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1.发明授权Universal IO connector and interface capable of both wired and wireless operation 有权通用IO连接器和能够进行有线和无线操作的接口公开(公告)号：US09312908B2
公开(公告)日：2016-04-12
申请号：US13995592
申请日：2011-11-11
申请人： Stephen R. Mooney , Howard L. Heck , James E. Jaussi , Bryan K. Casper , Debabani Choudhury , Frank T. Hady
发明人： Stephen R. Mooney , Howard L. Heck , James E. Jaussi , Bryan K. Casper , Debabani Choudhury , Frank T. Hady
CPC分类号： H04B1/40 , G06F13/4068 , G06F2213/0042
摘要： Systems and methods of interconnecting devices may include a connector assembly having a substrate, a set of input/output (IO) contacts, an antenna structure and transceiver logic. In one example, the transceiver logic may process one or more IO signals associated with the antenna structure and process one or more IO signals associated with the set of IO contacts.
摘要翻译： 互连设备的系统和方法可以包括具有基板，一组输入/输出（IO）触点，天线结构和收发器逻辑的连接器组件。 在一个示例中，收发器逻辑可以处理与天线结构相关联的一个或多个IO信号并且处理与该组IO触点相关联的一个或多个IO信号。
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2.发明申请UNIVERSAL IO CONNECTOR AND INTERFACE CAPABLE OF BOTH WIRED AND WIRELESS OPERATION 有权通用IO连接器和两个可以接线和无线操作的接口公开(公告)号：US20140242927A1
公开(公告)日：2014-08-28
申请号：US13995592
申请日：2011-11-11
申请人： Stephen R. Mooney , Howard L. Heck , James E. Jaussi , Bryan K. Casper , Debabani Choudhury , Frank T. Hady
发明人： Stephen R. Mooney , Howard L. Heck , James E. Jaussi , Bryan K. Casper , Debabani Choudhury , Frank T. Hady
IPC分类号： H04B1/40
CPC分类号： H04B1/40 , G06F13/4068 , G06F2213/0042
摘要： Systems and methods of interconnecting devices may include a connector assembly having a substrate, a set of input/output (IO) contacts, an antenna structure and transceiver logic. In one example, the transceiver logic may process one or more IO signals associated with the antenna structure and process one or more IO signals associated with the set of IO contacts.
摘要翻译： 互连设备的系统和方法可以包括具有基板，一组输入/输出（IO）触点，天线结构和收发器逻辑的连接器组件。 在一个示例中，收发器逻辑可以处理与天线结构相关联的一个或多个IO信号并且处理与该组IO触点相关联的一个或多个IO信号。
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公开(公告)号：US09070977B2
公开(公告)日：2015-06-30
申请号：US12888645
申请日：2010-09-23
CPC分类号： H01Q1/246 , H01Q1/2283 , H01Q1/2291 , H01Q1/38 , H01Q3/26 , H01Q3/34 , H01Q9/0407 , H01Q21/065 , H01Q21/067 , H01Q21/205 , H01Q21/24 , H01Q25/00 , H01Q25/04 , H04B7/0682
摘要： Embodiments of wireless antenna array systems to achieve three-dimensional beam coverage are described herein. Other embodiments may be described and claimed.
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4.发明授权Suspended-membrane/suspended-substrate monolithic microwave integrated circuit modules 失效悬浮膜/悬浮基板单片微波集成电路模块公开(公告)号：US08426290B1
公开(公告)日：2013-04-23
申请号：US12888331
申请日：2010-09-22
申请人： Debabani Choudhury
发明人： Debabani Choudhury
IPC分类号： H01L21/76 , H01L21/4763
CPC分类号： H01L23/66 , H01L23/3677 , H01L24/48 , H01L2223/6627 , H01L2224/32188 , H01L2224/48227 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/1423 , H01L2924/15153 , H01L2924/1517 , H01L2924/1903 , H01L2924/3011 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A device and a method for manufacturing it are disclosed. The device contains a plurality of transistors, a plurality of transmission mediums connected to the transistors; and a substrate having a first portion supporting the transistors and the transmission mediums thereon, and further having a plurality of discrete second portions extending from the first portion. The method disclosed teaches how to manufacture the device.
摘要翻译： 公开了一种装置及其制造方法。 该器件包含多个晶体管，连接到晶体管的多个传输介质; 以及基板，其具有支撑晶体管的第一部分和其上的传输介质，并且还具有从第一部分延伸的多个离散的第二部分。 所公开的方法教导了如何制造该装置。
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5.发明授权Multi-band tunable frequency reconfigurable antennas using higher order resonances 有权使用更高阶谐振的多频带可调谐频率可重构天线公开(公告)号：US08369796B2
公开(公告)日：2013-02-05
申请号：US11644741
申请日：2006-12-22
申请人： Helen K. Pan , Songnan Yang , Debabani Choudhury , Vijay K. Nair
发明人： Helen K. Pan , Songnan Yang , Debabani Choudhury , Vijay K. Nair
IPC分类号： H04B1/44
摘要： A wireless device using natural higher order harmonics on multi-band reconfigurable antenna designs where the antenna higher order resonance is used to build a multi-band to multi-band frequency reconfigurable antenna.
摘要翻译： 在多频带可重构天线设计中使用自然高阶谐波的无线设备，其中天线高阶谐振用于构建多频带到多频带可重新配置的天线。
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6.发明授权Wireless antenna array system architecture and methods to achieve 3D beam coverage 有权无线天线阵列系统架构及方法实现三维射束覆盖公开(公告)号：US07830312B2
公开(公告)日：2010-11-09
申请号：US12215542
申请日：2008-06-27
CPC分类号： H01Q1/246 , H01Q1/2283 , H01Q1/2291 , H01Q1/38 , H01Q3/26 , H01Q3/34 , H01Q9/0407 , H01Q21/065 , H01Q21/067 , H01Q21/205 , H01Q21/24 , H01Q25/00 , H01Q25/04 , H04B7/0682
摘要： Embodiments of wireless antenna array systems to achieve three-dimensional beam coverage are described herein. Other embodiments may be described and claimed.
摘要翻译： 本文描述了实现三维波束覆盖的无线天线阵列系统的实施例。 可以描述和要求保护其他实施例。
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公开(公告)号：US07795859B1
公开(公告)日：2010-09-14
申请号：US12503690
申请日：2009-07-15
申请人： Jonathan James Lynch , James H. Schaffner , Daniel Frederic Sievenpiper , Debabani Choudhury , Joseph Colburn , Joel N. Schulman , Harris P. Moyer , Andrew T. Hunter
发明人： Jonathan James Lynch , James H. Schaffner , Daniel Frederic Sievenpiper , Debabani Choudhury , Joseph Colburn , Joel N. Schulman , Harris P. Moyer , Andrew T. Hunter
IPC分类号： G01R19/22
CPC分类号： H01Q21/064 , G01S13/89 , H01Q3/2658 , H01Q19/062 , H05K1/0243 , H05K1/0306 , H05K1/112
摘要： Low cost millimeter wave imagers using two-dimensional focal plane arrays based on backward tunneling diode (BTD) detectors. Two-dimensional focal arrays of BTD detectors are used as focal plane arrays in imagers. High responsivity of BTD detectors near zero bias results in low noise detectors that alleviate the need for expensive and heat generating low noise amplifiers or Dicke switches in the imager. BTD detectors are installed on a printed circuit board using flip chip packaging technology and horn antennas direct the waves toward the flip chip including the BTD detectors. The assembly of the horn antennas, flip chips, printed circuit board substrate, and interconnects together work as an imaging sensor. Corrugated surfaces of the components prevent re-radiation of the incident waves.
摘要翻译： 使用基于反向隧道二极管（BTD）检测器的二维焦平面阵列的低成本毫米波成像器。 BTD检测器的二维焦点阵列用作成像器中的焦平面阵列。 BTD检测器在零偏置下的高响应度导致低噪声检测器，其减轻了在成像器中对昂贵的和发热的低噪声放大器或Dicke开关的需要。 BTD检测器使用倒装芯片封装技术安装在印刷电路板上，喇叭天线将波导引向包括BTD检测器的倒装芯片。 喇叭天线，倒装芯片，印刷电路板基板和互连的组合一起用作成像传感器。 这些部件的波纹表面防止入射波的再辐射。
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公开(公告)号：US20100164783A1
公开(公告)日：2010-07-01
申请号：US12347316
申请日：2008-12-31
IPC分类号： G01S13/00
CPC分类号： H01Q3/26 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01Q1/02 , H01Q21/0025 , H01Q21/065 , H01Q23/00 , H01L2224/0401
摘要： Disclosed are integration approaches for mm-wave planar phased array type architectures using multilayer substrate technologies. For instance, an apparatus may include a plurality of substrate layers, an integrated circuit, and a connector module. The plurality of substrate layers includes a first substrate layer having one or more phased array elements. The integrated circuit exchange one or more radio frequency (RF) signals (e.g., mm-wave signals) with the one or more phased array elements. The connector module exchange further signals with the integrated circuit that correspond to the one or more RF signals. For example, these further signals may be baseband or intermediate frequency (IF) signals.
摘要翻译： 公开了使用多层衬底技术的毫米波平面相控阵列型结构的集成方法。 例如，设备可以包括多个基板层，集成电路和连接器模块。 多个基底层包括具有一个或多个相控阵列元件的第一基底层。 集成电路与一个或多个相控阵列元件交换一个或多个射频（RF）信号（例如，毫米波信号）。 连接器模块与对应于一个或多个RF信号的集成电路交换进一步的信号。 例如，这些另外的信号可以是基带或中频（IF）信号。
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公开(公告)号：US20050082652A1
公开(公告)日：2005-04-21
申请号：US10716196
申请日：2003-11-17
申请人： Debabani Choudhury , Ross Bowen , James Foschaar
发明人： Debabani Choudhury , Ross Bowen , James Foschaar
IPC分类号： H01L23/04 , H01L23/10 , H01L23/552 , H01L23/66 , H01L23/02
CPC分类号： H01L23/66 , H01L23/04 , H01L23/10 , H01L23/552 , H01L2924/0002 , H01L2924/01079 , H01L2924/1423 , H01L2924/1616 , H01L2924/1617 , H01L2924/3011 , H01L2924/00
摘要： A housing for an integrated circuit, comprising a base for securing a substrate with an integrated circuit thereon, a top cover, and a body with a cavity for receiving the substrate and at least a portion of the top cover therein to form an enclosed housing therewith, the body including at least one connector extending from within the cavity to outside of the body and configured to contact the integrated circuit when the substrate is in the cavity.
摘要翻译： 一种用于集成电路的壳体，包括用于固定其上具有集成电路的基板的基座，顶盖和具有用于接收基板的空腔的主体以及其中的顶盖的至少一部分以与其形成封闭壳体 所述主体包括至少一个连接器，所述至少一个连接器从所述空腔内延伸到所述主体外部，并且被配置为当所述基板处于所述空腔中时与所述集成电路接触。
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公开(公告)号：US08706049B2
公开(公告)日：2014-04-22
申请号：US12347316
申请日：2008-12-31
IPC分类号： H04B1/38
CPC分类号： H01Q3/26 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01Q1/02 , H01Q21/0025 , H01Q21/065 , H01Q23/00 , H01L2224/0401
摘要： Disclosed are integration approaches for mm-wave planar phased array type architectures using multilayer substrate technologies. For instance, an apparatus may include a plurality of substrate layers, an integrated circuit, and a connector module. The plurality of substrate layers includes a first substrate layer having one or more phased array elements. The integrated circuit exchange one or more radio frequency (RF) signals (e.g., mm-wave signals) with the one or more phased array elements. The connector module exchange further signals with the integrated circuit that correspond to the one or more RF signals. For example, these further signals may be baseband or intermediate frequency (IF) signals.
摘要翻译： 公开了使用多层衬底技术的毫米波平面相控阵列型结构的集成方法。 例如，设备可以包括多个基板层，集成电路和连接器模块。 多个基底层包括具有一个或多个相控阵列元件的第一基底层。 集成电路与一个或多个相控阵列元件交换一个或多个射频（RF）信号（例如，毫米波信号）。 连接器模块与对应于一个或多个RF信号的集成电路交换进一步的信号。 例如，这些另外的信号可以是基带或中频（IF）信号。
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