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    POWER AMPLIFIER AND RADIO COMMUNICATION DEVICE USING THE AMPLIFIER
    5.
    发明申请
    POWER AMPLIFIER AND RADIO COMMUNICATION DEVICE USING THE AMPLIFIER 失效
    功率放大器和无线电通信设备使用放大器

    公开(公告)号：US20060033564A1

    公开(公告)日：2006-02-16

    申请号：US11258266

    申请日：2005-10-26

    申请人： Yuta Araki ,  Hiroyuki Kayano ,  Keiichi Yamaguchi

    发明人： Yuta Araki ,  Hiroyuki Kayano ,  Keiichi Yamaguchi

    IPC分类号： H03F3/68

    CPC分类号： H03F1/0277 ,  H03F3/68 ,  H03F2200/294 ,  H03F2200/372 ,  H03F2200/429 ,  H05K1/0265 ,  H05K1/165 ,  H05K2201/09254 ,  H05K2201/09263

    摘要： A power amplifier includes amplifier elements to amplify input signals of different frequencies. The amplifier also includes a power supply circuit that includes a common power supply path including an end connected to a power supply input terminal connected to a DC power supply. The amplifier further includes individual power supply paths each including an end connected to the other end of the common power supply path, and the other end connected to the main electrode of a corresponding one of the amplifier elements. The individual power supply paths have different impedances.

    摘要翻译： 功率放大器包括用于放大不同频率的输入信号的放大器元件。 放大器还包括电源电路，其包括公共电源路径，其包括连接到连接到DC电源的电源输入端的端部。 放大器还包括单独的电源路径，每个电源路径包括连接到公共电源路径的另一端的端部，另一端连接到相应的一个放大器元件的主电极。 各个电源路径具有不同的阻抗。

    Symmetric microwave filter and microwave integrated circuit merging the same
    6.
    发明授权
    Symmetric microwave filter and microwave integrated circuit merging the same 失效
    对称微波滤波器和微波集成电路合并相同

    公开(公告)号：US06876270B2

    公开(公告)日：2005-04-05

    申请号：US10397258

    申请日：2003-03-27

    申请人： Naoko Ono ,  Keiichi Yamaguchi

    发明人： Naoko Ono ,  Keiichi Yamaguchi

    IPC分类号： H01L27/04 ,  H01L21/822 ,  H01P1/201 ,  H03F3/60 ,  H03H7/06 ,  H01P5/00

    CPC分类号： H01P1/2013

    摘要： A microwave filter is disposed on a substrate. The microwave filter is configured to connect a first microwave transmission line to a second microwave transmission line, configured such that a signal propagates from the first microwave transmission line to the second microwave transmission line. The microwave filter encompasses a highpass component of filter disposed in a symmetrical configuration with respect to a median plane placed perpendicular to the surface of the substrate, including the central axis of the first and second microwave transmission lines; and a lowpass component of filter connected parallel with the highpass component of filter, the lowpass component of filter being disposed in a symmetrical configuration with respect to the median plane.

    摘要翻译： 微波滤波器设置在基板上。 微波滤波器被配置为将第一微波传输线连接到第二微波传输线，其被配置为使得信号从第一微波传输线传播到第二微波传输线。 微波滤波器包括相对于垂直于衬底表面放置的中间平面的对称构型布置的滤波器的高通分量，包括第一和第二微波传输线的中心轴线; 以及与滤波器的高通分量并联连接的滤波器的低通分量，滤波器的低通分量相对于中间平面布置成对称的结构。

    Microwave transmitter/receiver module
    7.
    发明授权
    Microwave transmitter/receiver module 失效
    微波发射器/接收器模块

    公开(公告)号：US06263193B1

    公开(公告)日：2001-07-17

    申请号：US09044911

    申请日：1998-03-20

    申请人： Yuji Iseki ,  Keiichi Yamaguchi ,  Mitsuo Konno

    发明人： Yuji Iseki ,  Keiichi Yamaguchi ,  Mitsuo Konno

    IPC分类号： H04B138

    CPC分类号： H01L23/552 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/49175 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/15155 ,  H01L2924/1616 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01Q21/0025 ,  H01Q23/00 ,  H04B1/38 ,  H01L2924/00014

    摘要： A microwave transmitter/receiver module has a package that includes a high-frequency circuit board and an electromagnetically narrowed space. A semiconductor chip is mounted on the circuit board and is contained in the electromagnetically narrowed space. The electromagnetically narrowed space has a cutoff frequency that is higher than a carrier frequency for microwave communication. A receiver antenna pattern is formed on the top surface of the package and is electromagnetically connected to the semiconductor chip through a first slot. A transmitter antenna pattern is formed on the top surface of the package at a different position from the receiver antenna pattern and is electromagnetically connected to the semiconductor chip through a second slot. Since the antenna patterns are on the top surface of the package, the proper performance thereof is secured and the package is compact.

    摘要翻译： 微波发射器/接收器模块具有包括高频电路板和电磁狭窄空间的封装。 半导体芯片安装在电路板上并被包含在电磁变窄的空间中。 电磁变窄的空间具有高于微波通信的载波频率的截止频率。 接收器天线图案形成在封装的顶表面上，并且通过第一槽与半导体芯片电磁连接。 发射器天线图案在与接收器天线图案不同的位置处形成在封装的顶表面上，并且通过第二槽电磁连接到半导体芯片。 由于天线图案位于封装的顶表面上，因此确保其适当的性能并且封装是紧凑的。