摘要:
A static random access memory (SRAM) cell having increased cell capacitance at the storage nodes utilizes a capacitive structure. The capacitive structure includes a dielectric material between polysilicon conductive lines and tungsten local interconnects. The polysilicon plates are each connected to drains of lateral transistors associated with the SRAM cell. A dielectric material such as silicon dioxide may be deposited between the local interconnect and polysilicon conductive lines. The capacitor structures are provided between first and second N-channel pull down transistors associated with the SRAM cell.
摘要:
A memory device uses a reduced word line voltage during READ operations. The memory device includes a memory cell and a pass transistor for accessing the cell. The cell includes a storage node coupled to a pull-down transistor having substantially the same conductivity as the pass transistor. A drive circuit generates a reduced word line voltage to activate the pass transistor during a READ operation. The reduced word line voltage has a magnitude less than the magnitude of the bias voltage used to activate the pull-down transistor.
摘要:
A method of forming minimal gaps or spaces in conductive lines pattern for increasing the density of integrated circuits by first forming an opening in an insulating layer overlying the conductive line by conventional optical lithography, followed by forming sidewalls in the opening to create a reduced opening, and using the sidewalls as a mask to remove, preferably by etching, a portion of the conductive line pattern substantially equal in size to the reduced opening.
摘要:
A method of forming field isolation in a semiconductor substrate, such as shallow oxide trenches, for isolation of FET transistors, including complementary FETs such as CMOS, with selected sections of said trenches extending above the substrate and being coplanar with the upper surface of subsequently formed polysilicon gates. An etch protective layer is used during the formation and the filling of the trench openings so that the top of the trenches are coplanar with upper surface of the etch protective layer. Selected sections of the trenches are masked and protected prior to planarization of the non-masked trenches to the bottom edge of the etch protective layer. After deposition and planarization of the poly, the upper surface of a deposited polysilicon layer for forming polysilicon gates of FET transistors is coplanar and self-aligned with the upwardly extending selected sections of the field isolation trenches.
摘要:
A method of forming minimal gaps or spaces in a polysilicon conductive lines pattern for increasing the density of integrated circuits by converting an area of the size of the desired gap or space in the polysilicon to silicon oxide, followed by removing the silicon oxide. The preferred method is to selectively ion implant oxygen into the polysilicon and annealing to convert the oxygen implanted polysilicon to silicon oxide. As an alternative method, an opening in an insulating layer overlying the conductive line is first formed by conventional optical lithography, followed by forming sidewalls in the opening to create a reduced opening and using the sidewalls as a mask to blanket implant oxygen through the reduced opening and into the exposed polysilicon conductive line. After annealing, the implanted polysilicon converted to silicon oxide and removed to form a gap or space in the polysilicon conductive line pattern substantially equal in size to the reduced opening. Instead of blanket implanting with oxygen, thermal oxidation can be used to convert the exposed polysilicon to silicon oxide.
摘要:
A method for fabricating a field effect transistor (FET) in and on a semiconductor substrate with local interconnects to permit the formation of minimal insulating space between polysilicon gate and the local interconnects by fabricating the source and drain of the FET and the local interconnects prior to forming the gate of the FET. A portion of an insulating layer between the source and drain is removed prior to forming the gate. Preferably, an etch stop layer on the semiconductor substrate underlying the insulating layer is used in the method.
摘要:
A method and the resulting device to permit the formation of minimal insulating space between polysilicon gates by forming an insulating layer over the polysilicon gates and protecting selected ones of the gates and the insulating layer with an etch barrier so that the opening for local interconnect metallization can be misaligned and the selected gates will be protected by its etch barrier and not be exposed to the opening. Further, local interconnect conductive material can pass over a gate or unrelated resistor without shorting the gate/resistor.
摘要:
A method for fabricating a field effect transistor (FET) in and on a semiconductor substrate with local interconnects to permit the formation of minimal space between gate and the local interconnects by fabricating the source and drain of the FET and the local interconnects prior to forming the gate of the FET.
摘要:
A method for fabricating a field effect transistor (FET) in and on a semiconductor substrate with local interconnects to permit the formation of minimal space between gate and the local interconnects by fabricating the source and drain of the FET and the local interconnects prior to forming the gate of the FET.
摘要:
The present invention discloses a differential logic circuit and sensing method providing differential sensing with greater speed and higher density than prior art techniques. One or more input signals are provided to a logic array and two output signals are produced from the logic array wherein one output signal of the logic array is a bit-line and one output signal of the logic array is a bit-bar-line as a reference signal, wherein both signals are provided as input signals to a differential sense amplifier having a binary output signal. The bit-line and the bit-bar-line are precharged to the same voltage level and a controlled input source-grounded transistor having less than fill drive strength is coupled to the bit-bar-line. A source-grounded transistor is coupled to each input signal of the logic array and is programmable to the bit-line by coupling the drain of the source-grounded transistor to the bit-line. A corresponding sourceless transistor, having a gate and a drain, but no source, is coupled to each input signal of the logic array and is programmable to the bit-bar-line by coupling the drain of the sourceless transistor to the bit-bar-line. The source-grounded transistors and the corresponding sourceless transistors are programmed identically providing substantially the same capacitance load on the bit-line and the bit-bar-line.