公开(公告)号：US20160124323A1

公开(公告)日：2016-05-05

申请号：US14706871

申请日：2015-05-07

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Hsueh-Yi CHUNG ,  Yung-Cheng CHEN ,  Fei-Gwo TSAI ,  Chi-Hung LIAO ,  Shih-Chi FU ,  Wei-Ti HSU ,  Jui-Ping CHUANG ,  Tzong-Sheng CHANG ,  Kuei-Shun CHEN ,  Meng-Wei CHEN

IPC分类号： G03F7/20 ,  H01L21/66

CPC分类号： G03F7/70433 ,  G03F1/50 ,  G03F1/68 ,  G03F1/70 ,  G03F1/78 ,  G03F7/20 ,  G03F7/70141 ,  G03F7/70158 ,  G03F7/70716 ,  H01L22/30

摘要： A method for exposing a wafer substrate includes forming a reticle having a device pattern. A relative orientation between the device pattern and a mask field of an exposure tool is determined based on mask field utilization. The reticle is loaded on the exposure tool. The wafer substrate is rotated based on an orientation of the device pattern. Radiation is projected through the reticle onto the rotated wafer substrate by the exposure tool, thereby imaging the device pattern onto the rotated wafer substrate.

摘要翻译： 曝光晶片衬底的方法包括形成具有器件图案的掩模版。 基于掩模场利用率确定曝光工具的装置图案和掩模场之间的相对取向。 掩模版装载在曝光工具上。 基于装置图案的取向旋转晶片基板。 通过曝光工具将辐射通过掩模版投影到旋转的晶片衬底上，从而将器件图案成像到旋转的晶片衬底上。

公开(公告)号：US20210263425A1

公开(公告)日：2021-08-26

申请号：US17315087

申请日：2021-05-07

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

发明人： Hsueh-Yi CHUNG ,  Yung-Cheng CHEN ,  Fei-Gwo TSAI ,  Chi-Hung LIAO ,  Shih-Chi FU ,  Wei-Ti HSU ,  Jui-Ping CHUANG ,  Tzong-Sheng CHANG ,  Kuei-Shun CHEN ,  Meng-Wei CHEN

IPC分类号： G03F7/20 ,  G03F1/70 ,  G03F1/78 ,  G03F1/50 ,  G03F1/68

摘要： A method includes receiving a device design layout and a scribe line design layout surrounding the device design layout. The device design layout and the scribe line design layout are rotated in different directions. An optical proximity correction (OPC) process is performed on the rotated device design layout and the rotated scribe line design layout. A reticle includes the device design layout and the scribe line design layout is formed after performing the OPC process.

公开(公告)号：US20190049848A1

公开(公告)日：2019-02-14

申请号：US16160894

申请日：2018-10-15

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

发明人： Yi-Rem CHEN ,  Ming-Shane LU ,  Chung-Hao CHANG ,  Jui-Ping CHUANG ,  Li-Kong TURN ,  Fei-Gwo TSAI

IPC分类号： G03F7/30 ,  H01L21/67

摘要： A developing method comprises steps as follows. A wafer is rotated. A developer solution is dispensed onto the rotated wafer through a first nozzle. The first nozzle is moved back and forth between a first position and a second position, in which moving the first nozzle back and forth is performed such that the first nozzle moving forward to the second position is reversed at the second position and that the first nozzle moving forward to the first position is reversed at the first position, and the first position and the second position are directly over the wafer, and the developer solution is dispensed through the first nozzle when moving the first nozzle back and forth between the first position and the second position.

公开(公告)号：US20200241421A1

公开(公告)日：2020-07-30

申请号：US16849818

申请日：2020-04-15

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

发明人： Yi-Rem CHEN ,  Ming-Shane LU ,  Chung-Hao CHANG ,  Jui-Ping CHUANG ,  Li-Kong TURN ,  Fei-Gwo TSAI

IPC分类号： G03F7/30 ,  H01L21/67

摘要： A developing method is provided. The developing method includes rotating a wafer. The developing method also includes dispensing, through a first nozzle, a developer solution onto the rotated wafer through a first nozzle at a first rotating speed. The developing method further includes dispensing, through a second nozzle, a rinse solution onto the rotated wafer through a second nozzle at a second rotating speed. The second rotating speed is less than the first rotating speed. In addition, the developing method includes simultaneously moving the first nozzle and the second nozzle during either the dispensing of the developer solution or the dispensing of the rinse solution.

公开(公告)号：US20200150546A1

公开(公告)日：2020-05-14

申请号：US16740256

申请日：2020-01-10

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

发明人： Hsueh-Yi CHUNG ,  Yung-Cheng CHEN ,  Fei-Gwo TSAI ,  Chi-Hung LIAO ,  Shih-Chi FU ,  Wei-Ti HSU ,  Jui-Ping CHUANG ,  Tzong-Sheng CHANG ,  Kuei-Shun CHEN ,  Meng-Wei CHEN

IPC分类号： G03F7/20 ,  G03F1/68 ,  G03F1/50 ,  G03F1/78 ,  G03F1/70

摘要： A method for exposing a wafer substrate includes forming a reticle having a device pattern. A relative orientation between the device pattern and a mask field of an exposure tool is determined based on mask field utilization. The reticle is loaded on the exposure tool. The wafer substrate is rotated based on an orientation of the device pattern. Radiation is projected through the reticle onto the rotated wafer substrate by the exposure tool, thereby imaging the device pattern onto the rotated wafer substrate.

公开(公告)号：US20190004436A1

公开(公告)日：2019-01-03

申请号：US16127017

申请日：2018-09-10

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

发明人： Hsueh-Yi CHUNG ,  Yung-Cheng CHEN ,  Fei-Gwo TSAI ,  Chi-Hung LIAO ,  Shih-Chi FU ,  Wei-Ti HSU ,  Jui-Ping CHUANG ,  Tzong-Sheng CHANG ,  Kuei-Shun CHEN ,  Meng-Wei CHEN

IPC分类号： G03F7/20 ,  G03F1/50 ,  G03F1/78 ,  G03F1/70 ,  G03F1/68 ,  H01L21/66

CPC分类号： G03F7/70433 ,  G03F1/50 ,  G03F1/68 ,  G03F1/70 ,  G03F1/78 ,  G03F7/20 ,  G03F7/70141 ,  G03F7/70158 ,  G03F7/70716 ,  H01L22/30

摘要： A method for exposing a wafer substrate includes forming a reticle having a device pattern. A relative orientation between the device pattern and a mask field of an exposure tool is determined based on mask field utilization. The reticle is loaded on the exposure tool. The wafer substrate is rotated based on an orientation of the device pattern. Radiation is projected through the reticle onto the rotated wafer substrate by the exposure tool, thereby imaging the device pattern onto the rotated wafer substrate.

公开(公告)号：US20170343899A1

公开(公告)日：2017-11-30

申请号：US15676925

申请日：2017-08-14

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

发明人： Yi-Rem CHEN ,  Ming-Shane LU ,  Chung-Hao CHANG ,  Jui-Ping CHUANG ,  Li-Kong TURN ,  Fei-Gwo TSAI

IPC分类号： G03F7/30 ,  H01L21/67

CPC分类号： G03F7/3021 ,  H01L21/67051 ,  H01L21/6715

摘要： A developing method includes rotating a wafer. A developer solution is dispensed onto the rotated wafer through a first nozzle. The first nozzle is moved from a first position to a second position. The first position and the second position are over the wafer and within a perimeter of the wafer when viewed from a top of the wafer. The developer solution is dispensed through the first nozzle when moving the first nozzle from the first position to the second position. The first nozzle is moved back from the second position to the first position immediately after the first nozzle is moved from the first position to the second position. The developer solution is dispensed through the first nozzle when moving the first nozzle from the second position to the first position.