摘要:
A connecting unit for establishing a connection with external connecting portions of an electronic device includes a base and a plurality of spiral contactors having a conductive layer and an auxiliary resilient layer. The top face, the bottom face, and both side faces of the conductive layer are completely surrounded by the auxiliary resilient layer. The conductive layer is composed of a material having a specific resistance lower than the specific resistance of the auxiliary resilient layer. The auxiliary resilient layer is composed of a material having a yield point and an elastic modulus higher than the yield point and the elastic modulus of the conductive layer.
摘要:
A connecting unit for establishing a connection with external connecting portions of an electronic device includes a base and a plurality of spiral contactors having a conductive layer and an auxiliary resilient layer. The top face, the bottom face, and both side faces of the conductive layer are completely surrounded by the auxiliary resilient layer. The conductive layer is composed of a material having a specific resistance lower than the specific resistance of the auxiliary resilient layer. The auxiliary resilient layer is composed of a material having a yield point and an elastic modulus higher than the yield point and the elastic modulus of the conductive layer.
摘要:
A connecting element includes a support member, a flexible substrate wrapped around the support member, and elastic contacts provided on the flexible substrate. A positioning hole is formed in the support member. A first positioning component is positioned and soldered on a metal layer formed on a motherboard, and a second positioning component is positioned and soldered on a metal layer formed on an electronic component. The first positioning component is inserted into the positioning hole in the connecting element, and the second positioning member is fitted to the first positioning component. Accordingly, the connecting element is positioned with respect to both the motherboard and the electronic component.
摘要:
A connecting element includes a support member, a flexible substrate wrapped around the support member, and elastic contacts provided on the flexible substrate. A positioning hole is formed in the support member. A first positioning component is positioned and soldered on a metal layer formed on a motherboard, and a second positioning component is positioned and soldered on a metal layer formed on an electronic component. The first positioning component is inserted into the positioning hole in the connecting element, and the second positioning member is fitted to the first positioning component. Accordingly, the connecting element is positioned with respect to both the motherboard and the electronic component.
摘要:
To provide a contact, formed in an amorphous state, having better spring properties as compared to conventional one; a method for manufacturing the contact; a connection device including the contact; and a method for manufacturing the connection device.The present invention provides a contact comprising an elastically deforming portion that includes at least one amorphous part. The elastically deforming portion includes an auxiliary elastic member 41 made of, for example, NiP (a P content of 15 atomic percent). In this case, an amorphous phase 50 is predominant in the auxiliary elastic member 41. This enhances spring properties such as a yield stress.
摘要:
A connection electrode that is formed of solder on an electronic component side and a tip portion of an elastic contact each other at a contact portion. Regarding the elastic contact, a resistive layer is formed in the tip portion, and the tip portion is placed in a clearance of an induction coil. When a predetermined high-frequency current is passed through the induction coil, electromagnetic induction causes the resistive layer to generate heat. Solder that forms the connection electrode is melt, and flows onto the tip portion of the elastic contact. Thus, the tip portion of the elastic contact and the connection electrode can be strongly bonded together at the contact portion that is a single point therebetween.
摘要:
To provide a contact, formed in an amorphous state, having better spring properties as compared to conventional one; a method for manufacturing the contact; a connection device including the contact; and a method for manufacturing the connection device.The present invention provides a contact comprising an elastically deforming portion that includes at least one amorphous part. The elastically deforming portion includes an auxiliary elastic member 41 made of, for example, NiP (a P content of 15 atomic percent). In this case, an amorphous phase 50 is predominant in the auxiliary elastic member 41. This enhances spring properties such as a yield stress
摘要:
To provide a contact, formed in an amorphous state, having better spring properties as compared to conventional one; a method for manufacturing the contact; a connection device including the contact; and a method for manufacturing the connection device.The present invention provides a contact comprising an elastically deforming portion that includes at least one amorphous part. The elastically deforming portion includes an auxiliary elastic member 41 made of, for example, NiP (a P content of 15 atomic percent). In this case, an amorphous phase 50 is predominant in the auxiliary elastic member 41. This enhances spring properties such as a yield stress.
摘要:
A laminated gas sensor element extending in a longitudinal direction and having a detection part including a plate-shaped element body which has a heater layer having an embedded resistance heating body and a detection layer laminated to the heater layer and having a vertical surface along a lamination direction and a horizontal surface perpendicular to the lamination direction; and a porous protective layer coating the vertical surface and the horizontal surface of the element body constituting the detection part, wherein a thickness of the protective layer formed on the vertical surface is thicker than a thickness of the protective layer formed on the horizontal surface.
摘要:
A connector for connecting with an external terminal on an electronic component includes a spiral contact which is wound a plurality of turns. The spiral contact has a single projection that projects outwardly toward an outer circumference of the turns. When the spiral contact is in contact with the external terminal, the projection of the spiral contact comes into contact with the external terminal.