公开(公告)号：US20060114582A1

公开(公告)日：2006-06-01

申请号：US11111457

申请日：2005-04-20

申请人： Young Hwang ,  Yeong Lee ,  Ohk Lim

发明人： Young Hwang ,  Yeong Lee ,  Ohk Lim

IPC分类号： G02B7/02

CPC分类号： G02B26/0808

摘要： Disclosed herein is a light modulator module package, which is advantageous because a size of the module package is minimized and heat is efficiently dispersed while the optical properties of a light modulator device are maintained.

公开(公告)号：US20060198000A1

公开(公告)日：2006-09-07

申请号：US11347187

申请日：2006-02-03

申请人： Heung Park ,  Yeong Lee ,  Suk Hong ,  Chang Park ,  Ohk Lim

发明人： Heung Park ,  Yeong Lee ,  Suk Hong ,  Chang Park ,  Ohk Lim

IPC分类号： G03H1/10

CPC分类号： G02B26/0833 ,  G03H2225/24 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/051 ,  H01L2224/05553 ,  H01L2224/05568 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48463 ,  H01L2924/1461 ,  H01L2924/00014

摘要： Disclosed herein is an optical modulator module package using a flip-chip mounting technology, in which an optical modulator device is hermetically mounted using the flip-chip mounting technology. The optical modulator device is protected from an external environment, it is easy to transmit an electrical signal to the exterior, and optical characteristics of the optical modulator device are desirably maintained.

摘要翻译： 本文公开了一种使用倒装芯片安装技术的光调制器模块封装，其中使用倒装芯片安装技术将光调制器装置气密地安装。 光调制器装置被保护免受外部环境的影响，容易将电信号传输到外部，并且希望保持光调制器件的光学特性。

公开(公告)号：US20060076666A1

公开(公告)日：2006-04-13

申请号：US11180979

申请日：2005-07-12

申请人： Yeong Lee ,  Suk Hong

发明人： Yeong Lee ,  Suk Hong

IPC分类号： H01L23/24

CPC分类号： B81C1/00269 ,  B81C2203/019 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A micro-electro-mechanical system (MEMS) package having a hydrophobic layer is disclosed. The MEMS package includes: a base substrate, with an MEMS element provided on a surface of the base substrate; a lid, spaced apart from the MEMS element provided on the base substrate and covering the MEMS element; a side sealing member provided on a side surface of the base substrate and the surface of the lid, thus hermetically sealing the MEMS element from an external environment; and a hydrophobic layer which covers the part of the side sealing member that is exposed to the external environment, thus removing the hydrophilia from the side sealing member.

摘要翻译： 公开了一种具有疏水层的微机电系统（MEMS）封装。 MEMS封装包括：基底基板，其具有设置在基底基板的表面上的MEMS元件; 与设置在基底基板上并覆盖MEMS元件的MEMS元件间隔开的盖; 侧密封构件，设置在基底基板的侧面和盖的表面上，从而将MEMS元件从外部环境密封; 以及覆盖侧面密封构件暴露于外部环境的部分的疏水层，从而从侧面密封构件除去亲水性。

公开(公告)号：US20060076692A1

公开(公告)日：2006-04-13

申请号：US11245413

申请日：2005-10-06

申请人： Yeong Lee ,  Jong Song ,  Sang Yun ,  Heung Park ,  Chang Park

发明人： Yeong Lee ,  Jong Song ,  Sang Yun ,  Heung Park ,  Chang Park

IPC分类号： H01L23/48

CPC分类号： H05K3/323 ,  B81B2207/093 ,  B81C1/00301 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29399 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73265 ,  H01L2224/811 ,  H01L2224/81191 ,  H01L2224/81855 ,  H01L2224/83101 ,  H01L2224/83136 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/1461 ,  H05K3/321 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A semiconductor package using flip-chip mounting technique is disclosed. The semiconductor package includes: a semiconductor device provided with a plurality of first pads extending from the semiconductor device; a substrate provided with a plurality of second pads extending from the substrate at positions in registry with the location of the first pads of the semiconductor device; and an anisotropic conductive material interposed between the plurality of first pads and the plurality of second pads to electrically connect the first pads to associated second pads, the anisotropic conductive material positioned at discrete locations around the semiconductor device, thereby providing unobstructed clearance at desired locations between the semiconductor device and the substrate.

摘要翻译： 公开了使用倒装芯片安装技术的半导体封装。 半导体封装包括：半导体器件，其设置有从半导体器件延伸的多个第一焊盘; 衬底，其设置有与所述半导体器件的所述第一焊盘的位置对准的位置处从所述衬底延伸的多个第二焊盘; 以及插入在所述多个第一焊盘和所述多个第二焊盘之间的各向异性导电材料，以将所述第一焊盘电连接到相关联的第二焊盘，所述各向异性导电材料定位在所述半导体器件周围的离散位置处，从而在 半导体器件和衬底。

公开(公告)号：US20050078920A1

公开(公告)日：2005-04-14

申请号：US10734146

申请日：2003-12-15

申请人： Yeong Lee ,  Seong Lee ,  Sung Jung ,  Moo Park ,  Suk Hong

发明人： Yeong Lee ,  Seong Lee ,  Sung Jung ,  Moo Park ,  Suk Hong

IPC分类号： G02B6/26 ,  B81B7/02 ,  G02B6/00 ,  G02B6/35 ,  G02B6/36 ,  G02B6/38 ,  G02B6/42 ,  G02B26/08 ,  H04B10/00 ,  H04B10/40 ,  H04B10/50 ,  H04B10/60

CPC分类号： G02B6/3582 ,  G02B6/266 ,  G02B6/3552 ,  G02B6/3594 ,  G02B6/36 ,  G02B6/3887 ,  G02B6/4248

摘要： The present invention relates to a micro optical communication device package. The package of the invention comprises a Micro-Electro-Mechanical System (MEMS) chip for executing an optical communication function. The MEMS chip is mounted on a base. An upper housing having an opened bottom is placed on the base to form an internal space together with the base. The upper housing is sealed with the base to hermetically seal the MEMS chip within the internal space. The MEMS chip is connected an optical fiber, which is extended through the upper housing to form a light path. A boot is fit around the optical fiber and fixed to the upper housing to seal a portion of the upper housing for allowing passage of the optical fiber.

摘要翻译： 本发明涉及一种微型光通信设备封装。 本发明的封装包括用于执行光通信功能的微机电系统（MEMS）芯片。 MEMS芯片安装在基座上。 具有开口底部的上壳体被放置在基座上以与基部一起形成内部空间。 上壳体与基座密封，以将MEMS芯片密封在内部空间内。 MEMS芯片连接有光纤，该光纤通过上壳体延伸以形成光路。 导光罩装在光纤周围并固定在上壳体上，以密封上壳体的一部分，以允许光纤通过。

公开(公告)号：US20060103964A1

公开(公告)日：2006-05-18

申请号：US10987417

申请日：2004-11-12

申请人： Sang Chu ,  Kang Lee ,  Jong Yun ,  Yeong Lee

发明人： Sang Chu ,  Kang Lee ,  Jong Yun ,  Yeong Lee

IPC分类号： G11B5/02 ,  G11B5/09

CPC分类号： G11B5/40

摘要： A hard disk drive that changes a variable write parameter of a head during a write operation. The controller can change the variable write parameter to compensate for a transient temperature profile of the head during the initial stage of a write operation. By way of example, the controller can provide a relatively large overshoot control signal of a head during the writing of a first sector of a write operation. The value of the overshoot control signal may be decremented for a second sector, a third sector etc., until the head attains a thermal steady state at which point the overshoot control signal is provided with a constant value.

摘要翻译： 在写入操作期间更改头的可变写入参数的硬盘驱动器。 控制器可以改变可变写入参数，以在写入操作的初始阶段补偿磁头的瞬态温度曲线。 作为示例，控制器可以在写操作的第一扇区的写入期间提供头的相对较大的过冲控制信号。 对于第二扇区，第三扇区等，过冲控制信号的值可以减小，直到磁头达到热稳定状态，在该点处，过冲控制信号被提供有恒定值。

公开(公告)号：US20060081951A1

公开(公告)日：2006-04-20

申请号：US11180302

申请日：2005-07-12

申请人： Suk Hong ,  Dong Park ,  Yeong Lee

发明人： Suk Hong ,  Dong Park ,  Yeong Lee

IPC分类号： H01L29/82

CPC分类号： B81C1/00293 ,  B81B2203/0384 ,  B81C2203/019 ,  H01L24/81

摘要： A micro-electro-mechanical system (MEMS) package having a side double-sealing member and method of manufacturing the MEMS package is disclosed. The MEMS package is formed by forming a metal layer on a base substrate by patterning so that the metal layer surrounds an MEMS element provided on the base substrate, joining a lid glass to the metal layer, and providing a side double-sealing member on a surface of the base substrate and a side surface of the lid glass, thus hermetically sealing the MEMS element from the external environment. The MEMS package includes a base substrate, with an MEMS element provided on a surface of the base substrate; a lid glass joined to the base substrate such that the lid glass covers the MEMS element and transmits incident light; a dam sealing member provided on a surface of the base substrate and a side surface of the lid glass, thus hermetically sealing the MEMS element from the external environment; and a second sealing member deposited on an upper surface of the dam sealing member such that the second sealing member is provided on the surface of the base substrate and the side surface of the lid glass, thus secondarily hermetically sealing the MEMS element from the external environment.

摘要翻译： 公开了一种具有侧面双密封构件的微机电系统（MEMS）封装以及MEMS封装的制造方法。 MEMS封装通过图案化在基底基板上形成金属层而形成，使得金属层围绕设置在基底基板上的MEMS元件，将盖玻璃接合到金属层，并在其上提供侧面双重密封构件 基底基板的表面和盖玻璃的侧表面，从而将MEMS元件从外部环境气密地密封。 MEMS封装包括基底基板，其中MEMS元件设置在基底基板的表面上; 连接到基底基板上的盖玻璃使得盖玻璃覆盖MEMS元件并透射入射光; 设置在基底基板的表面和盖玻璃的侧面的坝密封构件，从而将MEMS元件从外部环境气密地密封; 以及第二密封构件，其沉积在所述坝密封构件的上表面上，使得所述第二密封构件设置在所述基底基板的表面和所述盖玻璃的侧表面上，从而二次将所述MEMS元件与所述外部环境密封 。

公开(公告)号：US20060078256A1

公开(公告)日：2006-04-13

申请号：US11244769

申请日：2005-10-06

申请人： Yeong Lee ,  Dong Shin ,  Heung Park ,  Jun An ,  Yurlov Victor

发明人： Yeong Lee ,  Dong Shin ,  Heung Park ,  Jun An ,  Yurlov Victor

IPC分类号： G02B6/32 ,  G02B6/26 ,  G02B6/42

CPC分类号： G02B26/0858 ,  G02B26/0808

摘要： Disclosed herein is a light modulator package having an inclined light transmissive lid which is manufactured or positioned such that a surface of the light transmissive lid is inclined relative to a reflective surface of a light modulating array.

摘要翻译： 本文公开了一种光调制器封装，其具有制造或定位的倾斜透光盖，使得透光盖的表面相对于光调制阵列的反射表面倾斜。

公开(公告)号：US20050031795A1

公开(公告)日：2005-02-10

申请号：US10909892

申请日：2004-08-02

申请人： Manoj Chaudhury ,  Andrew Goodwin ,  Yeong Lee ,  Bhukandas Parbhoo ,  Geoffrey Gardner

发明人： Manoj Chaudhury ,  Andrew Goodwin ,  Yeong Lee ,  Bhukandas Parbhoo ,  Geoffrey Gardner

IPC分类号： H01L21/52 ,  C09J5/02 ,  H01L21/48 ,  H01L21/58 ,  H05K3/30 ,  H05K3/38 ,  H05H1/00

CPC分类号： H01L24/83 ,  C09J5/02 ,  C09J2400/226 ,  C09J2483/006 ,  H01L21/481 ,  H01L24/29 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/29298 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19042 ,  H01L2924/30107 ,  H05K3/305 ,  H05K3/381 ,  H01L2924/0715 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

摘要： A method for creating adhesion includes plasma treating two substrates and thereafter contacting the substrates. The method can be used on a variety of dry surfaces. The method is used to adhere nonadhesive surfaces such as a cured silicone with a ceramic or semiconductor.

摘要翻译： 用于产生粘合的方法包括等离子体处理两个基板，然后接触基板。 该方法可用于各种干燥表面。 该方法用于粘附非粘附表面，例如具有陶瓷或半导体的固化的硅氧烷。

公开(公告)号：US07485202B2

公开(公告)日：2009-02-03

申请号：US10571435

申请日：2004-08-03

申请人： Debra Soliz ,  Yeong Lee

发明人： Debra Soliz ,  Yeong Lee

IPC分类号： B29C65/00 ,  B32B37/00 ,  B32B38/04 ,  B32B38/14 ,  C09J5/02 ,  H01L21/00 ,  H01L21/31

CPC分类号： H01L21/67126 ,  H01L21/6715 ,  H01L23/3128 ,  H01L24/27 ,  H01L24/29 ,  H01L24/73 ,  H01L24/743 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/29198 ,  H01L2224/29499 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/743 ,  H01L2224/83136 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83855 ,  H01L2224/83856 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2225/06586 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/0715 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/01007 ,  H01L2924/01031 ,  H01L2924/00012

摘要： A method for preparing flat-top pads in electronic components includes the steps of: a) stencil printing a flat-top deposit of a curable silicone composition onto a first electronic substrate, where the first electronic substrate is selected from a semiconductor die or a semiconductor die attachment member, where stencil printing the flat-top deposit is performed by squeegee through a down-step stencil; b) curing the flat-top deposit to form a flat-top pad; optionally c) adhering a second electronic substrate to the top of the flat-top pad, where the second electronic substrate is selected from a semiconductor die or a semiconductor die attachment member; and optionally d) repeating steps a), b) and c).

摘要翻译： 一种用于制备电子部件中的平顶焊盘的方法包括以下步骤：a）将可固化硅酮组合物的平顶沉积物模版印刷到第一电子基板上，其中第一电子基板选自半导体管芯或半导体 模具附接构件，其中通过刮板通过下压模板执行平板印刷平顶沉积物; b）固化平顶沉积物以形成平顶垫; 可选地，c）将第二电子基板粘附到平顶焊盘的顶部，其中第二电子基板选自半导体管芯或半导体管芯附接构件; 和d）重复步骤a），b）和c）。