda , Yoshiaki Ohbayashi , Mamoru Yasuda , Shinichi Saeki , Shuji Osawa
IPC分类号: H01L2100
CPC分类号: H04R7/16 , H04R19/005 , H04R19/04
摘要: A stationary electrode layer 12 is formed on a semiconductor substrate 11, and a vibrating diaphragm 16 is disposed on spacers 14. The vibrating diaphragm 16 is placed so as to protrude from an end of the semiconductor substrate 11, and terminal pads 20 to 23 are placed with being exposed from the vibrating diaphragm 16.
摘要翻译: 固定电极层12形成在半导体衬底11上,振动膜16设置在间隔件14上。振动膜16被放置成从半导体衬底11的一端突出,端子衬垫20至23为 放置在从振动膜16暴露的位置。
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公开(公告)号:US06960797B2
公开(公告)日:2005-11-01
申请号:US10320576
申请日:2002-12-17
申请人: Shigeaki Okawa , Toshiyuki Ohkoda
发明人: Shigeaki Okawa , Toshiyuki Ohkoda
IPC分类号: H01L29/73 , H01L21/331 , H01L21/337 , H01L21/761 , H01L21/8222 , H01L21/8248 , H01L27/06 , H01L29/732 , H01L29/808 , H04R3/00 , H01L29/80 , H01L31/112
CPC分类号: H01L21/761 , H01L27/0635 , H01L2924/0002 , H01L2924/00
摘要: The object of the present invention is to provide a semiconductor device, which is suitable for use to connect electric condenser microphones. A semiconductor device, comprises: a conductivity-type substrate; an epitaxial layer formed on top of the substrate; island regions separating the epitaxial layer; an input transistor formed on one of the island regions; an insulation layer covering the surface of the input transistor layer; an expansion electrode formed above the insulation layer so as to provide an electrical connection to an input terminal of the input transistor; and resistivity of the epitaxial layer formed below the expansion electrode being in a range of 1000˜5,000 Ω·cm.
摘要翻译: 本发明的目的是提供一种适用于连接电容式麦克风的半导体器件。 一种半导体器件,包括:导电型衬底; 形成在基板顶部的外延层; 分离外延层的岛区; 形成在所述岛区域之一上的输入晶体管; 绝缘层,覆盖输入晶体管层的表面; 扩展电极,形成在绝缘层之上,以便提供与输入晶体管的输入端的电连接; 并且形成在膨胀电极下方的外延层的电阻率在1000〜5000Ω·cm的范围内。
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公开(公告)号:US06590273B2
公开(公告)日:2003-07-08
申请号:US10029895
申请日:2001-12-21
申请人: Shigeaki Okawa , Toshiyuki Ohkoda
发明人: Shigeaki Okawa , Toshiyuki Ohkoda
IPC分类号: H01L2900
CPC分类号: H01L29/66272 , H01L27/0664 , H01L29/0821 , H01L29/8611
摘要: In the semiconductor integrated circuit device, a first P+ type buried layer formed as an anode region and an N+ type diffused region formed in a cathode region are spaced from each other in the direction of the depth. This makes it possible to provide a semiconductor integrated circuit device in which a large depletion layer forming region can be provided in an N type region at a PN junction formed by first and second epitaxial layers and when a reverse bias voltage is applied to a diode element and in which a withstand voltage can be maintained by a depletion layer thus formed to prevent breakdown of elements in the device attributable to a breakdown current.
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公开(公告)号:US06555857B1
公开(公告)日:2003-04-29
申请号:US09520950
申请日:2000-03-08
申请人: Shigeaki Okawa , Toshiyuki Ohkoda
发明人: Shigeaki Okawa , Toshiyuki Ohkoda
IPC分类号: H01L2980
CPC分类号: H01L21/761 , H01L27/0635 , H01L2924/0002 , H01L2924/00
摘要: The object of the present invention is to provide a semiconductor device, which is suitable for use to connect electric condenser microphones. A semiconductor device, comprises: a conductivity-type substrate; an epitaxial layer formed on top of the substrate; island regions separating the epitaxial layer; an input transistor formed on one of the island regions; an insulation layer covering the surface of the input transistor layer; an expansion electrode formed above the insulation layer so as to provide an electrical connection to an input terminal of the input transistor; and resistivity of the epitaxial layer formed below the expansion electrode being in a range of 1000˜5,000 &OHgr;·cm.
摘要翻译: 本发明的目的是提供一种适用于连接电容式麦克风的半导体器件。 一种半导体器件,包括:导电型衬底; 形成在基板顶部的外延层; 分离外延层的岛区; 形成在所述岛区域之一上的输入晶体管; 绝缘层,覆盖输入晶体管层的表面; 扩展电极,形成在绝缘层之上,以便提供与输入晶体管的输入端的电连接; 并且形成在膨胀电极下方的外延层的电阻率在1000〜5000欧姆·厘米的范围内。
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公开(公告)号:US20050087771A1
公开(公告)日:2005-04-28
申请号:US10949569
申请日:2004-09-24
申请人: Ryo Kanda , Shigeaki Okawa , Kazuhiro Yoshitake
发明人: Ryo Kanda , Shigeaki Okawa , Kazuhiro Yoshitake
IPC分类号: H01L21/331 , H01L21/822 , H01L21/8222 , H01L27/04 , H01L27/06 , H01L27/082 , H01L29/732 , H01L29/745
CPC分类号: H01L27/0821 , H01L27/0647
摘要: A semiconductor integrated circuit device according to the present invention includes a diode in a second island region. The anode region of the diode and the dividing region in a first island region having a horizontal PNP transistor are electrically connected to each other; the cathode region of the diode and the collector region of a power NPN transistor are electrically connected to each other. Accordingly, the dividing region in the first island region having a horizontal PNP transistor becomes lower in potential than the dividing regions in the other island regions, so that the inflow of free carriers (electrons) to the horizontal PNP transistor can be prevented.
摘要翻译: 根据本发明的半导体集成电路器件包括在第二岛区中的二极管。 二极管的阳极区域和具有水平PNP晶体管的第一岛区域中的分割区域彼此电连接; 二极管的阴极区域和功率NPN晶体管的集电极区域彼此电连接。 因此,具有水平PNP晶体管的第一岛状区域中的分割区域的电位低于其他岛状区域中的分割区域,从而可以防止自由载流子(电子)向水平PNP晶体管的流入。
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