公开(公告)号：US5754915A

公开(公告)日：1998-05-19

申请号：US750676

申请日：1996-12-13

申请人： Shigeru Masuda ,  Tsukasa Nakano ,  Masayuki Kojima ,  Masayuki Nakanishi ,  Toshihiko Nakano ,  Haruo Hakamada ,  Hideo Ishii

发明人： Shigeru Masuda ,  Tsukasa Nakano ,  Masayuki Kojima ,  Masayuki Nakanishi ,  Toshihiko Nakano ,  Haruo Hakamada ,  Hideo Ishii

IPC分类号： G03D3/06

CPC分类号： G03D3/065

摘要： An automatic photosensitive material developing machine supplies a solid processing solution to be dissolved according to consumption of processing solution for a silver halide photosensitive material to be treated. The developing machine includes a solid processing solution supplying section for supplying the solid processing solution from a solid processing solution cartridge containing the solid processing solution, and a solid processing solution transferring section for receiving the solid processing solution supplied by the solid processing solution supplying section in a bucket, and for transferring the bucket upward.

摘要翻译： PCT No.PCT / JP95 / 01188 Sec。 371日期1996年12月13日第 102（e）日期1996年12月13日PCT提交1995年6月12日PCT公布。 WO95 / 34844 PCT出版物 日期1995年12月21日自动感光材料显影机根据消费用于待处理的卤化银感光材料的处理溶液提供待溶解的固体处理溶液。 显影机包括：固体处理剂供给部，用于从固体处理溶液的固体处理液筒供给固体处理液;固体处理液转移部，其用于接收由固体处理剂供给部供给的固体处理液 一个铲斗，并将铲斗向上传送。

公开(公告)号：US08926402B2

公开(公告)日：2015-01-06

申请号：US13303485

申请日：2011-11-23

申请人： Masayuki Nakanishi ,  Masaya Seki ,  Kenji Kodera

发明人： Masayuki Nakanishi ,  Masaya Seki ,  Kenji Kodera

IPC分类号： B24B1/00 ,  B24B9/06 ,  B24B21/00 ,  B24B37/02

CPC分类号： B24B9/065 ,  B24B21/002 ,  B24B37/02

摘要： A method of polishing a peripheral portion of a substrate is provided. This method includes: causing sliding contact between the peripheral portion of the substrate and a polishing tape; and supplying a polishing liquid onto the polishing tape contacting the peripheral portion of the substrate. The polishing tape includes a base tape and a fixed abrasive formed on the base tape, and the polishing liquid is an alkaline polishing liquid containing an alkaline chemical and an additive including molecules that cause steric hindrance.

摘要翻译： 提供了研磨基板周边部分的方法。 该方法包括：引起基板的周边部分与研磨带之间的滑动接触; 以及将研磨液供给到与基板的周边部分接触的研磨带上。 抛光带包括形成在基带上的基带和固定磨料，抛光液是含有碱性化学物质和包含引起空间位阻的分子的添加剂的碱性抛光液。

公开(公告)号：US08535117B2

公开(公告)日：2013-09-17

申请号：US12956381

申请日：2010-11-30

申请人： Masayuki Nakanishi ,  Masunobu Onozawa ,  Masaya Seki

发明人： Masayuki Nakanishi ,  Masunobu Onozawa ,  Masaya Seki

IPC分类号： B24B1/00

CPC分类号： B24B9/065 ,  B24B21/002

摘要： A method capable of quickly polishing an angular portion formed by a grinded back surface and a circumferential surface of a substrate without causing damages on the thin substrate is provided. The method includes rotating the substrate about its center, and pressing a polishing tape against the angular portion formed by the back surface and the circumferential surface of the substrate to polish the angular portion.

摘要翻译： 提供了一种能够快速抛光由磨削的背面和基板的圆周表面形成的角部，而不会在薄基板上造成损坏的方法。 该方法包括使基板围绕其中心旋转，并且将研磨带压靠在由基板的背面和圆周表面形成的角部上以抛光角部。

公开(公告)号：US20110237164A1

公开(公告)日：2011-09-29

申请号：US12986481

申请日：2011-01-07

申请人： Masaya SEKI ,  Kenya Ito ,  Masayuki Nakanishi

发明人： Masaya SEKI ,  Kenya Ito ,  Masayuki Nakanishi

IPC分类号： B24B1/00 ,  B24B27/00

CPC分类号： B24B9/065 ,  B24B21/004 ,  B24B37/27

摘要： A polishing apparatus polishes a top edge portion and/or a bottom edge portion of a substrate accurately and uniformly. The polishing apparatus includes a rotary holding mechanism 3 configured to hold the substrate W horizontally and to rotate the substrate W; and at least one polishing head 30 disposed near the peripheral portion of the substrate. The polishing head 30 has at least one protrusion 51a, 51b extending along a circumferential direction of the substrate W, and the polishing head 30 is configured to press a polishing surface of a polishing tape 23 by the protrusion 51a, 51b against the peripheral portion of the substrate W from above or below.

摘要翻译： 抛光装置精确而均匀地抛光基板的顶边部分和/或底边部分。 抛光装置包括旋转保持机构3，其构造成水平地保持基板W并使基板W旋转; 以及设置在基板的周边部分附近的至少一个抛光头30。 抛光头30具有沿着基板W的圆周方向延伸的至少一个突起51a，51b，并且抛光头30被构造成通过突起51a，51b将抛光带23的抛光表面压靠在基板 基底W从上方或下方。

公开(公告)号：US06938968B2

公开(公告)日：2005-09-06

申请号：US10258131

申请日：2001-04-23

申请人： Yasuaki Tanimoto ,  Tomohisa Tenra ,  Masayuki Nakanishi ,  Akiko Yuasa

发明人： Yasuaki Tanimoto ,  Tomohisa Tenra ,  Masayuki Nakanishi ,  Akiko Yuasa

IPC分类号： B65D81/18 ,  B65D81/38 ,  C03C13/00 ,  F16L59/065 ,  F25D23/06 ,  B32B1/06 ,  F25D11/00

CPC分类号： F16L59/065 ,  B65D81/18 ,  B65D81/3823 ,  B65D81/3897 ,  C03C13/00 ,  F25D23/062 ,  F25D2201/124 ,  F25D2201/126 ,  F25D2201/14 ,  F25D2400/04 ,  Y10T428/1362 ,  Y10T428/231

摘要： Vacuum heat insulator comprising a laminated core made of a plurality of sheets of inorganic fibers having 10 μm or smaller in diameter and a certain composition including SiO2 as a main component, Al2O3, CaO, and MgO, a gas barrier enveloping member, and an absorbent. The vacuum heat insulator is characterized by having at least one groove formed therein after fabrication of the vacuum heat insulator. Further, the vacuum heat insulator is characterized by using inorganic fiber core of which a peak of distribution in fiber diameter lies between 1 μm or smaller and 0.1 μm or larger, and not containing binding material for binding the fiber material. Electronic apparatuses use the vacuum heat insulator. With use of the vacuum heat insulator, electronic and electric apparatuses superior in energy saving and not to present uncomfortable feeling to the user can be provided.

摘要翻译： 真空绝热体包括由直径10μm以下的多个无机纤维片构成的叠层铁芯，以及以SiO 2为主要成分的一定成分，Al 2 N 2 氧化铝，氧化镁，氧化镁，阻气性包封材料和吸收剂。 真空绝热器的特征在于在制造真空隔热件之后具有形成在其中的至少一个凹槽。 此外，真空绝热体的特征在于使用纤维直径分布的峰值在1μm以上0.1μm以下的无机纤维芯，不含粘合纤维材料的粘合材料。 电子设备使用真空绝热体。 通过使用真空绝热体，可以提供节能性优异且不给使用者带来不适感的电子电气装置。

公开(公告)号：US5017225A

公开(公告)日：1991-05-21

申请号：US392913

申请日：1989-07-27

申请人： Masayuki Nakanishi ,  Takashi Iwasaki ,  Shuichi Maeda

发明人： Masayuki Nakanishi ,  Takashi Iwasaki ,  Shuichi Maeda

IPC分类号： C09D11/00 ,  C09K9/02 ,  G03C1/00 ,  G03C1/685

CPC分类号： C09D11/50 ,  C09K9/02 ,  G03C1/002 ,  G03C1/685 ,  Y10T428/2984

摘要： This invention relates to a microencapsulated photochromic material and a process for its preparation. More particularly, it relates to a microencapsulated photochromic material having a good durability and a process for its preparation.The present invention further relates to a water-base ink composition comprising said microencapsulated photochromic material.

摘要翻译： PCT No.PCT / JP88 / 01215 Sec。 371日期：1989年7月27日 102（e）日期1989年7月27日PCT提交1988年12月1日PCT公布。 第WO89 / 05335号公报 日本6月15日，1989年。本发明涉及一种微囊化光致变色材料及其制备方法。 更具体地说，本发明涉及具有良好耐久性的微囊化光致变色材料及其制备方法。 本发明还涉及包含所述微囊化光致变色材料的水性油墨组合物。

公开(公告)号：US09457447B2

公开(公告)日：2016-10-04

申请号：US13073218

申请日：2011-03-28

申请人： Masaya Seki ,  Tetsuji Togawa ,  Masayuki Nakanishi

发明人： Masaya Seki ,  Tetsuji Togawa ,  Masayuki Nakanishi

IPC分类号： B24B1/00 ,  B24B21/00 ,  B24B9/06 ,  B24B21/20 ,  H01L21/306 ,  H01L21/67 ,  H01L21/68 ,  H01L21/84 ,  H01L21/66

CPC分类号： B24B21/002 ,  B24B9/065 ,  B24B21/20 ,  H01L21/30625 ,  H01L21/67092 ,  H01L21/67259 ,  H01L21/68 ,  H01L21/84 ,  H01L22/20

摘要： The polishing apparatus has a polishing unit capable of forming a right-angled cross section by polishing a peripheral portion of the substrate. The polishing unit includes a polishing head having a pressing member configured to press a polishing tape against the peripheral portion of the substrate from above, a tape supply and recovery mechanism configured to supply the polishing tape to the polishing head and to recover the polishing tape from the polishing head, a first moving mechanism configured to move the polishing head in a radial direction of the substrate, and a second moving mechanism configured to move the tape supply and recovery mechanism in the radial direction of the substrate. The guide rollers are arranged such that the polishing tape extends parallel to a tangential direction of the substrate and a polishing surface of the polishing tape is parallel to a surface of the substrate.

摘要翻译： 抛光装置具有能够通过抛光基板的周边部分而形成直角横截面的抛光单元。 抛光单元包括：抛光头，其具有被配置成从上方将研磨带压靠在基板的周边部分上的按压构件，配置成将抛光带供给到抛光头并将抛光带从 抛光头，构造成沿着基板的径向方向移动抛光头的第一移动机构和被配置为沿着基板的径向移动带供给和恢复机构的第二移动机构。 引导辊布置成使得抛光带平行于基板的切线方向延伸，并且抛光带的抛光表面平行于基板的表面。

公开(公告)号：US08979615B2

公开(公告)日：2015-03-17

申请号：US13308857

申请日：2011-12-01

申请人： Masaya Seki ,  Tetsuji Togawa ,  Masayuki Nakanishi ,  Naoki Matsuda ,  Atsushi Yoshida

发明人： Masaya Seki ,  Tetsuji Togawa ,  Masayuki Nakanishi ,  Naoki Matsuda ,  Atsushi Yoshida

IPC分类号： B24B21/04 ,  B24B9/06 ,  B24B21/00

CPC分类号： B24B21/002 ,  B24B9/065 ,  B24B21/004 ,  B24B21/006 ,  B24B21/008 ,  B24B21/20

摘要： The polishing apparatus has a polishing unit capable of polishing a peripheral portion of the substrate to form a right-angled cross section. The polishing apparatus includes: a substrate holder that holds and rotates the substrate; guide rollers that support a polishing tape; and a polishing head having a pressing member that presses an edge of the polishing tape against the peripheral portion of the substrate from above. The guide rollers are arranged such that the polishing tape extends parallel to a tangential direction of the substrate and a polishing surface of the polishing tape is parallel to a surface of the substrate. The substrate holder includes: a holding stage that holds the substrate; and a supporting stage that supports a lower surface of the peripheral portion of the substrate in its entirety. The supporting stage rotates in unison with the holding stage.

摘要翻译： 抛光装置具有能够抛光基板的周边部分以形成直角横截面的抛光单元。 抛光装置包括：保持和旋转衬底的衬底保持器; 支撑抛光带的导辊; 以及抛光头，其具有从上方将研磨带的边缘压靠在基板的周边部分的按压部件。 引导辊布置成使得抛光带平行于基板的切线方向延伸，并且抛光带的抛光表面平行于基板的表面。 基板保持器包括：保持基板的保持台; 以及支撑台，其整体地支撑基板的周边部分的下表面。 支撑台与保持台一致地旋转。

公开(公告)号：US07767472B2

公开(公告)日：2010-08-03

申请号：US11882398

申请日：2007-08-01

申请人： Atsushi Shigeta ,  Gen Toyota ,  Hiroyuki Yano ,  Kunio Oishi ,  Kenya Ito ,  Masayuki Nakanishi ,  Kenji Yamaguchi

发明人： Atsushi Shigeta ,  Gen Toyota ,  Hiroyuki Yano ,  Kunio Oishi ,  Kenya Ito ,  Masayuki Nakanishi ,  Kenji Yamaguchi

IPC分类号： H01L21/00

CPC分类号： B24B37/013 ,  B24B9/065

摘要： A substrate processing method is used to polish a substrate. The substrate processing method includes rotating a substrate 13 by a motor 12, polishing a first surface of a peripheral portion of the substrate 13 by pressing a polishing surface of a polishing mechanism 20 against the first surface, determining a polishing end point of the first surface by monitoring a polished state of the first surface, stopping the polishing according to the determining the polishing end point, determining a polishing time spent for the polishing, determining a polishing time for a second surface of the peripheral portion based on the polishing time of the first surface, and polishing the second surface for the determined polishing time.

摘要翻译： 基板处理方法用于抛光基板。 基板处理方法包括通过马达12旋转基板13，通过将研磨机构20的研磨面压在第一面上来研磨基板13的周边部的第一面，确定第一面的研磨终点 通过监测第一表面的抛光状态，根据确定抛光终点停止抛光，确定抛光所用的抛光时间，基于抛光时间确定周边部分的第二表面的抛光时间 第一表面，并抛光第二表面以确定抛光时间。

公开(公告)号：US20100136886A1

公开(公告)日：2010-06-03

申请号：US12699318

申请日：2010-02-03

申请人： Akihisa Hongo ,  Kenya Ito ,  Kenji Yamaguchi ,  Masayuki Nakanishi

发明人： Akihisa Hongo ,  Kenya Ito ,  Kenji Yamaguchi ,  Masayuki Nakanishi

IPC分类号： B24B49/04 ,  B24B49/12 ,  B24B21/18 ,  B24B9/02

CPC分类号： B24B37/02 ,  B24B9/065 ,  B24B21/002

摘要： The present invention relates to a polishing apparatus for removing surface roughness produced at a peripheral portion of a substrate, or for removing a film formed on a peripheral portion of a substrate. The polishing apparatus includes a housing for forming a polishing chamber therein, a rotational table for holding and rotating a substrate, a polishing tape supply mechanism for supplying a polishing tape into the polishing chamber and taking up the polishing tape which has been supplied to the polishing chamber, a polishing head for pressing the polishing tape against a bevel portion of the substrate, a liquid supply for supplying a liquid to a front surface and a rear surface of the substrate, and a regulation mechanism for making an internal pressure of the polishing chamber being set to be lower than an external pressure of the polishing chamber.

摘要翻译： 本发明涉及一种用于去除在基板的周边部分产生的表面粗糙度或用于去除形成在基板的周边部分上的膜的抛光装置。 抛光装置包括：用于在其中形成抛光室的壳体，用于保持和旋转基板的旋转台;抛光带供给机构，用于将研磨带供给到抛光室中并且吸收已经被供给到抛光的研磨带 用于将抛光带压靠在基板的斜面部分上的抛光头，用于将液体供应到基板的前表面和后表面的液体供应源，以及用于使抛光室的内部压力的调节机构 被设定为低于抛光室的外部压力。