公开(公告)号：US08240650B2

公开(公告)日：2012-08-14

申请号：US12048323

申请日：2008-03-14

申请人： Michael Teich ,  Karsten Stoll ,  Axel Schmidt ,  Stojan Kanev ,  Jörg Kiesewetter

发明人： Michael Teich ,  Karsten Stoll ,  Axel Schmidt ,  Stojan Kanev ,  Jörg Kiesewetter

IPC分类号： B25B1/00 ,  B23Q3/00 ,  G01R31/20 ,  F28F7/00 ,  B23B31/30 ,  B23B31/12

CPC分类号： G01R1/04 ,  G01R31/2865 ,  H01L21/68714 ,  H01L21/68757 ,  Y10T279/11 ,  Y10T279/18

摘要： A chuck with triaxial construction comprises a receiving surface for a test substrate and arranged below the receiving surface: an electrically conductive first surface element, an electrically conductive second surface element electrically insulated therefrom, and an electrically conductive third surface element electrically insulated therefrom, and, between the first and the second surface element, a first insulation element and, between the second and the third surface element, a second insulation element. A chuck for very low current measurements which can be used to prevent the occurrence of leakage currents and a triboelectric charge and which is configured favourably in terms of production, is achieved because at least one of the electrically conductive surface elements is mechanically connected to at least one insulation element and has an elasticity that compensates for an expansion difference resulting from differences in different coefficients of expansion between a respective surface element and an adjoining insulation element.

摘要翻译： 具有三轴结构的卡盘包括用于测试基板的接收表面并且布置在接收表面下方：导电的第一表面元件，与其电绝缘的导电的第二表面元件和与其电绝缘的导电的第三表面元件， 在第一和第二表面元件之间，第一绝缘元件和第二和第三表面元件之间的第二绝缘元件。 实现了用于非常低的电流测量的卡盘，其可用于防止泄漏电流和摩擦电荷的发生，并且在生产方面被有利地配置，这是因为至少一个导电表面元件至少机械地连接到 一个绝缘元件并且具有补偿由相应的表面元件和相邻绝缘元件之间的不同膨胀系数的差异引起的膨胀差的弹性。

公开(公告)号：US20100289511A1

公开(公告)日：2010-11-18

申请号：US12681806

申请日：2008-10-01

申请人： Joerg Kiesewetter ,  Stojan Kanev ,  Michael Teich ,  Karsten Stoll ,  Axel Schmidt

发明人： Joerg Kiesewetter ,  Stojan Kanev ,  Michael Teich ,  Karsten Stoll ,  Axel Schmidt

IPC分类号： G01R31/00

CPC分类号： G01R31/2891 ,  G01R31/2874

摘要： In a method and a device for testing a test substrate under defined thermal conditions, a substrate that is to be tested is held by a temperature-controllable chuck and is set to a defined temperature; the test substrate is positioned relative to test probes by at least one positioning device; and the test probes make contact with the test substrate for testing purposes. At least one component of the positioning device that is present in the vicinity of the temperature-controlled test substrate is set to a temperature that is independent of the temperature of the test substrate by a temperature-controlling device, and this temperature is held constant.

摘要翻译： 在用于在限定的热条件下测试测试基板的方法和装置中，待测试的基板由温度可控的卡盘保持并设定在限定的温度; 测试基板通过至少一个定位装置相对于测试探针定位; 并且测试探针与测试基板接触以进行测试。 存在于受温度控制的测试基板附近的定位装置的至少一个部件通过温度控制装置设定为与测试基板的温度无关的温度，并且该温度保持恒定。

公开(公告)号：US08497693B2

公开(公告)日：2013-07-30

申请号：US12681806

申请日：2008-10-01

申请人： Joerg Kiesewetter ,  Stojan Kanev ,  Michael Teich ,  Karsten Stoll ,  Axel Schmidt

发明人： Joerg Kiesewetter ,  Stojan Kanev ,  Michael Teich ,  Karsten Stoll ,  Axel Schmidt

IPC分类号： G01R31/00

CPC分类号： G01R31/2891 ,  G01R31/2874

摘要： In a method and a device for testing a test substrate under defined thermal conditions, a substrate that is to be tested is held by a temperature-controllable chuck and is set to a defined temperature; the test substrate is positioned relative to test probes by at least one positioning device; and the test probes make contact with the test substrate for testing purposes. At least one component of the positioning device that is present in the vicinity of the temperature-controlled test substrate is set to a temperature that is independent of the temperature of the test substrate by a temperature-controlling device, and this temperature is held constant.

摘要翻译： 在用于在限定的热条件下测试测试基板的方法和装置中，待测试的基板由温度可控的卡盘保持并设定在限定的温度; 测试基板通过至少一个定位装置相对于测试探针定位; 并且测试探针与测试基板接触以进行测试。 存在于受温度控制的测试基板附近的定位装置的至少一个部件通过温度控制装置设定为与测试基板的温度无关的温度，并且该温度保持恒定。

公开(公告)号：US08344744B2

公开(公告)日：2013-01-01

申请号：US12818442

申请日：2010-06-18

申请人： Axel Schmidt ,  Botho Hirschfeld ,  Stojan Kanev ,  Andrej Rumiantsev ,  Michael Teich

发明人： Axel Schmidt ,  Botho Hirschfeld ,  Stojan Kanev ,  Andrej Rumiantsev ,  Michael Teich

IPC分类号： G01R31/00

CPC分类号： G01R31/2886 ,  G01R1/18

摘要： An arrangement is provided for testing DUTs with a chuck that has a support surface for supporting of a DUT as well as for supplying the support surface with a defined potential, or for connecting the DUT. The arrangement further includes a positioning device for positioning the chuck as well as an electromagnetic shielding housing enclosing at least the chuck. Inside the housing and adjacent to the chuck, a signal preamplifier is arranged whose signal port facing the chuck is electrically connected with the support surface, wherein the signal preamplifier is moveable together with the chuck by the positioning device in a way that it holds its position constant relative to the chuck during positioning. The signal preamplifier is connected to a measurement unit outside of the housing via a measurement cable.

摘要翻译： 提供了一种用于使用具有用于支撑DUT的支撑表面以及用于向支撑表面提供限定电位或用于连接DUT的卡盘来测试DUT的布置。 该装置还包括用于定位卡盘的定位装置以及至少包围卡盘的电磁屏蔽壳体。 在壳体内部和卡盘附近，布置了一个信号前置放大器，其信号端口面向卡盘与支撑表面电连接，其中信号前置放大器可以通过定位装置与卡盘一起移动，使其保持其位置 在定位期间相对于卡盘是恒定的。 信号前置放大器通过测量电缆连接到壳体外部的测量单元。

公开(公告)号：US20110241711A1

公开(公告)日：2011-10-06

申请号：US13119145

申请日：2009-07-31

申请人： Michael Teich ,  Stojan Kanev ,  Hans-Jurgen Fleischer

发明人： Michael Teich ,  Stojan Kanev ,  Hans-Jurgen Fleischer

IPC分类号： G01R31/00

CPC分类号： G01R1/0408 ,  G01R31/2855 ,  G01R31/2874 ,  G01R31/2875 ,  G01R31/2886

摘要： A method and an apparatus for verifying or testing test substrates, i.e. wafers and other electronic semiconductor components, in a prober under defined thermal conditions. Such a verifying apparatus, known to the person skilled in the art as a prober, has a housing having at least two housing sections, in one housing section of which, designated hereinafter as test chamber, the test substrate to be verified is held by a chuck and is set to a defined temperature, and in the other housing section of which, designated hereinafter as probe chamber, probes are held. For verification purposes, the test substrate and the probes are positioned relative to one another by means of at least one positioning device and the probes subsequently make contact with the test substrate.

摘要翻译： 一种用于在确定的热条件下在探测器中验证或测试测试基板，即晶片和其它电子半导体部件的方法和装置。 这种本领域技术人员已知的探测器的验证装置具有壳体，该壳体具有至少两个壳体部分，在其一个壳体部分中，下文称为测试室，待验证的测试基板由 卡盘并设定在限定的温度，并且在其另一个壳体部分中，下文称为探针室，探针被保持。 为了验证目的，测试基板和探针通过至少一个定位装置相对于彼此定位，并且探头随后与测试基板接触。

公开(公告)号：US08692567B2

公开(公告)日：2014-04-08

申请号：US13119145

申请日：2009-07-31

申请人： Michael Teich ,  Stojan Kanev ,  Hans-Jurgen Fleischer

发明人： Michael Teich ,  Stojan Kanev ,  Hans-Jurgen Fleischer

IPC分类号： G01R31/00 ,  G01R31/28

CPC分类号： G01R1/0408 ,  G01R31/2855 ,  G01R31/2874 ,  G01R31/2875 ,  G01R31/2886

摘要： A method and an apparatus for verifying or testing test substrates, i.e. wafers and other electronic semiconductor components, in a prober under defined thermal conditions. Such a verifying apparatus, known to the person skilled in the art as a prober, has a housing having at least two housing sections, in one housing section of which, designated hereinafter as test chamber, the test substrate to be verified is held by a chuck and is set to a defined temperature, and in the other housing section of which, designated hereinafter as probe chamber, probes are held. For verification purposes, the test substrate and the probes are positioned relative to one another by means of at least one positioning device and the probes subsequently make contact with the test substrate.

摘要翻译： 一种用于在确定的热条件下在探测器中验证或测试测试基板，即晶片和其它电子半导体部件的方法和装置。 这种本领域技术人员已知的探测器的验证装置具有壳体，该壳体具有至少两个壳体部分，在其一个壳体部分中，下文称为测试室，待验证的测试基板由 卡盘并设定在限定的温度，并且在其另一个壳体部分中，下文称为探针室，探针被保持。 为了验证目的，测试基板和探针通过至少一个定位装置相对于彼此定位，并且探头随后与测试基板接触。

公开(公告)号：US07038441B2

公开(公告)日：2006-05-02

申请号：US10677524

申请日：2003-10-02

申请人： Karsten Stoll ,  Stefan Kreissig ,  Alf Wachtveitl ,  Michael Teich ,  Stefan Schneidewind ,  Claus Dietrich ,  Jorg Kiesewetter ,  Dietmar Runge

发明人： Karsten Stoll ,  Stefan Kreissig ,  Alf Wachtveitl ,  Michael Teich ,  Stefan Schneidewind ,  Claus Dietrich ,  Jorg Kiesewetter ,  Dietmar Runge

IPC分类号： G01R31/02

CPC分类号： G01R31/2865 ,  G01R31/2806 ,  G01R31/2831 ,  G01R31/2887

摘要： The invention, which relates to a test apparatus with loading device which has a chuck, which is provided with a bearing surface for a test substrate and with a chuck drive, by means of which the chuck can be displaced with a working area, and which has a receiving means for receiving test substrates, which can be displaced from a working area of the chuck to a receiving position outside the working area, is based on the object of increasing the accuracy of the movement of the chuck. Moreover, in the case of test apparatus with a controlled atmosphere, a further object is to prevent the chuck from being exposed to the open-air atmosphere. This is achieved by virtue of the fact that a carriage, which can be displaced between a position close to the chuck, in which the chuck is located in a position inside the working area, and the receiving position, is provided, which carriage is provided with a holder, in which the test substrate can be at least indirectly inserted in such a way that the test substrate, when the carriage is in the position close to the chuck, is located above the chuck. The holder and the chuck can move vertically relative to one another when the carriage is in the position close to the chuck.

摘要翻译： 本发明涉及具有卡盘的装载装置的测试装置，其具有用于测试基板的轴承表面和卡盘驱动装置，通过该卡盘驱动器卡盘可以移动工作区域，并且其中 具有用于接收可以从卡盘的工作区域移动到工作区域外部的接收位置的测试基板的接收装置，其基础是提高卡盘的运动精度的目的。 此外，在具有受控气氛的测试装置的情况下，另一个目的是防止卡盘暴露于露天气氛。 这是通过以下事实来实现的：提供了可以在卡盘位于工作区域内的位置的接近卡盘的位置之间移动的托架和接收位置，该托架被设置 具有保持器，其中测试基板可以至少间接地插入，使得当托架处于靠近卡盘的位置时，测试基板位于卡盘上方。 当托架位于靠近卡盘的位置时，托架和夹头可以相对于彼此垂直移动。

公开(公告)号：US20110013011A1

公开(公告)日：2011-01-20

申请号：US12847723

申请日：2010-07-30

申请人： Michael Teich ,  Ulf Hackius ,  Juliane Busch ,  Joerg Kiesewetter ,  Axel Becker

发明人： Michael Teich ,  Ulf Hackius ,  Juliane Busch ,  Joerg Kiesewetter ,  Axel Becker

IPC分类号： H04N7/18

CPC分类号： G02B21/365 ,  G02B21/06 ,  G02B21/244 ,  G02B21/26 ,  G02B21/32

摘要： A focused multi-planar image acquisition in real time even while a test object is moving, is achieved with a system and a method for a focused multi-planar image acquisition in a prober. When a surface of a test object is positioned laterally in relation to tips of separated probe needles, a microscope is focused on the surface of the test object at a first time and on a plane of the probe needles at a second time. The objective lens is provided with a microscope objective lens focusing system, which can focus the objective lens, independently of a vertical adjustment drive of the microscope, on the surface of the test object in a first focal plane and in a second focal plane, which is on a level with the probe needle tips.

摘要翻译： 使用用于在探测器中聚焦的多平面图像采集的系统和方法来实现即使在测试对象移动时实时聚焦的多平面图像采集。 当测试对象的表面相对于分离的探针的尖端横向定位时，显微镜在第一时间和第二次在探针的平面上聚焦在测试对象的表面上。 物镜上设有显微镜物镜聚焦系统，该系统可独立于显微镜的垂直调节驱动物体将物镜聚焦在第一焦平面和第二焦平面上的测试物体的表面上， 在探针针尖的水平上。

公开(公告)号：US20100111403A1

公开(公告)日：2010-05-06

申请号：US12619327

申请日：2009-11-16

申请人： Stefan Schineidewind ,  Claus Dietrich ,  Jorg Kiesewetter ,  Michael Teich ,  Thomas Tharigen

发明人： Stefan Schineidewind ,  Claus Dietrich ,  Jorg Kiesewetter ,  Michael Teich ,  Thomas Tharigen

IPC分类号： G06K9/00

CPC分类号： G06T7/74 ,  G06T2207/30148

摘要： A method is provided for increasing the accuracy of the positioning of a first object relative to a second object. The method overcomes the disadvantageous influence of thermal drift between a first and a second object during a positioning of a first object on a second object. The method finds applications in manufacturing, for example, in the manufacturing of semiconductor components. The method utilizes recognition of structures on the second object which have a minimum structure width. At a first instant, using one recognition procedure, the first object is positioned on the second object in a desired position. The relative displacement of the two objects is determined at the first instant and on at least one subsequent instant. A second recognition procedure may be used for this purpose. The second recognition procedure may have a resolution accuracy which is different than the resolution accuracy of the first resolution procedure. The second recognition procedure may be a pattern recognition method. The relative displacement determined at the second instant is used to correct the positioning of the first and second objects as necessary to maintain a desired position of the two objects.

摘要翻译： 提供了一种用于增加第一物体相对于第二物体的定位精度的方法。 该方法克服了在将第一物体定位在第二物体上时第一和第二物体之间的热漂移的不利影响。 该方法在例如制造半导体部件的制造中得到应用。 该方法利用具有最小结构宽度的第二物体上的结构的识别。 在第一时刻，使用一个识别过程，第一个物体位于第二个物体上所需的位置上。 两个对象的相对位移在第一时刻和至少一个后续时刻确定。 为此目的可以使用第二识别程序。 第二识别程序可以具有与第一解析过程的分辨率精度不同的分辨率精度。 第二识别程序可以是模式识别方法。 在第二时刻确定的相对位移用于根据需要校正第一和第二物体的定位，以保持两个物体的期望位置。

公开(公告)号：US20080173697A1

公开(公告)日：2008-07-24

申请号：US12018506

申请日：2008-01-23

申请人： Enrico Herz ,  Michael Teich ,  Axel Becker

发明人： Enrico Herz ,  Michael Teich ,  Axel Becker

IPC分类号： B23K31/02 ,  B23Q16/00 ,  B23K26/00

CPC分类号： B23K3/0623 ,  H05K3/225 ,  H05K3/3478 ,  H05K2203/0113 ,  H05K2203/0338

摘要： Disclosed is a method and apparatus for the correction of defective solder bump arrays arranged in a plurality of cavities in a mold. In the method, a faulty solder bump is searched, identified and located (i.e., its position is determined) in an arrangement of solder bumps disposed in cavities of a mold and the faulty solder bump is subsequently replaced by a prefabricated solder bump. The apparatus for carrying out the method comprises a mold holder, a scanning and locating device for finding and locating faulty solder bumps and a repair device for replacing the faulty solder bump by a prefabricated solder bump.

摘要翻译： 公开了一种用于校正布置在模具中的多个空腔中的有缺陷的焊料凸块阵列的方法和装置。 在该方法中，在布置在模具的空腔中的焊料凸块的布置中搜索，识别和定位故障的焊料凸块（即，其位置），并且随后由预制的焊料凸块代替故障的焊料凸块。 用于执行该方法的装置包括：模具夹持器，用于发现和定位故障焊料凸块的扫描和定位装置;以及用于通过预制焊料凸块来替换故障焊料凸块的修复装置。