公开(公告)号：US5648006A

公开(公告)日：1997-07-15

申请号：US385968

申请日：1995-02-09

申请人： Suk-Ki Min ,  Moo Sung Kim ,  Seong-Il Kim ,  Yong Kim

发明人： Suk-Ki Min ,  Moo Sung Kim ,  Seong-Il Kim ,  Yong Kim

IPC分类号： H05B3/20 ,  C23C16/46 ,  H05B3/16 ,  H05B3/68

CPC分类号： C23C16/46 ,  H05B3/16

摘要： A heater for a chemical vapor deposition equipment includes a meandering heating wire made of either molybdenum or tungsten and having a diameter of about 1 mm. The heating wire is laid on a heater disc that is made of either molybdenum, tungsten or ceramic. The heater disc is holed at its center for receiving a susceptor rotating shaft. A plurality of heating wire fixtures support the heating wire on the heater disc while spacing the heating wire from the heater disc at an interval, thus to prevent the heating wire from directly contacting the heater disc. Each of the heating wire fixtures is provided with a pair of lateral through holes, that is, a heating wire hole formed in an upper section of each fixture and a fixing wire hole formed in a lower section of each fixture. The heater also includes heat resisting plates that are made of either molybdenum or tungsten and placed on the bottom surface and the side surface of the heater disc for preventing side and downward radiation of the heat of the heating wire. The heater heats a substrate to a high temperature not less than 1500.degree. C. and achieves an excellent heating efficiency.

摘要翻译： 用于化学气相沉积设备的加热器包括由钼或钨制成并具有约1mm直径的曲折加热丝。 加热丝放置在由钼，钨或陶瓷制成的加热盘上。 加热盘在其中心处是用于接收基座旋转轴的。 多个加热线夹具支撑加热盘上的加热线，同时间隔加热丝与加热盘间隔开，从而防止加热线直接接触加热盘。 每个加热线夹具设置有一对横向通孔，即，形成在每个固定装置的上部中的加热丝孔和形成在每个夹具的下部中的固定线孔。 加热器还包括由钼或钨制成并且放置在加热盘的底表面和侧表面上的耐热板，用于防止加热丝的热量的侧向和向下辐射。 加热器将基板加热至不低于1500℃的高温，并实现优良的加热效率。

公开(公告)号：US5888294A

公开(公告)日：1999-03-30

申请号：US609323

申请日：1996-03-01

申请人： Suk-Ki Min ,  Moo Sung Kim ,  Yong Kim

发明人： Suk-Ki Min ,  Moo Sung Kim ,  Yong Kim

IPC分类号： H01L21/205 ,  C30B25/02 ,  H01L21/20 ,  H01L29/06 ,  H01S5/00 ,  C30B25/14

CPC分类号： B82Y30/00 ,  B82Y10/00 ,  B82Y20/00 ,  C30B25/02 ,  C30B29/42

摘要： An improved epitaxial growth rate varying method for a side surface of a semiconductor pattern capable of controlling a growth rate of a side surface of a semiconductor pattern by controlling the amount of CCl.sub.4 gas supplied when forming an epitaxial layer on a patterned GaAs substrate in a metalorganic chemical deposition method, thus fabricating a desired quantum wire, and which is characterized by controlling a side-surface growth rate of an epitaxial layer in accordance with the CCl.sub.4 doping gas flow rate while an epitaxial layer is formed on a patterned GaAs substrate in a metalorganic chemical deposition method and in achieving a desired substantial flatness.

摘要翻译： 一种用于半导体图案的侧表面的改进的外延生长速率变化方法，其能够通过控制在金属有机物的图案化GaAs衬底上形成外延层时供应的CCl 4气体的量来控制半导体图案的侧表面的生长速率 化学沉积方法，从而制造所需的量子线，其特征在于根据CCl4掺杂气体流速控制外延层的侧面生长速率，同时在金属有机物的图案化GaAs衬底上形成外延层 化学沉积方法和实现期望的实质平坦度。

公开(公告)号：US5281551A

公开(公告)日：1994-01-25

申请号：US909935

申请日：1992-07-07

申请人： Suk-ki Min ,  Yong Kim ,  Moo S. Kim

发明人： Suk-ki Min ,  Yong Kim ,  Moo S. Kim

IPC分类号： H01L21/205 ,  H01L29/36 ,  H01L21/20

CPC分类号： H01L21/02584 ,  H01L21/02381 ,  H01L21/02463 ,  H01L21/02546 ,  H01L21/0262 ,  H01L21/02658 ,  H01L29/365 ,  Y10S438/925

摘要： The technique of the delta-doping by metalorganic chemical vapor deposition (MOCVD) in GaAs epitaxial layer at 700.degree.-750.degree. C. after deposition of GaAs heteroepitaxial buffer layer exceeding 3 .mu.m thickness on silicon substrate.

摘要翻译： 在硅衬底上沉积超过3（μm）厚度的GaAs异质外延缓冲层之后，在700℃-750℃下，通过金属有机化学气相沉积（MOCVD）在GaAs外延层中进行δ掺杂的技术。

公开(公告)号：US20070155033A1

公开(公告)日：2007-07-05

申请号：US11649914

申请日：2007-01-05

申请人： Yong Kim ,  Seog Choi ,  Yong Kim ,  Sang Shin

发明人： Yong Kim ,  Seog Choi ,  Yong Kim ,  Sang Shin

IPC分类号： H01L21/00

CPC分类号： B29C41/12 ,  B29C41/20 ,  B29C41/36 ,  B29C41/50 ,  B29L2011/00 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A method of manufacturing an LED package. The method includes dispensing a transparent resilient resin on an LED package body and overturning an entire structure to form an LED lens integrally provided to the LED package body. This prevents extra processes and costs incurring from forming intermediate layers and obviates degradation in reliability and light extraction efficiency due to additional interfaces.

摘要翻译： 一种制造LED封装的方法。 该方法包括将透明弹性树脂分配在LED封装主体上并翻转整个结构以形成一体地提供到LED封装体的LED透镜。 这防止了由于附加界面而形成中间层而导致额外的工艺和成本，并且消除了可靠性和光提取效率的降低。

公开(公告)号：US20060121815A1

公开(公告)日：2006-06-08

申请号：US10521196

申请日：2003-07-15

申请人： Yong Kim ,  Yong Kim ,  Sung Cho

发明人： Yong Kim ,  Yong Kim ,  Sung Cho

IPC分类号： H01J9/24

CPC分类号： H01J9/242 ,  H01J11/12 ,  H01J11/36

摘要： Disclosed is a method of manufacturing rear plate barrier ribs for Plasma Display Panel (PDP), which includes the steps of: forming barrier ribs by infiltrating the barrier rib forming paste into grooves of a mold by using the capillary phenomenon, and then sintering the paste. This method causes rare environmental pollution, enables to make barrier ribs having fine and complex shapes and reduces material costs required for the barrier rib. Thus, the method may improve quality of PDP and reduce manufacture costs of the rear plate.

摘要翻译： 公开了一种制造等离子体显示面板（PDP）的后板阻挡肋的方法，其包括以下步骤：通过使用毛细管现象将隔壁形成膏渗透到模具的凹槽中，然后烧结浆料 。 这种方法造成罕见的环境污染，能够形成具有精细和复杂形状的隔肋，并且减少隔壁所需的材料成本。 因此，该方法可以提高PDP的质量并降低后板的制造成本。

公开(公告)号：US20070063214A1

公开(公告)日：2007-03-22

申请号：US11524278

申请日：2006-09-21

申请人： Yong Kim ,  Seog Choi ,  Chang Lim ,  Yong Kim

发明人： Yong Kim ,  Seog Choi ,  Chang Lim ,  Yong Kim

IPC分类号： H01L33/00

CPC分类号： H01L33/507 ,  H01L33/58

摘要： The invention relates to a light emitting diode package that can prevent deterioration of phosphor and a method of manufacturing the same. The light emitting diode package includes a package body having a recessed part, a light emitting diode chip mounted on a floor surface of the recessed part and a lens structure disposed on an upper surface of the package body, apart from the light emitting diode chip. Phosphor is dispersed in at least a part of the lens structure.

摘要翻译： 本发明涉及能够防止荧光体劣化的发光二极管封装及其制造方法。 发光二极管封装包括具有凹部的封装主体，安装在凹部的地板表面上的发光二极管芯片和设置在封装体的上表面上的透镜结构，与发光二极管芯片分开。 荧光体分散在透镜结构的至少一部分中。

公开(公告)号：US20050156522A1

公开(公告)日：2005-07-21

申请号：US10510036

申请日：2002-04-08

申请人： Yong Kim ,  Jin Hwang ,  Yong Kim

发明人： Yong Kim ,  Jin Hwang ,  Yong Kim

IPC分类号： H01J9/24 ,  H01J11/12 ,  H01J11/36 ,  H01J17/49

CPC分类号： H01J9/242 ,  H01J11/12 ,  H01J11/36 ,  H01J2211/366

摘要： Disclosed is a method of manufacturing barrier ribs for a Plasma Display Panel (PDP), which includes the steps of forming a thick film (or, “green tape”) for barrier ribs on a glass or metal substrate by using composition for forming the barrier ribs, which contains water soluble components and solvent soluble components together a binder; forming a protective pattern film partially soluble or insoluble to the water based solution on the thick film; etching the thick film into a barrier rib shape by using solution or mixed solution containing ceramic powder as an etching accelerator, and sintering the etched thick film. This method causes rare environmental pollution, enables to make barrier ribs having fine and complex shapes and reduces material costs required for the barrier rib. Thus, the method may improve quality of DPD and reduce manufacture costs of the rear plate.

摘要翻译： 公开了一种制造用于等离子体显示面板（PDP）的隔壁的方法，其包括以下步骤：通过使用用于形成屏障的组合物在玻璃或金属基板上形成用于隔壁的厚膜（或“生胶条”） 肋骨，其含有水溶性成分和溶剂可溶性成分在一起的粘合剂; 在厚膜上形成部分溶解或不溶于水基溶液的保护性图案膜; 通过使用含有陶瓷粉末作为蚀刻加速剂的溶液或混合溶液将厚膜蚀刻成隔壁形状，并烧结蚀刻的厚膜。 这种方法造成罕见的环境污染，能够形成具有精细和复杂形状的隔肋，并且减少隔壁所需的材料成本。 因此，该方法可以提高DPD的质量并降低后板的制造成本。

公开(公告)号：US20060270078A1

公开(公告)日：2006-11-30

申请号：US11439189

申请日：2006-05-24

申请人： Yong Kim ,  Seog Choi ,  Hyoung Kim ,  Yong Kim

发明人： Yong Kim ,  Seog Choi ,  Hyoung Kim ,  Yong Kim

IPC分类号： H01L21/00

CPC分类号： H01L33/52 ,  H01L2224/48091 ,  H01L2224/48227 ,  Y10S438/974 ,  H01L2924/00014

摘要： The invention relates to an LED package and proposes a method of fabricating an LED package including steps of providing a package substrate having a mounting area of an LED and a metal pattern to be connected with the LED, and plasma-treating the package substrate to reform at least a predetermined surface area of the package substrate where a resin-molded part will be formed. The method also includes mounting the LED on the mounting area on the substrate package and electrically connecting the LED with the metal pattern, and forming the resin-molded part in the mounting area of the LED to seal the LED package.

摘要翻译： 本发明涉及一种LED封装，并提出了一种制造LED封装的方法，包括以下步骤：提供具有LED的安装区域和与LED连接的金属图案的封装基板，以及等离子体处理封装基板以改造 至少形成将形成树脂成型部件的封装基板的预定表面积。 该方法还包括将LED安装在基板封装上的安装区域上，并将LED与金属图形电连接，并在LED的安装区域中形成树脂模制部件以密封LED封装。

公开(公告)号：US20050233763A1

公开(公告)日：2005-10-20

申请号：US11050802

申请日：2005-02-07

申请人： Yong Kim ,  Yong Kim

发明人： Yong Kim ,  Yong Kim

IPC分类号： H04B1/38 ,  G06K7/00 ,  H04M1/00 ,  H04M1/02

CPC分类号： H04B1/3816 ,  G06K7/0021 ,  G06K7/0034 ,  H04M1/026

摘要： A dual connection device for memory mediums has a body portion electrically connected with a mobile communication terminal, a first receiving portion formed to the body portion for receiving therein a first memory medium, a second receiving portion formed to the body portion as to be arranged piled up to the first receiving portion for receiving therein a second memory medium, a first connection terminal installed in the first receiving portion so as to be electrically connected with a terminal of the first memory medium, and a second connection terminal installed in the second receiving portion so as to be electrically connected with a terminal of the second memory medium. Since a plurality of memory mediums are connected with a terminal mobile communication terminal by the connection device, it is possible to make the mobile communication terminal have a slim and compact size, accomplish a simplified assembly process, and obtain increased productivity and cost reduction due to simplification of assembly process.

摘要翻译： 用于存储介质的双连接装置具有与移动通信终端电连接的主体部分，形成在主体部分上用于在其中容纳第一存储介质的第一接收部分，形成在主体部分上的第二接收部分，以布置成堆 直到第一接收部分用于在其中接收第二存储介质;第一连接端子，安装在第一接收部分中以便与第一存储介质的端子电连接，第二连接端子安装在第二接收部分中 以便与第二存储介质的端子电连接。 由于多个存储介质通过连接装置与终端移动通信终端连接，所以可以使移动通信终端具有纤细且紧凑的尺寸，实现简化的组装过程，并且由于 装配过程简化。

公开(公告)号：US08779037B2

公开(公告)日：2014-07-15

申请号：US12919423

申请日：2008-12-28

申请人： Seon Mo Son ,  Kyung Mo Park ,  Sung Tae Ahn ,  Yong Kim

发明人： Seon Mo Son ,  Kyung Mo Park ,  Sung Tae Ahn ,  Yong Kim

IPC分类号： C08K5/52 ,  C08L69/00 ,  C08K5/42 ,  C08K5/521 ,  C08L33/12 ,  C08L27/18 ,  C08K5/523 ,  C08L25/12

CPC分类号： C08L69/00 ,  C08K5/42 ,  C08K5/521 ,  C08K5/523 ,  C08L25/12 ,  C08L27/18 ,  C08L33/12 ,  C08L2666/04

摘要： A polycarbonate resin composition is provided. The composition comprises (A) 50 to 90% by weight of a polycarbonate resin, (B) 5 to 30% by weight of a polymethyl methacrylate resin, (C) 5 to 20% by weight of a phosphate compound, (D) 0.01 to 2% by weight of a metal sulfonate as an organic salt, and (E) 0.05 to 2% by weight of a fluorinated olefin. The composition is highly flame retardant and scratch resistant.

摘要翻译： 提供聚碳酸酯树脂组合物。 该组合物包含（A）50〜90重量％的聚碳酸酯树脂，（B）5〜30重量％的聚甲基丙烯酸甲酯树脂，（C）5〜20重量％的磷酸酯化合物，（D）0.01 至2重量％的作为有机盐的金属磺酸盐，和（E）0.05至2重量％的氟化烯烃。 该组合物具有高度阻燃和耐划伤性。