摘要:
Recombinant Bombyx mori nuclear polyhedrosis viruses having, in the polyhedral protein-encoding structural gene portion of the Bombyx mori nuclear polyhedrosis virus DNA (BmNPV DNA), a structural gene for a desired protein as joined to the whole of or a part of the polyhedral protein-encoding structural gene with or without interposition of a linker base sequence are provided.By propagating the above viruses in silkworm-derived cells or silkworms, fused proteins of a desired protein and the whole of or a part of the polyhedral protein as joined together with or without interposition of a linking amino acid or peptide are produced. The desired proteins can be obtained from the fused proteins by cleavage or decomposition at the linking site.
摘要:
A method of producing useful substances which comprising propagating in cultured cells or in a host a recombinant Bombyx mori nuclear polydegrosis virus (BmNPV) DNA is disclosed. The BmNPV DNA is produced by recombination with a double-stranded DNA containing (i) a 5'-upstream BmNPV DNA fragment orginally occurring upstream from the structural gene coding for the production of polyhedral protein and also including the promoter region for the structural gene, (ii) a translational start codon and (iii) a gene coding for the production of a useful substance exogenous to the virus, with or without (iv) a 3'-downstream BmNPV DNA fragment originally occurring downstream from the structural gene coding for the production of polyhedral protein.
摘要:
A silicon wafer for preventing a void defect in a bulk region from becoming source of contamination and slip generation in a device process is provided. And a heat-treating method thereof for reducing crystal defects such as COP in a region near the wafer surface to be a device active region is provided. The silicon wafer has a surface region 1 which is a defect-free region and a bulk region 2 including void defect of a polyhedron whose basic shape is an octahedron in which a corner portion of the polyhedron is in the curved shape and an inner-wall oxide film the void defect is removed. The silicon wafer is provided by performing a heat-treating method in which gas to be supplied, inner pressure of spaces and a maximum achievable temperature are set to a predetermined value when subjecting the silicon wafer produced by a CZ method to RTP.
摘要:
In a three-phase, four-pole, four-parallel-circuit stator winding of an electrical rotating machine, each of two sets of U-phase output terminals U1, U2 is formed of two sets of parallel circuits each formed of windings having a same pitch (one is formed of first and second winding circuits 1, 2 and the other is formed of third and fourth winding circuits 3, 4). The winding of each winding circuit is formed of two serially-connected coil phase bands (coil phase bands a and b form the first winding circuit 1 and coil phase bands c and d, coil phase bands e and f, and coil phase bands g and h form the second, third, and fourth winding circuits 2, 3, 4, respectively). A voltage vector phase difference and a voltage difference between the winding circuits can be eliminated without providing a jumper wire to winding end portions.
摘要:
A steel for nitriding having a chemical composition consisting of, by mass percent, C: 0.07-0.14%, Si: 0.10-0.30%, Mn: 0.4-1.0%, S: 0.005-0.030%, Cr: 1.0-1.5%, Mo: ≦0.05% (including 0%), Al: 0.010% or more to less than 0.10%, V: 0.10-0.25%, optionally at least one element selected from Cu: ≦0.30% and Ni: ≦0.25% [0.61Mn+1.11Cr+0.35Mo+0.47≦2.30], and the balance of Fe and impurities. P, N, Ti and O among the impurities are P: ≦0.030%, N: ≦0.008%, Ti: ≦0.005%, and O: ≦0.0030%. The steel is easily subjected to cutting before nitriding and suitable for use as an automobile ring gear. The nitrided component having a surface hardness of 650-900 HV, core hardness being ≧150 HV, and effective case depth of ≧0.15 mm has excellent bending fatigue strength and surface fatigue strength although the content of Mo is as low as ≦0.05% and has a small amount of expansion caused by nitriding.
摘要:
In a method of heat treating a wafer obtained by slicing a silicon single crystal ingot manufactured by the Czochralski method, a rapid heating/cooling heat treatment is carried out by setting a holding time at an ultimate temperature of 1200° C. or more and a melting point of silicon or less to be equal to or longer than one second and to be equal to or shorter than 60 seconds in a mixed gas atmosphere containing oxygen having an oxygen partial pressure of 1.0% or more and 20% or less and argon, and an oxide film having a thickness of 9.1 nm or less or 24.3 nm or more is thus formed on a surface of the silicon wafer.
摘要:
In a manufacturing method for a silicon wafer, a first heat treatment process is performed on the silicon wafer while introducing a first gas having an oxygen gas in an amount of 0.01 vol. % or more and 1.00 vol. % or less and a rare gas, and a second heat treatment process is performed while stopping introducing the first gas and introducing a second gas having an oxygen gas in an amount of 20 vol. % or more and 100 vol. % or less and a rare gas. In the first heat treatment process, the silicon wafer is rapidly heated to first temperature of 1300° C. or higher and a melting point of silicon or lower at a first heating rate, and kept at the first temperature. In the second heat treatment process, the silicon wafer is kept at the first temperature, and rapidly cooled from the first temperature at a first cooling rate.
摘要:
A process for producing a single-crystal semiconductor and an apparatus therefor. A single-crystal semiconductor of large diameter and large weight can be lifted with the use of existing equipment not having any substantial change thereto while not influencing the oxygen concentration of single-crystal semiconductor and the temperature of melt and while not unduly raising the temperature of seed crystal. In particular, the relationship (L1, L2, L3) between the allowable temperature difference (ΔT) and the diameter (D) of seed crystal (14) is preset so that the temperature difference between the seed crystal (14) at the time the seed crystal (14) is immersed in the melt and the melt (5) falls within the allowable temperature difference (ΔT) at which dislocations are not introduced into the seed crystal (14). In accordance with the relationship (L1, L2, L3), the allowable temperature difference (ΔT) corresponding to the diameter (D) of seed crystal (14) to be immersed in the melt is determined. Temperature control is conducted so that at the time the seed crystal (14) is immersed in the melt (5) the temperature difference between the seed crystal (14) and the melt (5) falls within the determined allowable temperature difference (ΔT).
摘要:
In order to control an actual temperature of a vapor generated by en evaporator (3) for heating water by an exhaust gas from an engine (1) to a target vapor temperature by varying the amount of water supplied from a supplied-water amount control injector (7), a control unit (11) controls the amount of water supplied in a feedforward manner in accordance to an engine rotational speed and an intake negative pressure and controls the amount of water supplied in a feedback manner based on a difference between the actual vapor temperature and the target vapor temperature. It is possible to control the actual temperature of the vapor generated by the evaporator (3) to the target vapor temperature with a high accuracy even in a transient state of the engine (1) by correcting a feedforward control value using at least one of a fuel-cut control signal, an ignition-retarding control signal, an EGR control signal and an air fuel ratio control signal which are parameters indicating a burned state of the engine (1).
摘要:
The fuel injection valve controller steadily detects the completion of opening of the fuel injection valve or the completion of the needle valve lifting movement. A current flowing through the electromagnetic coil 4 which drives the fuel infection valve, is measured based on the voltage difference V across the resistor R6 connected in series with the coil 4. The circuit 21 emphasizes changes in the coil current. The signal V2 representative of emphasized coil current is supplied to the current change detecting circuit 22 which generates the output signal V3 when the coil current or voltage signal V2 temporarily decreases. The signal V3 is compared with the reference voltage Vref to issue the signal S3 showing the full opening of the fuel injection valve.