公开(公告)号：US07227267B2

公开(公告)日：2007-06-05

申请号：US11245413

申请日：2005-10-06

申请人： Yeong Gyu Lee ,  Jong Hyeong Song ,  Sang Kyeong Yun ,  Heung Woo Park ,  Chang Su Park

发明人： Yeong Gyu Lee ,  Jong Hyeong Song ,  Sang Kyeong Yun ,  Heung Woo Park ,  Chang Su Park

IPC分类号： H01L23/48

CPC分类号： H05K3/323 ,  B81B2207/093 ,  B81C1/00301 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29399 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73265 ,  H01L2224/811 ,  H01L2224/81191 ,  H01L2224/81855 ,  H01L2224/83101 ,  H01L2224/83136 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/1461 ,  H05K3/321 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A semiconductor package using flip-chip mounting technique is disclosed. The semiconductor package includes: a semiconductor device provided with a plurality of first pads extending from the semiconductor device; a substrate provided with a plurality of second pads extending from the substrate at positions in registry with the location of the first pads of the semiconductor device; and an anisotropic conductive material interposed between the plurality of first pads and the plurality of second pads to electrically connect the first pads to associated second pads, the anisotropic conductive material positioned at discrete locations around the semiconductor device, thereby providing unobstructed clearance at desired locations between the semiconductor device and the substrate.

摘要翻译： 公开了使用倒装芯片安装技术的半导体封装。 半导体封装包括：半导体器件，其设置有从半导体器件延伸的多个第一焊盘; 衬底，其设置有与所述半导体器件的所述第一焊盘的位置对准的位置处从所述衬底延伸的多个第二焊盘; 以及插入在所述多个第一焊盘和所述多个第二焊盘之间的各向异性导电材料，以将所述第一焊盘电连接到相关联的第二焊盘，所述各向异性导电材料定位在所述半导体器件周围的离散位置处，从而在 半导体器件和衬底。

公开(公告)号：US20060078247A1

公开(公告)日：2006-04-13

申请号：US11244563

申请日：2005-10-06

申请人： Yeong Gyu Lee ,  Jong Hyeong Song ,  Heung Woo Park ,  Suk Kee Hong ,  Chang Su Park ,  Ohk Kun Lim

发明人： Yeong Gyu Lee ,  Jong Hyeong Song ,  Heung Woo Park ,  Suk Kee Hong ,  Chang Su Park ,  Ohk Kun Lim

IPC分类号： G02B6/12

CPC分类号： G02B6/4232

摘要： Disclosed herein is a package structure for an optical modulator, which is configured such that an optical modulating device and electronic control circuitry are incorporated into a module, thus allowing the manufacture of a compact module while maintaining the optical properties of the optical modulating device.

摘要翻译： 这里公开了一种用于光学调制器的封装结构，其被配置为使得光学调制装置和电子控制电路并入模块中，从而允许制造紧凑的模块，同时保持光学调制装置的光学特性。

公开(公告)号：US07394139B2

公开(公告)日：2008-07-01

申请号：US11347187

申请日：2006-02-03

申请人： Heung Woo Park ,  Yeong Gyu Lee ,  Suk Kee Hong ,  Chang Su Park ,  Ohk Kun Lim

发明人： Heung Woo Park ,  Yeong Gyu Lee ,  Suk Kee Hong ,  Chang Su Park ,  Ohk Kun Lim

IPC分类号： H01L27/14 ,  H01L31/00

CPC分类号： G02B26/0833 ,  G03H2225/24 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/051 ,  H01L2224/05553 ,  H01L2224/05568 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48463 ,  H01L2924/1461 ,  H01L2924/00014

摘要： Disclosed herein is an optical modulator module package using a flip-chip mounting technology, in which an optical modulator device is hermetically mounted using the flip-chip mounting technology. The optical modulator device is protected from an external environment, it is easy to transmit an electrical signal to the exterior, and optical characteristics of the optical modulator device are desirably maintained.

摘要翻译： 本文公开了一种使用倒装芯片安装技术的光调制器模块封装，其中使用倒装芯片安装技术将光调制器装置气密地安装。 光调制器装置被保护免受外部环境的影响，容易将电信号传输到外部，并且希望保持光调制器件的光学特性。

公开(公告)号：US07343072B2

公开(公告)日：2008-03-11

申请号：US11244769

申请日：2005-10-06

申请人： Yeong Gyu Lee ,  Dong Ho Shin ,  Heung Woo Park ,  Jun Won An ,  Yurlov Victor

发明人： Yeong Gyu Lee ,  Dong Ho Shin ,  Heung Woo Park ,  Jun Won An ,  Yurlov Victor

IPC分类号： G02B6/32 ,  G02B6/26

CPC分类号： G02B26/0858 ,  G02B26/0808

摘要： Disclosed herein is a light modulator package having an inclined light transmissive lid which is manufactured or positioned such that a surface of the light transmissive lid is inclined relative to a reflective surface of a light modulating array.

摘要翻译： 本文公开了一种光调制器封装，其具有制造或定位的倾斜透光盖，使得透光盖的表面相对于光调制阵列的反射表面倾斜。

公开(公告)号：US20120266673A1

公开(公告)日：2012-10-25

申请号：US13185660

申请日：2011-07-19

申请人： Hyun Kee Lee ,  Heung Woo Park ,  Nam Su Park ,  Yeong Gyu Lee ,  Sung Min Cho

发明人： Hyun Kee Lee ,  Heung Woo Park ,  Nam Su Park ,  Yeong Gyu Lee ,  Sung Min Cho

IPC分类号： G01P15/08 ,  H01L21/02

CPC分类号： H01L21/50 ,  G01P15/0802 ,  G01P15/09

摘要： Disclosed herein is an inertial sensor. The inertial sensor includes a sensor unit including a flexible substrate part on which a driving electrode and a sensing electrode are formed, a mass displaceably mounted on the flexible substrate part, and a support body coupled with the flexible substrate part in order to support the mass in a floated state and made of silicon; and a lower cap covering a bottom portion of the mass and made of silicon, wherein the lower cap and the sensor unit are coupled by a silicon direct bonding method, whereby the inertial sensor and the method of manufacturing the same may be obtained to improve the convenience in manufacturing and the reliability of the sensor by bonding the sensor unit and the lower cap by the silicon direct bonding method.

摘要翻译： 这里公开了惯性传感器。 惯性传感器包括传感器单元，其包括形成有驱动电极和感测电极的柔性基板部分，可移动地安装在柔性基板部分上的质量以及与柔性基板部分连接以支撑质量的支撑体 处于漂浮状态，由硅制成; 以及覆盖所述物体的底部并由硅制成的下盖，其中所述下盖和所述传感器单元通过硅直接粘合方法联接，由此可以获得惯性传感器及其制造方法，以改善 通过硅直接粘合法粘合传感器单元和下盖，便于制造和传感器的可靠性。

公开(公告)号：US08505190B2

公开(公告)日：2013-08-13

申请号：US13180289

申请日：2011-07-11

申请人： Hyun Kee Lee ,  Tae Joon Park ,  Sang Kee Yoon ,  Hyung Jae Park ,  Yeong Gyu Lee ,  Heung Woo Park

发明人： Hyun Kee Lee ,  Tae Joon Park ,  Sang Kee Yoon ,  Hyung Jae Park ,  Yeong Gyu Lee ,  Heung Woo Park

IPC分类号： G01R3/00

CPC分类号： G01P15/08 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2203/0315 ,  B81C1/00269 ,  B81C2203/032 ,  G01C19/5663 ,  G01P15/0802 ,  Y10T29/49002 ,  Y10T29/49005 ,  Y10T29/49007 ,  Y10T29/4902 ,  Y10T29/4908 ,  Y10T29/49124

摘要： Disclosed herein is a method of manufacturing an inertial sensor. The method of manufacturing an inertial sensor 100 includes (A) applying a polymer 120 to a base substrate 110, (B) patterning the polymer 120 so as to form an opening part 125 in the polymer 120, (C) completing a cap 130 by forming a cavity 115 on the base substrate 110 exposed fro the opening part 125 through an etching process in a thickness direction, and (D) bonding the cap 130 to a device substrate 140 by using a polymer 120, whereby the polymer 120 is applied to the base substrate 110 in a constant thickness D3, such that the cap 130 may be easily bonded to the device substrate 140 by using the polymer 120.

摘要翻译： 本文公开了一种制造惯性传感器的方法。 制造惯性传感器100的方法包括（A）将聚合物120施加到基底基材110上，（B）图案化聚合物120以在聚合物120中形成开口部分125，（C）通过 通过在厚度方向上的蚀刻工艺在开口部分125上暴露的基底基板110上形成空腔115，以及（D）通过使用聚合物120将盖130连接到器件基板140，由此将聚合物120施加到 基底基板110处于恒定厚度D3，使得帽130可以通过使用聚合物120而容易地结合到装置基板140。

公开(公告)号：US20130081464A1

公开(公告)日：2013-04-04

申请号：US13324879

申请日：2011-12-13

申请人： Heung Woo Park ,  Min Kyu Choi ,  Jong Woon Kim ,  Sung Jun Lee

发明人： Heung Woo Park ,  Min Kyu Choi ,  Jong Woon Kim ,  Sung Jun Lee

IPC分类号： G01C19/56

CPC分类号： G01P15/0802 ,  B81B3/0051 ,  B81B2201/0235 ,  G01C19/5783 ,  G01P2015/0871

摘要： Disclosed herein is an inertial sensor. The inertial sensor includes a sensor part including a driving mass, a flexible substrate part displaceably supporting the driving mass, and a support part supporting the flexible substrate part so that the driving mass is freely movable in a state in which the driving mass is floated; a lower cap covering a lower portion of the driving mass and coupled with the support part and provided with a stopper part limiting a displacement of the driving mass; and a dry film resist coupling the sensor part with the cover and providing an interval between the driving mass and the stopper.

摘要翻译： 这里公开了惯性传感器。 惯性传感器包括传感器部件，其包括驱动质量块，可移动地支撑驱动质量块的柔性基板部分和支撑柔性基板部分的支撑部件，使得驱动质量块在驱动质量块浮起的状态下可自由移动; 下盖覆盖驱动质量块的下部并与支撑部分联接并设置有限制驱动质量块的位移的止动部分; 以及将传感器部分与盖接合并且提供驱动质量块和止动件之间的间隔的干膜。

公开(公告)号：US20120125096A1

公开(公告)日：2012-05-24

申请号：US13283517

申请日：2011-10-27

申请人： Heung Woo Park ,  Won Kyu Jeung ,  Hyun Kee Lee ,  Si Joong Yang

发明人： Heung Woo Park ,  Won Kyu Jeung ,  Hyun Kee Lee ,  Si Joong Yang

IPC分类号： G01C19/56

CPC分类号： G01C19/5783

摘要： Disclosed herein is an inertial sensor which includes a sensing unit including a mass mounted to be displaced on a flexible substrate part, a driving unit moving the mass, and a displacement detecting unit detecting a displacement of the mass, the inertial sensor comprising: a top cap covering a top of the flexible substrate part; and a bottom cap covering a bottom of the mass. Thereby, the inertial sensor can be implemented in an economic EMC molding package shape, while protecting the mass and the piezo-electric element. Further, the inertial sensor optimizes a thickness of the cap covering the mass and the piezo-electric element and an interval between the mass and the piezo-electric element to have improved freedom in design of space utilization as well as improved driving characteristics and Q values.

摘要翻译： 本文公开了一种惯性传感器，其包括感测单元，该感测单元包括安装成在柔性基板部件上移位的质量，移动该质量块的驱动单元和检测该质量块的位移的位移检测单元，该惯性传感器包括：顶部 帽盖覆盖柔性基板部分的顶部; 以及覆盖该质量块底部的底盖。 因此，惯性传感器可以以经济的EMC成型包装形式实现，同时保护质量和压电元件。 此外，惯性传感器优化覆盖质量块和压电元件的盖的厚度以及质量块和压电元件之间的间隔，以提高空间利用设计的自由度以及改善的驱动特性和Q值 。

公开(公告)号：US08973438B2

公开(公告)日：2015-03-10

申请号：US13275397

申请日：2011-10-18

申请人： Jong Woon Kim ,  Sung Jun Lee ,  Won Kyu Jeung ,  Min Kyu Choi ,  Heung Woo Park

发明人： Jong Woon Kim ,  Sung Jun Lee ,  Won Kyu Jeung ,  Min Kyu Choi ,  Heung Woo Park

IPC分类号： G01P1/02 ,  G01P15/12 ,  G01P15/09 ,  G01C19/5769 ,  G01C19/5755 ,  G01P15/08

CPC分类号： G01C25/00 ,  B32B37/0076 ,  B32B37/02 ,  B32B37/12 ,  B32B37/18 ,  B32B38/10 ,  B32B2457/00 ,  C23F1/02 ,  G01C19/5755 ,  G01C19/5769 ,  G01P15/08 ,  G01P15/0802 ,  G01P15/135 ,  G01P2015/084 ,  Y10T156/1064

摘要： Disclosed herein are an inertial sensor and a method of manufacturing the same. The inertial sensor 100 according to a preferred embodiment of the present invention is configured to include a plate-shaped membrane 110, a mass body 120 disposed under a central portion 113 of the membrane 110, a post 130 disposed under an edge 115 of the membrane 110 so as to support the membrane 110, and a bottom cap 150 of which the edge 153 is provided with the first cavity 155 into which an adhesive 140 is introduced, wherein the adhesive 140 bonds an edge 153 to a bottom surface of the post, whereby the edge 153 of the bottom cap 150 is provided with the first cavity 155 to introduce the adhesive 140 into the first cavity 155, thereby preventing the adhesive 140 from being permeated into the post 130.

摘要翻译： 这里公开了惯性传感器及其制造方法。 根据本发明的优选实施例的惯性传感器100被构造成包括板状膜110，设置在膜110的中心部分113下方的质量体120，设置在膜110的边缘115下方的柱130 110，以支撑膜110，底盖150的边缘153设置有第一腔155，粘合剂140被引入到其中，其中粘合剂140将边缘153粘合到柱的底表面， 由此底盖150的边缘153设置有第一腔155以将粘合剂140引入第一腔155中，从而防止粘合剂140渗透到柱130中。

公开(公告)号：US08789417B2

公开(公告)日：2014-07-29

申请号：US13303334

申请日：2011-11-23

申请人： Jong Woon Kim ,  Heung Woo Park ,  Won Kyu Jeung

发明人： Jong Woon Kim ,  Heung Woo Park ,  Won Kyu Jeung

IPC分类号： G01C19/56

CPC分类号： G01P15/08 ,  G01C19/5747 ,  G01P15/18

摘要： Disclosed herein is an inertial sensor including: a driving part displaceably supported by a support; a driving electrode vibrating the driving part; and a detecting electrode detecting a force acting on the driving part in a predetermined direction, wherein the driving part includes: a center driving mass positioned at the center of the inertial sensor; side driving masses connected to and interlocking with the center driving mass and positioned at four sides based on the center driving mass; and connection bridges connecting the center driving mass, the side driving masses, and the support to each other.

摘要翻译： 本文公开了一种惯性传感器，包括：可移动地由支撑件支撑的驱动部分; 驱动电极使所述驱动部振动; 以及检测电极，其在预定方向上检测作用在所述驱动部件上的力，其中所述驱动部件包括：位于所述惯性传感器的中心的中心驱动质量块; 连接到中心驱动质量块并且与中心驱动质量块互锁的侧驱动质量块，并且基于中心驱动质量被定位在四侧; 以及将中心驱动质量块，侧驱动块和支撑件彼此连接的连接桥。