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    High-impedance substrate, antenna device and mobile radio device
    3.
    发明授权
    High-impedance substrate, antenna device and mobile radio device 失效
    高阻抗基板，天线装置和移动无线电设备

    公开(公告)号：US07623087B2

    公开(公告)日：2009-11-24

    申请号：US11950525

    申请日：2007-12-05

    申请人： Makoto Higaki ,  Kazuhiro Inoue ,  Shuichi Sekine ,  Akihiro Tsujimura

    发明人： Makoto Higaki ,  Kazuhiro Inoue ,  Shuichi Sekine ,  Akihiro Tsujimura

    IPC分类号： H01Q15/02 ,  H01Q15/24

    CPC分类号： H01Q15/0066 ,  H01Q1/243 ,  H01Q15/008

    摘要： There is provided with a high-impedance substrate including: a finite ground plane; a plurality of metal plates arranged at a predetermined height from the finite ground plane and in a matrix pattern such that respective faces thereof are approximately parallel to the finite ground plane; and a plurality of linear conductive elements configured to connect the plurality of metal plates to the finite ground plane and, wherein outer metal plates arranged at an outermost periphery among the plurality of metal plates are connected with the linear conductive elements at edges of the outer metal plates.

    摘要翻译： 设置有高阻抗基板，包括：有限接地平面; 多个金属板，其布置在与所述有限接地平面相对的预定高度处并以矩阵图形布置，使得其各个面大致平行于所述有限接地平面; 以及多个线性导电元件，其被配置为将所述多个金属板连接到所述有限接地平面，并且其中布置在所述多个金属板中的最外周的外部金属板在所述外部金属的边缘处与所述线性导电元件连接 盘子

    ANTENNA APPARATUS
    4.
    发明申请
    ANTENNA APPARATUS 失效
    天线装置

    公开(公告)号：US20090040112A1

    公开(公告)日：2009-02-12

    申请号：US12170733

    申请日：2008-07-10

    申请人： Shuichi SEKINE ,  Kazuhiro Inoue ,  Makoto Higaki ,  Yukako Tsutsumi ,  Akihiro Tsujimura

    发明人： Shuichi SEKINE ,  Kazuhiro Inoue ,  Makoto Higaki ,  Yukako Tsutsumi ,  Akihiro Tsujimura

    IPC分类号： H01Q9/04

    CPC分类号： H01Q15/008 ,  H01Q1/38 ,  H01Q9/16

    摘要： There is provided with an antenna apparatus, including: a finite ground plate; a plurality of conductor plates arranged along and on both sides of a first gap line or a second gap line that intersect with the first gap line; a plurality of first linear conductive elements configured to connect the finite ground plate with each of the conductor plates; and an antenna element configured to have second and third linear conductive elements arranged in the first gap line and a feeding point that is placed between adjacent ends of the second and third linear conductive elements for supplying electric power from the ends, wherein the feeding point is positioned in an intersection area of the first gap line and the second gap line.

    摘要翻译： 设有天线装置，包括：有限接地板; 沿着与第一间隙线相交的第一间隙线或第二间隙线的两侧布置的多个导体板; 多个第一线性导电元件，其被配置为将所述有限接地板与每个所述导体板连接; 以及天线元件，其被配置为具有布置在所述第一间隙线中的第二和第三线性导电元件和放置在所述第二和第三线性导电元件的相邻端之间的馈电点，用于从所述端部提供电力，其中所述馈电点为 位于第一间隙线和第二间隙线的交叉区域中。

    HIGH-IMPEDANCE SUBSTRATE, ANTENNA DEVICE AND MOBILE RADIO DEVICE
    5.
    发明申请
    HIGH-IMPEDANCE SUBSTRATE, ANTENNA DEVICE AND MOBILE RADIO DEVICE 失效
    高阻抗衬底，天线器件和移动无线电器件

    公开(公告)号：US20080150825A1

    公开(公告)日：2008-06-26

    申请号：US11950525

    申请日：2007-12-05

    申请人： Makoto Higaki ,  Kazuhiro Inoue ,  Shuichi Sekine ,  Akihiro Tsujimura

    发明人： Makoto Higaki ,  Kazuhiro Inoue ,  Shuichi Sekine ,  Akihiro Tsujimura

    IPC分类号： H01Q1/50 ,  H03H7/01

    CPC分类号： H01Q15/0066 ,  H01Q1/243 ,  H01Q15/008

    摘要： There is provided with a high-impedance substrate including: a finite ground plane; a plurality of metal plates arranged at a predetermined height from the finite ground plane and in a matrix pattern such that respective faces thereof are approximately parallel to the finite ground plane; and a plurality of linear conductive elements configured to connect the plurality of metal plates to the finite ground plane and, wherein outer metal plates arranged at an outermost periphery among the plurality of metal plates are connected with the linear conductive elements at edges of the outer metal plates.

    摘要翻译： 设置有高阻抗基板，包括：有限接地平面; 多个金属板，其布置在与所述有限接地平面相对的预定高度处并以矩阵图形布置，使得其各个面大致平行于所述有限接地平面; 以及多个线性导电元件，其被配置为将所述多个金属板连接到所述有限接地平面，并且其中布置在所述多个金属板中的最外周的外部金属板在所述外部金属的边缘处与所述线性导电元件连接 盘子

    Antenna apparatus
    6.
    发明授权
    Antenna apparatus 失效
    天线装置

    公开(公告)号：US07760154B2

    公开(公告)日：2010-07-20

    申请号：US12170733

    申请日：2008-07-10

    申请人： Shuichi Sekine ,  Kazuhiro Inoue ,  Makoto Higaki ,  Yukako Tsutsumi ,  Akihiro Tsujimura

    发明人： Shuichi Sekine ,  Kazuhiro Inoue ,  Makoto Higaki ,  Yukako Tsutsumi ,  Akihiro Tsujimura

    IPC分类号： H01Q9/16 ,  H01Q15/02 ,  H01Q19/10

    CPC分类号： H01Q15/008 ,  H01Q1/38 ,  H01Q9/16

    摘要： There is provided with an antenna apparatus, including: a finite ground plate; a plurality of conductor plates arranged along and on both sides of a first gap line or a second gap line that intersect with the first gap line; a plurality of first linear conductive elements configured to connect the finite ground plate with each of the conductor plates; and an antenna element configured to have second and third linear conductive elements arranged in the first gap line and a feeding point that is placed between adjacent ends of the second and third linear conductive elements for supplying electric power from the ends, wherein the feeding point is positioned in an intersection area of the first gap line and the second gap line.

    摘要翻译： 设有天线装置，包括：有限接地板; 沿着与第一间隙线相交的第一间隙线或第二间隙线的两侧布置的多个导体板; 多个第一线性导电元件，其被配置为将所述有限接地板与每个所述导体板连接; 以及天线元件，其被配置为具有布置在所述第一间隙线中的第二和第三线性导电元件和放置在所述第二和第三线性导电元件的相邻端之间的馈电点，用于从所述端部提供电力，其中所述馈电点为 位于第一间隙线和第二间隙线的交叉区域中。

    Atmospheric pressure plasma, generating method, plasma processing method and component mounting method using same, and device using these methods
    7.
    发明授权
    Atmospheric pressure plasma, generating method, plasma processing method and component mounting method using same, and device using these methods 有权
    大气压等离子体，生成方法，等离子体处理方法和使用其的部件安装方法以及使用这些方法的装置

    公开(公告)号：US08399794B2

    公开(公告)日：2013-03-19

    申请号：US12299174

    申请日：2007-05-28

    申请人： Hiroyuki Tsuji ,  Kazuhiro Inoue

    发明人： Hiroyuki Tsuji ,  Kazuhiro Inoue

    IPC分类号： B23K10/00

    CPC分类号： H01J37/32825 ,  H01J37/32366 ,  H05H1/30 ,  H05H1/42 ,  H05H1/46 ,  H05H2001/4667

    摘要： A first inert gas (5) is supplied into a reaction space (1) and a high-frequency power supply (4) applies a high-frequency electric field so that a primary plasma (6) composed of the first inert gas which has been made into the plasma is ejected from the reaction space. A mixed gas area (10) in which a mixed gas (8) having a second inert gas (12) as a main ingredient and a proper amount of a reactive gas (13) mixed is formed. The primary plasma collides into the mixed gas area to generate a secondary plasma (11) composed of the mixed gas which has been made into the plasma, and the secondary plasma is sprayed on a processed object (S) to carry out a plasma processing. Accordingly, the plasma processing is carried out in a wide range by an atmospheric pressure plasma generated by a small input power.

    摘要翻译： 将第一惰性气体（5）供应到反应空间（1）中，并且高频电源（4）施加高频电场，使得由已经被第一惰性气体组成的初级等离子体（6） 制成等离子体的物质从反应空间喷出。 形成混合气体区域（10），其中混合有第二惰性气体（12）作为主要成分的混合气体（8）和适量的反应性气体（13）混合。 初级等离子体与混合气体区域碰撞，生成由等离子体制成的混合气体构成的二次等离子体（11），将二次等离子体喷射到被处理物（S）上进行等离子体处理。 因此，通过由小的输入功率产生的大气压等离子体等离子体处理在宽范围内进行。

    LED MODULE
    9.
    发明申请
    LED MODULE 有权
    LED模块

    公开(公告)号：US20120132931A1

    公开(公告)日：2012-05-31

    申请号：US13053525

    申请日：2011-03-22

    申请人： Kazuhiro Inoue ,  Kazuhisa Iwashita ,  Teruo Takeuchi ,  Gen Watari ,  Tetsuro Komatsu ,  Tatsuo Tonedachi

    发明人： Kazuhiro Inoue ,  Kazuhisa Iwashita ,  Teruo Takeuchi ,  Gen Watari ,  Tetsuro Komatsu ,  Tatsuo Tonedachi

    IPC分类号： H01L33/08 ,  H01L33/60

    CPC分类号： H01L33/486 ,  H01L24/73 ,  H01L24/97 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

    摘要： According to one embodiment, an LED module includes a substrate, an interconnect layer, a light emitting diode (LED) package, and a reflection member. The interconnect layer is provided on the substrate. The LED package is mounted on the interconnect layer. The reflection member is provided on a region in the substrate where the LED package is not mounted and has a property of reflecting light emitted from the LED package. The LED package includes a first lead frame, a second lead frame, an LED chip, and a resin body. The first lead frame and the second lead frame are arranged apart from each other on the same plane. The LED chip is provided above the first lead frame and the second lead frame, with one terminal connected to the first lead frame and one other terminal connected to the second lead frame. The resin body covers the LED chip, covers an upper surface, a part of a lower surface, and a part of an end surface of each of the first lead frame and the second lead frame, and exposes a remaining part of the lower surface and a remaining part of the end surface.

    摘要翻译： 根据一个实施例，LED模块包括衬底，互连层，发光二极管（LED）封装和反射构件。 互连层设置在基板上。 LED封装安装在互连层上。 反射构件设置在基板中未安装LED封装的区域上，具有反射从LED封装件发出的光的性质。 LED封装包括第一引线框架，第二引线框架，LED芯片和树脂体。 第一引线框架和第二引线框架在同一平面上彼此分开布置。 LED芯片设置在第一引线框架和第二引线框架的上方，其中一个端子连接到第一引线框架，另一个端子连接到第二引线框架。 所述树脂体覆盖所述LED芯片，覆盖所述第一引线框架和所述第二引线框架的上表面，下表面的一部分和端面的一部分，并且暴露所述下表面的剩余部分， 端面的剩余部分。