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26 条记录 (耗时 0.027 秒)

    Charge transfer salts and uses thereof
    1.
    发明授权
    Charge transfer salts and uses thereof 失效
    电荷转移盐及其用途

    公开(公告)号：US5179467A

    公开(公告)日：1993-01-12

    申请号：US583888

    申请日：1990-09-17

    申请人： Stephen L. Buchwalter ,  Martin J. Goldberg ,  Revathi Iyengar ,  Terrence R. O'Toole ,  Alfred Viehbeck

    发明人： Stephen L. Buchwalter ,  Martin J. Goldberg ,  Revathi Iyengar ,  Terrence R. O'Toole ,  Alfred Viehbeck

    IPC分类号： C09K9/02 ,  H01B1/12

    CPC分类号： H01B1/121 ,  C09K9/02 ,  H01B1/12

    摘要： An electrochemical color change cell incorporating as a color changing agent intramolecular charge transfer salt or an intermolecular charge transfer salt. The intermolecular charge transfer salts and the intramolecular charge transfer salts have a plurality of oxidation states and a wide variation in color change. The intermolecular and intramolecular charge transfer salts preferably contain a violene moiety and a moiety having a carbonyl group conjugated to an aromatic moiety. The intramolecular charge transfer salts have a stable covalent radical-anion/radical-cation configuration. The intermolecular charge transfer salts have a stable ionic radical-anion/radical-cation configuration.

    摘要翻译： 一种结合作为变色剂分子内电荷转移盐或分子内电荷转移盐的电化学变色细胞。 分子间电荷转移盐和分子内电荷转移盐具有多种氧化态和颜色变化的广泛变化。 分子间和分子内电荷转移盐优选含有突出部分和具有与芳族部分结合的羰基的部分。 分子内电荷转移盐具有稳定的共价自由基 - 阴离子/自由基 - 阳离子配置。 分子间电荷转移盐具有稳定的离子自由基 - 阴离子/自由基 - 阳离子配置。

    Isoimide modifications of a polyimide and reaction thereof with nucleophiles
    3.
    发明授权
    Isoimide modifications of a polyimide and reaction thereof with nucleophiles 失效
    聚酰亚胺的异构酰亚胺改性物和与亲核试剂的反应

    公开(公告)号：US5187241A

    公开(公告)日：1993-02-16

    申请号：US770506

    申请日：1991-10-03

    申请人： Stephen L. Buchwalter ,  Ernest R. Frank ,  Terrence R. O'Toole ,  Richard R. Thomas ,  Alfred Viehbeck

    发明人： Stephen L. Buchwalter ,  Ernest R. Frank ,  Terrence R. O'Toole ,  Richard R. Thomas ,  Alfred Viehbeck

    IPC分类号： C08G73/06 ,  C08G73/10 ,  C08J7/12 ,  C23C18/22 ,  G03F7/038 ,  H05K3/38

    CPC分类号： C08J7/12 ,  C08G73/1089 ,  C23C18/22 ,  H05K3/381 ,  C08J2379/08

    摘要： The invention relates to the formation of isoimides from amic acids, especially polyisoimides by a novel process in which polyimides are first converted to polyamic acids and then contacted with an isoimidizing agent. An acyl halide of a heterocyclic nitrogen compound or an acyl halide of a heterocyclic sulphur compound can be used as the isoimidizing agent. The isoimidization may also be carried out in the presence of a compound containing a heterocyclic nitrogen especially a solvent containing a heterocyclic nitrogen.The invention is especially applicable to conducting nucleophilic addition reactions on the surface of polyimides where the surface has been converted to a polyamic acid or on the surface of polyamic acid materials followed by isoimidization and reaction of the isoimide with a nucleophile such as an amine or organic hydroxy compound.Photosensitive metal compounds or electroless metal coating catalysts can be coordinated with the compositions obtained.

    摘要翻译： 本发明涉及通过一种新方法从酰胺酸，特别是聚酰亚胺形成异酰亚胺，其中首先将聚酰亚胺转化为聚酰胺酸，然后与异氰酸酯接触。 可以使用杂环氮化合物的酰卤或杂环硫化合物的酰卤作为异亚胺化剂。 异氰酰化还可以在含有杂环氮的化合物，特别是含有杂环氮的溶剂的存在下进行。 本发明特别适用于在表面已转化为聚酰胺酸或聚酰胺酸物质表面的聚酰亚胺的表面上进行亲核加成反应，随后异亚胺化和异亚胺与亲核试剂例如胺或有机物的反应 羟基化合物。 感光金属化合物或无电镀金属涂层催化剂可以与获得的组合物配位。

    Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier
    8.
    发明授权
    Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier 失效
    多层包装中的粘合层和有机材料作为金属扩散屏障

    公开(公告)号：US5326643A

    公开(公告)日：1994-07-05

    申请号：US771929

    申请日：1991-10-07

    申请人： Eleftherios Adamopoulos ,  Jungihl Kim ,  Kang-Wook Lee ,  Tae S. Oh ,  Terrence R. O'Toole ,  Sampath Purushothaman ,  John J. Ritsko ,  Jane M. Shaw ,  Alfred Viehbeck ,  George F. Walker

    发明人： Eleftherios Adamopoulos ,  Jungihl Kim ,  Kang-Wook Lee ,  Tae S. Oh ,  Terrence R. O'Toole ,  Sampath Purushothaman ,  John J. Ritsko ,  Jane M. Shaw ,  Alfred Viehbeck ,  George F. Walker

    IPC分类号： B32B7/10 ,  B32B15/08 ,  B32B15/088 ,  B32B27/00 ,  C08G73/00 ,  C08G73/10 ,  H01B3/30 ,  H01L21/52 ,  H05K1/03 ,  H05K3/46 ,  B32B9/00

    CPC分类号： C08G73/1089 ,  C08G73/1003 ,  C08G73/1007 ,  C08G73/101 ,  H01B3/306 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31721

    摘要： The disclosure describes a multilayer article of manufacture comprising a substrate having adhered to it a terminally unsaturated adhesive polyimide, where the surface of the adhesive opposite the substrate is adhered to a polyimide, the article further characterized in having one set or a plurality of alternating layers of the terminally unsaturated adhesive polyimide and the polyimide. In another embodiment, the article has at least one adhesive polyimide layer adhered to a metal substrate or an electrical circuit component such as an integrated circuit, or means for forming electrical connections in an electrical circuit such as metal conduits on the circuit or a wiring network embedded within a ceramic and/or polymer substrate.In manufacturing the article of manufacture, a surface treatment technique such as wet process or a plasma/optional silane coupling agent may be applied to either the substrate, adhesive polyimide film or polyimide film prior to the bonding operation.A novel adhesive polyimide is also described which is an adhesive polyimide such as ODPA-APB terminated with unsaturated heterocyclic monoamines such as azaadenines, aminobenzotriazoles, aminopurines or aminopyrazolopyrimidines and optionally anhydrides, aminoacetylenes, vinylamines or amino phosphines. The novel polyimide may also contain unsaturated heterocyclic groups in the polymer backbone or chain, either as a partial or complete replacement for the aromatic diamines used in synthesizing the polyimide. This novel adhesive polyimide in this invention acts as an adhesive layer for the polymer-substrate (copper, polymer, glass ceramic) interface as well as a copper diffusion barrier layer for the polymer-copper interface.

    摘要翻译： 本公开描述了一种多层制品，其包括粘附到其上的末端不饱和粘合聚酰亚胺的基底，其中与基底相对的粘合剂的表面粘附到聚酰亚胺上，该制品进一步的特征在于具有一组或多个交替层 的末端不饱和粘合聚酰亚胺和聚酰亚胺。 在另一个实施方案中，制品具有粘附到金属基底或诸如集成电路的电路部件的至少一个粘合聚酰亚胺层，或用于在电路中形成电连接的装置，例如电路上的金属管道或布线网络 嵌入在陶瓷和/或聚合物基材内。 在制造该制品时，可以在接合操作之前将表面处理技术如湿法或等离子体/任选的硅烷偶联剂施加到基底，粘合聚酰亚胺膜或聚酰亚胺膜上。 还描述了一种新型粘合聚酰亚胺，其是粘合聚酰亚胺，例如用不饱和杂环单胺如氮杂腺嘌呤，氨基苯并三唑，氨基嘌呤或氨基吡唑并嘧啶和任选的酸酐，氨基乙炔，乙烯胺或氨基膦封端的ODPA-APB。 新型聚酰亚胺还可以在聚合物主链或链中含有不饱和杂环基团，作为用于合成聚酰亚胺的芳族二胺的部分或完全替代物。 本发明中的这种新型粘合聚酰亚胺作为聚合物基材（铜，聚合物，玻璃陶瓷）界面的粘合剂层以及用于聚合物 - 铜界面的铜扩散阻挡层。

    Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier
    9.
    发明授权
    Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier 失效
    多层包装中的粘合层和有机材料作为金属扩散屏障

    公开(公告)号：US5582858A

    公开(公告)日：1996-12-10

    申请号：US474985

    申请日：1995-06-07

    申请人： Eleftherios Adamopoulos ,  Jungihl Kim ,  Kang-Wook Lee ,  Tae S. Oh ,  Terrence R. O'Toole ,  Sampath Purushothaman ,  John J. Ritsko ,  Jane M. Shaw ,  Alfred Viehbeck ,  George F. Walker

    发明人： Eleftherios Adamopoulos ,  Jungihl Kim ,  Kang-Wook Lee ,  Tae S. Oh ,  Terrence R. O'Toole ,  Sampath Purushothaman ,  John J. Ritsko ,  Jane M. Shaw ,  Alfred Viehbeck ,  George F. Walker

    IPC分类号： B32B7/10 ,  B32B15/08 ,  B32B15/088 ,  B32B27/00 ,  C08G73/00 ,  C08G73/10 ,  H01B3/30 ,  H01L21/52 ,  H05K1/03 ,  H05K3/46 ,  B05D5/10

    CPC分类号： C08G73/1089 ,  C08G73/1003 ,  C08G73/1007 ,  C08G73/101 ,  H01B3/306 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31721

    摘要： The disclosure describes a multilayer article of manufacture comprising a substrate having adhered to it a terminally unsaturated adhesive polyimide, where the surface of the adhesive opposite the substrate is adhered to a polyimide, the article further characterized in having one set or a plurality of alternating layers of the terminally unsaturated adhesive polyimide and the polyimide. In another embodiment, the article has at least one adhesive polyimide layer adhered to a metal substrate or an electrical circuit component such as an integrated circuit, or means for forming electrical connections in an electrical circuit such as metal conduits on the circuit or a wiring network embedded within a ceramic and/or polymer substrate.In manufacturing the article of manufacture, a surface treatment technique such as wet process or a plasma/optional silane coupling agent may be applied to either the substrate, adhesive polyimide film or polyimide film prior to the bonding operation.A novel adhesive polyimide is also described which is an adhesive polyimide such as ODPA-APB terminated with unsaturated heterocyclic monoamines such as azaadenines, aminobenzotriazoles, aminopurines or aminopyrazolopyrimidines and optionally anhydrides, aminoacetylenes, vinylamines or amino phosphines. The novel polyimide may also contain unsaturated heterocyclic groups in the polymer backbone or chain, either as a partial or complete replacement for the aromatic diamines used in synthesizing the polyimide. This novel adhesive polyimide in this invention acts as an adhesive layer for the polymer-substrate (copper, polymer, glass ceramic) interface as well as a copper diffusion barrier layer for the polymer-copper interface.

    摘要翻译： 本公开描述了一种多层制品，其包括粘附到其上的末端不饱和粘合聚酰亚胺的基底，其中与基底相对的粘合剂的表面粘附到聚酰亚胺上，该制品进一步的特征在于具有一组或多个交替层 的末端不饱和粘合聚酰亚胺和聚酰亚胺。 在另一个实施方案中，制品具有粘附到金属基底或诸如集成电路的电路部件的至少一个粘合聚酰亚胺层，或用于在电路中形成电连接的装置，例如电路上的金属管道或布线网络 嵌入在陶瓷和/或聚合物基材内。 在制造该制品时，可以在接合操作之前将表面处理技术如湿法或等离子体/任选的硅烷偶联剂施加到基底，粘合聚酰亚胺膜或聚酰亚胺膜上。 还描述了一种新型粘合聚酰亚胺，其是粘合聚酰亚胺，例如用不饱和杂环单胺如氮杂腺嘌呤，氨基苯并三唑，氨基嘌呤或氨基吡唑并嘧啶和任选的酸酐，氨基乙炔，乙烯胺或氨基膦封端的ODPA-APB。 新型聚酰亚胺还可以在聚合物主链或链中含有不饱和杂环基团，作为用于合成聚酰亚胺的芳族二胺的部分或完全替代物。 本发明中的这种新型粘合聚酰亚胺作为聚合物基材（铜，聚合物，玻璃陶瓷）界面的粘合剂层以及用于聚合物 - 铜界面的铜扩散阻挡层。

    Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier
    10.
    发明授权
    Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier 失效
    多层包装中的粘合层和有机材料作为金属扩散屏障

    公开(公告)号：US5569739A

    公开(公告)日：1996-10-29

    申请号：US197941

    申请日：1994-02-17

    申请人： Eleftherios Adamopoulos ,  Kang-Wook Lee ,  Terrence R. O'Toole ,  Sampath Purushothaman ,  Jane M. Shaw ,  Alfred Viehbeck ,  George F. Walker

    发明人： Eleftherios Adamopoulos ,  Kang-Wook Lee ,  Terrence R. O'Toole ,  Sampath Purushothaman ,  Jane M. Shaw ,  Alfred Viehbeck ,  George F. Walker

    IPC分类号： B32B7/10 ,  B32B15/08 ,  B32B15/088 ,  B32B27/00 ,  C08G73/00 ,  C08G73/10 ,  H01B3/30 ,  H01L21/52 ,  H05K1/03 ,  H05K3/46 ,  C08F8/34

    CPC分类号： C08G73/1089 ,  C08G73/1003 ,  C08G73/1007 ,  C08G73/101 ,  H01B3/306 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31721

    摘要： The disclosure describes a multilayer article of manufacture comprising a substrate having adhered to it a terminally unsaturated adhesive polyimide, where the surface of the adhesive opposite the substrate is adhered to a polyimide, the article further characterized in having one set or a plurality of alternating layers of the terminally unsaturated adhesive polyimide and the polyimide. the bonding operation.A novel adhesive polyimide is also described which is an adhesive polyimide such as ODPA-APB terminated with unsaturated heterocyclic monoamines such as azaadenines, aminobenzotriazoles, aminopurines or aminopyrazolopyrimidines and optionally anhydrides, aminoacetylenes, vinylamines or amino phosphines. The novel polyimide may also contain unsaturated heterocyclic groups in the polymer backbone or chain, either as a partial or complete replacement for the aromatic diamines used in synthesizing the polyimide. This novel adhesive polyimide in this invention acts as an adhesive layer for the polymer-substrate (copper, polymer, glass ceramic) interface as well as a copper diffusion barrier layer for the polymer copper interface.

    摘要翻译： 本公开描述了一种多层制品，其包括粘附到其上的末端不饱和粘合聚酰亚胺的基底，其中与基底相对的粘合剂的表面粘附到聚酰亚胺上，该制品进一步的特征在于具有一组或多个交替层 的末端不饱和粘合聚酰亚胺和聚酰亚胺。 接合操作。 还描述了一种新型粘合聚酰亚胺，其是粘合聚酰亚胺，例如用不饱和杂环单胺如氮杂腺嘌呤，氨基苯并三唑，氨基嘌呤或氨基吡唑并嘧啶和任选的酸酐，氨基乙炔，乙烯胺或氨基膦封端的ODPA-APB。 新型聚酰亚胺还可以在聚合物主链或链中含有不饱和杂环基团，作为用于合成聚酰亚胺的芳族二胺的部分或完全替代物。 本发明中的这种新型粘合聚酰亚胺作为聚合物基材（铜，聚合物，玻璃陶瓷）界面的粘合剂层以及用于聚合物铜界面的铜扩散阻挡层。