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    OPTICAL ASSEMBLY HAVING A DISPLAY PANEL AND METHODS OF MAKING AND DISASSEMBLING SAME
    1.
    发明申请
    OPTICAL ASSEMBLY HAVING A DISPLAY PANEL AND METHODS OF MAKING AND DISASSEMBLING SAME 审中-公开
    具有显示面板的光学组件及其制造和拆卸方法

    公开(公告)号：US20130011683A1

    公开(公告)日：2013-01-10

    申请号：US13255555

    申请日：2011-03-24

    申请人： Stanley C. Busman ,  Sunil K. Pillalamarri ,  Thu-Van T. Tran ,  Christopher J. Campbell

    发明人： Stanley C. Busman ,  Sunil K. Pillalamarri ,  Thu-Van T. Tran ,  Christopher J. Campbell

    IPC分类号： B32B27/36 ,  C08K5/36 ,  C08K5/20 ,  C08K5/21 ,  C08L33/08 ,  C08K5/00

    CPC分类号： C09D133/04 ,  C08K3/36 ,  C08K5/0016 ,  C08K5/06 ,  Y10T428/31551 ,  Y10T428/31786

    摘要： An optically clear adhesive layer includes a liquid optically clear adhesive having a viscosity of less than about 20 Pa·s at a shear rate of 1 sec−1 and a thixotrope. The optically clear adhesive layer has a haze of about 2% or less, a viscosity of between about 2 and about 30 Pa·s at a shear rate of 10 sec−1, a displacement creep of about 0.2 radians or less when a stress of 10 Pa is applied for about 2 minutes and a recovery time of about 60 seconds or less to reach a delta of 35 degrees after a torque of about 100 microN·m is applied for about 60 seconds at a frequency of 1 Hz and immediately followed by a torque of 80 microN·m at a frequency of 1 Hz. The adhesive layer can be used in an optical assembly to bond a display panel to a substantially transparent substrate. The adhesive layer provides a cleavage strength between glass substrates of about 15 N/mm or less such that the optical assembly can be disassembled with little or no damage to the display panel or the substrate. Optical assemblies and methods of making the optical assembly are also disclosed. The optical assembly may be used in an optical device such as a handheld device, a television, a computer monitor, a laptop display, or a digital sign.

    摘要翻译： 光学透明的粘合剂层包括在1秒-1的剪切速率下具有小于约20Pa·s的粘度的液体透光粘合剂和触变剂。 光学透明粘合剂层在10秒-1的剪切速率下具有约2％或更小的雾度，约2至约30Pa·s的粘度，约0.2弧度或更小的位移蠕变，当应力 10Pa的施加约2分钟，恢复时间为约60秒以下，达到35度的角度，在约100微N·m的转矩以1Hz的频率施加约60秒后，紧随其后 在1Hz频率下的转矩为80 microN·m。 粘合剂层可以用于光学组件中，以将显示面板粘合到基本透明的基底上。 粘合剂层在玻璃基板之间提供约15N / mm或更小的切割强度，使得光学组件可以很少或没有损坏显示面板或基板而被拆卸。 还公开了光学组件和制造光学组件的方法。 光学组件可以用于诸如手持设备，电视机，计算机显示器，膝上型显示器或数字标牌的光学设备中。

    OPTICAL ASSEMBLIES INCLUDING STRESS-RELIEVING OPTICAL ADHESIVES AND METHODS OF MAKING SAME
    2.
    发明申请
    OPTICAL ASSEMBLIES INCLUDING STRESS-RELIEVING OPTICAL ADHESIVES AND METHODS OF MAKING SAME 审中-公开
    包含应力消除光学粘合剂的光学组件及其制造方法

    公开(公告)号：US20130136874A1

    公开(公告)日：2013-05-30

    申请号：US13813183

    申请日：2011-08-15

    申请人： Jianhui Xia ,  Sunil K. Pillalamarri ,  Stanley C. Busman ,  Albert I. Everaerts

    发明人： Jianhui Xia ,  Sunil K. Pillalamarri ,  Stanley C. Busman ,  Albert I. Everaerts

    IPC分类号： C09J4/00 ,  C09J7/02 ,  G02F1/1333

    CPC分类号： C09J4/00 ,  C09J7/385 ,  C09J2203/318 ,  C09J2205/31 ,  G02B1/04 ,  G02F1/1333 ,  G02F2202/28 ,  Y10T428/1059 ,  Y10T428/2891 ,  Y10T428/31855 ,  C08L33/08 ,  C08L33/10

    摘要： An optical assembly is provided that includes a display panel, a substantially transparent substrate and an adhesive composition. The adhesive composition includes the reaction product of a miscible blend that includes one or more (meth)acrylate monomer, one or more multifunctional (meth)acrylate oligomer and one or more free-radical generating photoinitiator. The one or more multifunctional (meth)acrylic oligomer includes an acrylic oligomer derived from (meth)acrylate monomers that is not substantially bonded to the adhesive composition after it has been cured by exposure to actinic radiation. Also provide is a method of making the optical assembly and a tape that includes a backing and the provided adhesive composition that has been cured.

    摘要翻译： 提供了一种光学组件，其包括显示面板，基本透明的基板和粘合剂组合物。 粘合剂组合物包括可混溶共混物的反应产物，其包含一种或多种（甲基）丙烯酸酯单体，一种或多种多官能（甲基）丙烯酸酯低聚物和一种或多种产生自由基的光引发剂。 一种或多种多官能（甲基）丙烯酸低聚物包括衍生自（甲基）丙烯酸酯单体的丙烯酸低聚物，其通过暴露于光化辐射固化后基本上不粘合到粘合剂组合物上。 还提供了制造光学组件和包括背衬和已经固化的所提供的粘合剂组合物的带的方法。

    High-temperature spin-on temporary bonding compositions
    4.
    发明授权
    High-temperature spin-on temporary bonding compositions 有权
    高温旋涂临时粘结组合物

    公开(公告)号：US07935780B2

    公开(公告)日：2011-05-03

    申请号：US12146148

    申请日：2008-06-25

    申请人： Wenbin Hong ,  Sunil K. Pillalamarri

    发明人： Wenbin Hong ,  Sunil K. Pillalamarri

    IPC分类号： C08G69/26 ,  C08G77/04 ,  C08G77/26

    CPC分类号： H01L21/6835 ,  C09J5/06 ,  C09J2203/326 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2924/30105 ,  Y10T156/11 ,  Y10T428/24355

    摘要： New compositions and methods of using those compositions as bonding compositions are provided. The compositions are preferably thermoplastic and comprise imides, amideimides, and/or amideimide-siloxanes (either in polymeric or oligomeric form) dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened to allow the wafers to slide apart at the appropriate stage in the fabrication process.

    摘要翻译： 提供了使用这些组合物作为粘合组合物的新组合物和方法。 组合物优选是热塑性的，并且包括分散或溶解在溶剂体系中的酰亚胺，酰胺酰亚胺和/或酰胺酰亚胺 - 硅氧烷（以聚合或低聚形式），并且可用于将活性晶片结合到载体晶片或基底以辅助 在后续处理和处理期间保护活性晶片及其活性位点。 组合物形成化学和耐热的粘合层，但是也可以软化以使晶片在制造过程中的适当阶段分开。

    HIGH-TEMPERATURE SPIN-ON TEMPORARY BONDING COMPOSITIONS
    6.
    发明申请
    HIGH-TEMPERATURE SPIN-ON TEMPORARY BONDING COMPOSITIONS 有权
    高温旋转临时粘结组合物

    公开(公告)号：US20110065257A1

    公开(公告)日：2011-03-17

    申请号：US12949019

    申请日：2010-11-18

    申请人： Wenbin Hong ,  Sunil K. Pillalamarri

    发明人： Wenbin Hong ,  Sunil K. Pillalamarri

    IPC分类号： H01L21/18

    CPC分类号： H01L21/6835 ,  C09J5/06 ,  C09J2203/326 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2924/30105 ,  Y10T156/11 ,  Y10T428/24355

    摘要： New compositions and methods of using those compositions as bonding compositions are provided. The compositions are preferably thermoplastic and comprise imides, amideimides, and/or amideimide-siloxanes (either in polymeric or oligomeric form) dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened to allow the wafers to slide apart at the appropriate stage in the fabrication process.

    摘要翻译： 提供了使用这些组合物作为粘合组合物的新组合物和方法。 组合物优选是热塑性的，并且包括分散或溶解在溶剂体系中的酰亚胺，酰胺酰亚胺和/或酰胺酰亚胺 - 硅氧烷（以聚合或低聚形式），并且可用于将活性晶片结合到载体晶片或基底以辅助 在后续处理和处理期间保护活性晶片及其活性位点。 组合物形成化学和耐热的粘合层，但是也可以软化以使晶片在制造过程中的适当阶段分开。

    HIGH-TEMPERATURE SPIN-ON TEMPORARY BONDING COMPOSITIONS
    9.
    发明申请
    HIGH-TEMPERATURE SPIN-ON TEMPORARY BONDING COMPOSITIONS 有权
    高温旋转临时粘结组合物

    公开(公告)号：US20090038750A1

    公开(公告)日：2009-02-12

    申请号：US12146148

    申请日：2008-06-25

    申请人： Wenbin Hong ,  Sunil K. Pillalamarri

    发明人： Wenbin Hong ,  Sunil K. Pillalamarri

    IPC分类号： B32B38/10 ,  D06N7/04 ,  C08G77/14 ,  C08G73/10

    CPC分类号： H01L21/6835 ,  C09J5/06 ,  C09J2203/326 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2924/30105 ,  Y10T156/11 ,  Y10T428/24355

    摘要： New compositions and methods of using those compositions as bonding compositions are provided. The compositions are preferably thermoplastic and comprise imides, amideimides, and/or amideimide-siloxanes (either in polymeric or oligomeric form) dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened to allow the wafers to slide apart at the appropriate stage in the fabrication process.

    摘要翻译： 提供了使用这些组合物作为粘合组合物的新组合物和方法。 组合物优选是热塑性的，并且包括分散或溶解在溶剂体系中的酰亚胺，酰胺酰亚胺和/或酰胺酰亚胺 - 硅氧烷（以聚合或低聚形式），并且可用于将活性晶片结合到载体晶片或基底以辅助 在后续处理和处理期间保护活性晶片及其活性位点。 组合物形成化学和耐热的粘合层，但是也可以软化以使晶片在制造过程中的适当阶段分开。

    THERMALLY DECOMPOSABLE SPIN-ON BONDING COMPOSITIONS FOR TEMPORARY WAFER BONDING
    10.
    发明申请
    THERMALLY DECOMPOSABLE SPIN-ON BONDING COMPOSITIONS FOR TEMPORARY WAFER BONDING 失效
    用于临时波形结合的热分解旋转粘合组合物

    公开(公告)号：US20080173970A1

    公开(公告)日：2008-07-24

    申请号：US11866908

    申请日：2007-10-03

    申请人： Sunil K. Pillalamarri

    发明人： Sunil K. Pillalamarri

    IPC分类号： H01L21/46 ,  H01L27/00

    CPC分类号： C09J5/06 ,  C08G73/0233 ,  C09J2205/302 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2924/30105

    摘要： New spin-on, bonding compositions and methods of using those compositions are provided. The cured bonding compositions comprise a crosslinked oxazoline (either crosslinked with another oxazoline or with a crosslinking agent), and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can be thermally decomposed at 285° C. or higher to allow the wafers to slide apart at the appropriate stage in the fabrication process.

    摘要翻译： 提供了新的旋涂，粘合组合物和使用这些组合物的方法。 固化的粘合组合物包含交联的恶唑啉（与另一种恶唑啉交联或与交联剂交联），并且可用于将活性晶片结合到载体晶片或基底，以有助于在后续处理期间保护活性晶片及其活性位点 和处理。 组合物形成化学和耐热性的粘合层，但是可以在285℃或更高温度下热分解，以允许晶片在制造过程中的适当阶段滑动分开。