摘要:
A field-effect transistor for a narrow-body, multiple-gate transistor such as a FinFET, tri-gate or Ω-FET is described. The corners of the channel region disposed beneath the gate are rounded n, for instance, oxidation steps, to reduce the comer effect associated with conduction initiating in the corners of the channel region.
摘要:
A method of fabricating a MOS transistor having a thinned channel region is described. The channel region is etched following removal of a dummy gate. The source and drain regions have relatively low resistance with the process.
摘要:
An embodiment of the present invention is a technique to fabricate a semiconductor device having low off state leakage current. A gate structure of a first device is formed on a substrate layer having a hardmask. A channel is formed underneath the gate structure having a width to support the gate structure. An oxide or a dielectric layer is deposited on the substrate layer. A doped polysilicon layer is deposited on the oxide layer. A recessed junction area is formed on the doped polysilicon layer between the first device and an adjacent device.
摘要:
A structure to form an energy well within a Carbon nanotube is described. The structure includes a doped semiconductor region and an undoped semiconductor region. The Carbon nanotube is between the doped semiconductor region and the undoped semiconductor region. The structure also includes a delta doped semiconductor region. The undoped semiconductor region is between the Carbon nanotube and the delta doped region. The delta doped semiconductor region is doped opposite that of the doped semiconductor region.
摘要:
The fabrication of a tri-gate transistor formed with a replacement gate process is described. A nitride dummy gate, in one embodiment, is used allowing the growth of epitaxial source and drain regions immediately adjacent to the dummy gate. This reduces the external resistance.
摘要:
A method of patterning a semiconductor film is described. According to an embodiment of the present invention, a hard mask material is formed on a silicon film having a global crystal orientation wherein the semiconductor film has a first crystal plane and second crystal plane, wherein the first crystal plane is denser than the second crystal plane and wherein the hard mask is formed on the second crystal plane. Next, the hard mask and semiconductor film are patterned into a hard mask covered semiconductor structure. The hard mask covered semiconductor structured is then exposed to a wet etch process which has sufficient chemical strength to etch the second crystal plane but insufficient chemical strength to etch the first crystal plane.
摘要:
A structure to form an energy well within a Carbon nanotube is described. The structure includes a doped semiconductor region and an undoped semiconductor region. The Carbon nanotube is between the doped semiconductor region and the undoped semiconductor region. The structure also includes a delta doped semiconductor region. The undoped semiconductor region is between the Carbon nanotube and the delta doped region. The delta doped semiconductor region is doped opposite that of the doped semiconductor region.
摘要:
A top metal gate carbon nanotube transistor may be provided which has acceptable electrical characteristics. The transistor may be formed over a structure including a semiconductor substrate made of an epitaxial layer and covered with an insulating layer. The carbon nanotubes may be deposited thereover, source and drains defined, and a metal gate electrode applied over a high dielectric constant gate dielectric. The processing may be such that the carbon nanotubes are protected from high temperature processing and excessively oxidizing atmospheres.
摘要:
A nanotube transistor, such as a carbon nanotube transistor, may be formed with a top gate electrode and a spaced source and drain. Conduction along the transistor from source to drain is controlled by the gate electrode. Underlying the gate electrode are at least two nanotubes. In some embodiments, the substrate may act as a back gate.
摘要:
A method for providing halo implants in a tri-gate structure is described. Implantation is performed at two different angels to assure a halo for the top transistor and a halo for the side transistors.