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公开(公告)号：US08847693B2
公开(公告)日：2014-09-30
申请号：US13448261
申请日：2012-04-16
摘要： A system and method is disclosed that provides a technique for generating an accurate time base for MEMS sensors and actuators which has a vibrating MEMS structure. The accurate clock is generated from the MEMS oscillations and converted to the usable range by means of a frequency translation circuit.
摘要翻译： 公开了一种系统和方法，其提供了一种用于为具有振动MEMS结构的MEMS传感器和致动器产生精确时基的技术。 精确时钟由MEMS振荡产生，并通过频率转换电路转换成可用的范围。
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公开(公告)号：US08183944B2
公开(公告)日：2012-05-22
申请号：US12418547
申请日：2009-04-03
IPC分类号： H03B5/30
摘要： A system and method is disclosed that provides a technique for generating an accurate time base for MEMS sensors and actuators which has a vibrating MEMS structure. The accurate clock is generated from the MEMS oscillations and converted to the usable range by means of a frequency translation circuit.
摘要翻译： 公开了一种系统和方法，其提供了一种用于为具有振动MEMS结构的MEMS传感器和致动器产生精确时基的技术。 精确时钟由MEMS振荡产生，并通过频率转换电路转换成可用的范围。
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公开(公告)号：US08960002B2
公开(公告)日：2015-02-24
申请号：US13096732
申请日：2011-04-28
IPC分类号： G01P15/08 , G01P15/125 , G01P15/18 , B60R21/0132
CPC分类号： G01P15/0888 , B60R2021/01327 , G01P15/0802 , G01P15/125 , G01P15/18
摘要： Sensors for measuring angular acceleration about three mutually orthogonal axes, X, Y, Z or about the combination of these axes are disclosed. The sensor comprises a sensor subassembly. The sensor subassembly further comprises a base which is substantially parallel to the X-Y sensing plane; a proof mass disposed in the X-Y sensing plane and constrained to rotate substantially about the X, and/or Y, and/or Z, by at least one linkage and is responsive to angular accelerations about the X, and/or Y, and/or Z directions. Finally, the sensor includes at least one electrode at the base plate or perpendicular to the base plate and at least one transducer for each sensing direction of the sensor subassembly responsive to the angular acceleration. Multi-axis detection is enabled by adjusting a configuration of flexures and electrodes.
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4.发明授权Performance-enhancing two-sided MEMS anchor design for vertically integrated micromachined devices 有权用于垂直集成微加工设备的性能提升双面MEMS锚定设计公开(公告)号：US07863698B2
公开(公告)日：2011-01-04
申请号：US12418554
申请日：2009-04-03
IPC分类号： H01L29/84
CPC分类号： B81C1/00039 , B81B2203/0307
摘要： An anchoring assembly for anchoring MEMS device is disclosed. The anchoring assembly comprises: a top substrate; a bottom substrate substantially parallel to the top substrate; and a first portion of the anchor between the top substrate and the bottom substrate. The first portion of the anchor is rigidly connected to the top substrate; and the first portion of the anchor is rigidly connected to the bottom substrate. A second portion of the anchor is between the top substrate and the bottom substrate. The second portion of the anchor is rigidly connected to the top substrate; the second portion of the anchor being an anchoring point for the MEMS device. A substantially flexible mechanical element coupling the first portion of the anchor and the second portion of the anchor; the flexible element providing the electrical connection between the first portion of the anchor and the second portion of the anchor.
摘要翻译： 公开了一种用于锚定MEMS装置的锚固组件。 锚固组件包括：顶部基底; 基本上平行于顶部衬底的底部衬底; 以及锚固件在顶部基底和底部基底之间的第一部分。 锚的第一部分刚性地连接到顶部基底; 并且锚的第一部分刚性地连接到底部基底。 锚的第二部分在顶部基底和底部基底之间。 锚的第二部分刚性地连接到顶部基底; 锚的第二部分是用于MEMS装置的锚定点。 将锚固件的第一部分和锚固件的第二部分联接的基本上柔性的机械元件; 所述柔性元件提供所述锚固件的第一部分和所述锚固件的第二部分之间的电连接。
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5.发明授权Vertically integrated 3-axis MEMS angular accelerometer with integrated electronics 有权垂直集成的3轴MEMS角加速度计与集成电子公开(公告)号：US07934423B2
公开(公告)日：2011-05-03
申请号：US11953762
申请日：2007-12-10
IPC分类号： G01P15/08 , G01P15/125
CPC分类号： G01P15/0888 , B60R2021/01327 , G01P15/0802 , G01P15/125 , G01P15/18
摘要： Sensors for measuring angular acceleration about three mutually orthogonal axes, X, Y, Z or about the combination of these axes are disclosed. The sensor comprises a sensor subassembly. The sensor subassembly further comprises a base which is substantially parallel to the X-Y sensing plane; a proof mass disposed in the X-Y sensing plane and constrained to rotate substantially about the X, and/or Y, and/or Z, by at least one linkage and is responsive to angular accelerations about the X, and/or Y, and/or Z directions. Finally, the sensor includes at least one electrode at the base plate or perpendicular to the base plate and at least one transducer for each sensing direction of the sensor subassembly responsive to the angular acceleration. Multi-axis detection is enabled by adjusting a configuration of flexures and electrodes.
摘要翻译： 公开了用于测量围绕三个相互正交的轴X，Y，Z或围绕这些轴的组合的角加速度的传感器。 传感器包括传感器子组件。 传感器子组件还包括基本上平行于X-Y感测平面的基座; 设置在XY感测平面中并被约束以基于X和/或Y和/或Z 1至少一个连杆旋转的检测质量体，并响应于围绕X和/或Y的角加速度和/ 或Z方向。 最后，传感器在基板处包括至少一个电极或垂直于基板，以及至少一个传感器，用于响应于角加速度的传感器子组件的每个感测方向。 通过调整弯曲和电极的配置可实现多轴检测。
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6.发明申请VERTICALLY INTEGRATED 3-AXIS MEMS ANGULAR ACCELEROMETER WITH INTEGRATED ELECTRONICS 有权具有集成电子的垂直集成三轴MEMS角锥加速度计公开(公告)号：US20110197677A1
公开(公告)日：2011-08-18
申请号：US13096732
申请日：2011-04-28
IPC分类号： G01P15/08
CPC分类号： G01P15/0888 , B60R2021/01327 , G01P15/0802 , G01P15/125 , G01P15/18
摘要： Sensors for measuring angular acceleration about three mutually orthogonal axes, X, Y, Z or about the combination of these axes are disclosed. The sensor comprises a sensor subassembly. The sensor subassembly further comprises a base which is substantially parallel to the X-Y sensing plane; a proof mass disposed in the X-Y sensing plane and constrained to rotate substantially about the X, and/or Y, and/or Z, by at least one linkage and is responsive to angular accelerations about the X, and/or Y, and/or Z directions. Finally, the sensor includes at least one electrode at the base plate or perpendicular to the base plate and at least one transducer for each sensing direction of the sensor subassembly responsive to the angular acceleration. Multi-axis detection is enabled by adjusting a configuration of flexures and electrodes.
摘要翻译： 公开了用于测量围绕三个相互正交的轴X，Y，Z或围绕这些轴的组合的角加速度的传感器。 传感器包括传感器子组件。 传感器子组件还包括基本上平行于X-Y感测平面的基座; 设置在XY感测平面中并被约束以基于X和/或Y和/或Z 1至少一个连杆旋转的检测质量体，并响应于围绕X和/或Y的角加速度和/ 或Z方向。 最后，传感器在基板处包括至少一个电极或垂直于基板，以及至少一个传感器，用于响应于角加速度的传感器子组件的每个感测方向。 通过调整弯曲和电极的配置可实现多轴检测。
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公开(公告)号：US08567246B2
公开(公告)日：2013-10-29
申请号：US12979960
申请日：2010-12-28
申请人： Derek Shaeffer , Baris Cagdaser , Chiung C. Lo , Joseph Seeger
发明人： Derek Shaeffer , Baris Cagdaser , Chiung C. Lo , Joseph Seeger
IPC分类号： G01C19/56
CPC分类号： G01R33/0286 , H03H3/0073
摘要： An integrated MEMS device is disclosed. The system comprises a MEMS resonator; and a MEMS device coupled to a MEMS resonator. The MEMS resonator and MEMS device are fabricated on a common substrate so that certain characteristics of the MEM resonator and MEMS device track each other as operating conditions vary.
摘要翻译： 公开了集成的MEMS器件。 该系统包括MEMS谐振器; 以及耦合到MEMS谐振器的MEMS器件。 MEMS谐振器和MEMS器件制造在公共衬底上，使得MEM谐振器和MEMS器件的某些特性在操作条件变化时彼此跟踪。
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公开(公告)号：US09006832B2
公开(公告)日：2015-04-14
申请号：US13071374
申请日：2011-03-24
申请人： Derek Shaeffer , Baris Cagdaser , Joseph Seeger
发明人： Derek Shaeffer , Baris Cagdaser , Joseph Seeger
IPC分类号： H01L23/62 , H01L21/00 , H01L27/092 , H01L21/8238 , B81B7/00
CPC分类号： H01L27/092 , B81B7/008 , B81B2207/015 , H01L21/823892
摘要： A high-voltage MEMS system compatible with low-voltage semiconductor process technology is disclosed. The system comprises a MEMS device coupled to a high-voltage bias generator employing an extended-voltage isolation residing in a semiconductor technology substrate. The system avoids the use of high-voltage transistors so that special high-voltage processing steps are not required of the semiconductor technology, thereby reducing process cost and complexity. MEMS testing capability is addressed with a self-test circuit allowing modulation of the bias voltage and current so that a need for external high-voltage connections and associated electro-static discharge protection circuitry are also avoided.
摘要翻译： 公开了一种兼容低压半导体工艺技术的高压MEMS系统。 该系统包括耦合到高电压偏置发生器的MEMS器件，其采用驻留在半导体技术衬底中的扩展电压隔离。 该系统避免使用高压晶体管，因此不需要半导体技术的特殊高压处理步骤，从而降低工艺成本和复杂性。 利用允许调制偏置电压和电流的自检电路解决MEMS测试能力，从而也避免了外部高压连接和相关静电放电保护电路的需要。
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公开(公告)号：US08860409B2
公开(公告)日：2014-10-14
申请号：US13004365
申请日：2011-01-11
申请人： Joseph Seeger , Chiung C. Lo , Baris Cagdaser , Derek Shaeffer
发明人： Joseph Seeger , Chiung C. Lo , Baris Cagdaser , Derek Shaeffer
IPC分类号： G01R33/02 , G01R33/028 , G01R33/038
CPC分类号： G01R33/038 , G01R33/0286
摘要： A micromachined magnetic field sensor is disclosed. The micromachined magnetic field comprises a substrate; a drive subsystem, the drive subsystem comprises a plurality of beams, and at least one anchor connected to the substrate; a mechanism for providing an electrical current through the drive subsystem along a first axis; and Lorentz force acting on the drive subsystem along a second axis in response to a magnetic field along a third axis. The micromachined magnetic field sensor also includes a sense subsystem, the sense subsystem includes a plurality of beams, and at least one anchor connected to the substrate; wherein a portion of the sense subsystem moves along a fourth axis; a coupling spring between the drive subsystem and the sense subsystem which causes motion of the sense subsystem in response to the magnetic field; and a position transducer to detect the motion of the sense subsystem.
摘要翻译： 公开了一种微加工磁场传感器。 微加工磁场包括基片; 驱动子系统，所述驱动子系统包括多个梁，以及连接到所述基板的至少一个锚固件; 用于沿着第一轴线提供穿过所述驱动子系统的电流的机构; 以及响应于沿着第三轴的磁场沿第二轴作用在驱动子系统上的洛伦兹力。 微加工磁场传感器还包括感测子系统，感测子系统包括多个光束，以及至少一个连接到衬底的锚; 其中所述感测子系统的一部分沿着第四轴线移动; 驱动子系统和感测子系统之间的耦合弹簧，其引起感测子系统响应于磁场的运动; 以及用于检测感测子系统的运动的位置传感器。
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公开(公告)号：US08947081B2
公开(公告)日：2015-02-03
申请号：US13004383
申请日：2011-01-11
申请人： Joseph Seeger , Chiung C. Lo , Baris Cagdaser , Derek Shaeffer
发明人： Joseph Seeger , Chiung C. Lo , Baris Cagdaser , Derek Shaeffer
IPC分类号： G01R33/02 , G01R33/038 , G01R33/028
CPC分类号： G01R33/038 , G01R33/0286
摘要： A micromachined magnetic field sensor is disclosed. The micromachined magnetic field sensor includes a substrate; and a drive subsystem partially supported by the substrate with a plurality of beams, and at least one anchor; a mechanism for providing an electrical current through the drive subsystem along a first axis; and Lorentz force acting on the drive subsystem along a second axis in response to a magnetic field vector along a third axis. The micromachined magnetic field sensor also includes a position transducer to detect the motion of the drive subsystem and an electrostatic offset cancellation mechanism coupled to the drive subsystem.
摘要翻译： 公开了一种微加工磁场传感器。 微加工磁场传感器包括基板; 以及驱动子系统，其由具有多个梁的所述衬底部分地支撑，以及至少一个锚; 用于沿着第一轴线提供穿过所述驱动子系统的电流的机构; 以及响应于沿着第三轴的磁场矢量沿第二轴作用在驱动子系统上的洛伦兹力。 微加工磁场传感器还包括位置传感器，用于检测驱动子系统的运动和耦合到驱动子系统的静电偏移消除机构。
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