公开(公告)号：US20180148076A1

公开(公告)日：2018-05-31

申请号：US15645980

申请日：2017-07-10

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

发明人： Shih-Hung CHIEN ,  Jen-Ti WANG ,  Fu-Hsien LI ,  Chih-Hung LIU ,  Yung-Lin HSU

IPC分类号： B61L23/04 ,  B61B13/00 ,  B60M1/12

CPC分类号： B61L23/044 ,  B60M1/12 ,  B60M1/28 ,  B61B13/00 ,  B61D3/02 ,  B61K9/08 ,  B61L23/047 ,  B61L25/025

摘要： A monitor vehicle for a rail system includes a wheeled trolley, an overhead vehicle body, at least one supporting structure, and at least one first sensor. The wheeled trolley is operable to move over one or more rails of the rail system. The supporting structure connects the wheeled trolley and overhead vehicle body. The first sensor is on the wheeled trolley and configured to detect at least one first parameter of the one or more rails of the rail system.

公开(公告)号：US20190163170A1

公开(公告)日：2019-05-30

申请号：US15883497

申请日：2018-01-30

申请人： Taiwan Semiconductor Manufacturing Co., Ltd

发明人： Yung-Lin HSU ,  Richard LIN ,  Chiung-Min LIN ,  Alan YANG

IPC分类号： G05B19/418

CPC分类号： G05B19/41815 ,  G05B2219/45031 ,  H01L21/67276 ,  H01L21/67703 ,  H01L21/67727 ,  H01L21/6773 ,  H01L21/67733 ,  H01L21/67736

摘要： In an embodiment an automated material handling system (AMHS) for a semiconductor fabrication facility (FAB) includes: a sensor supported by a rail, wherein the sensor is configured to collect sensor data characterizing a vehicle that moves along the rail, wherein the vehicle is configured to carry at least one wafer; and a monitoring module configured to: detect a trigger event based on the sensor data, and initiate a remediation action in response to the trigger event.

公开(公告)号：US20200062285A1

公开(公告)日：2020-02-27

申请号：US16673678

申请日：2019-11-04

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

发明人： Shih-Hung CHIEN ,  Jen-Ti WANG ,  Fu-Hsien LI ,  Chih-Hung LIU ,  Yung-Lin HSU

IPC分类号： B61L23/04 ,  B60M1/12 ,  B61B13/00 ,  B61L25/02 ,  B60M1/28 ,  B61D3/02 ,  B61K9/08

摘要： A monitor vehicle for a rail system includes a wheeled trolley, an overhead vehicle, a supporting structure, and a first sensor. The wheeled trolley is above a rail of the rail system, is operable to move over the rail, and has a bottom surface. The overhead vehicle body is suspended by the wheeled trolley and below the rail. The supporting structure connects the wheeled trolley and the overhead vehicle body. The first sensor is on the bottom surface of the wheeled trolley and is configured to detect a first parameter of the rail of the rail system.

公开(公告)号：US20230178401A1

公开(公告)日：2023-06-08

申请号：US18104731

申请日：2023-02-01

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chun-Jung HUANG ,  Yung-Lin HSU ,  Kuang Huan HSU ,  Jeff CHEN ,  Steven HUANG ,  Yueh-Lun YANG

IPC分类号： H01L21/677 ,  H01L21/67

CPC分类号： H01L21/67703 ,  H01L21/67196 ,  H01L21/67727

摘要： In an embodiment, a system, includes: a first pressurized load port interfaced with a workstation body; a second pressurized load port interfaced with the workstation body; the workstation body maintained at a set pressure level, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first and second pressurized load ports at the set pressure level; a first modular tool interfaced with the first pressurized load port, wherein the first modular tool is configured to process the semiconductor workpiece; and a second modular tool interfaced with the second pressurized load port, wherein the second modular tool is configured to inspect the semiconductor workpiece processed by the first modular tool.

公开(公告)号：US20210265187A1

公开(公告)日：2021-08-26

申请号：US17317747

申请日：2021-05-11

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chun-Jung HUANG ,  Yung-Lin HSU ,  Kuang Huan HSU ,  Jeff CHEN ,  Steven HUANG ,  Yueh-Lun YANG

IPC分类号： H01L21/677 ,  H01L21/67

摘要： In an embodiment, a system, includes: a first pressurized load port interfaced with a workstation body; a second pressurized load port interfaced with the workstation body; the workstation body maintained at a set pressure level, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first and second pressurized load ports at the set pressure level; a first modular tool interfaced with the first pressurized load port, wherein the first modular tool is configured to process the semiconductor workpiece; and a second modular tool interfaced with the second pressurized load port, wherein the second modular tool is configured to inspect the semiconductor workpiece processed by the first modular tool.

公开(公告)号：US20240136213A1

公开(公告)日：2024-04-25

申请号：US18403613

申请日：2024-01-03

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chun-Jung HUANG ,  Yung-Lin HSU ,  Kuang Huan HSU ,  Jeff CHEN ,  Steven HUANG ,  Yueh-Lun YANG

IPC分类号： H01L21/677 ,  H01L21/67

CPC分类号： H01L21/67703 ,  H01L21/67196 ,  H01L21/67727

摘要： In an embodiment, a system, includes: a first pressurized load port interfaced with a workstation body; a second pressurized load port interfaced with the workstation body; the workstation body maintained at a set pressure level, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first and second pressurized load ports at the set pressure level; a first modular tool interfaced with the first pressurized load port, wherein the first modular tool is configured to process the semiconductor workpiece; and a second modular tool interfaced with the second pressurized load port, wherein the second modular tool is configured to inspect the semiconductor workpiece processed by the first modular tool.

公开(公告)号：US20230230839A1

公开(公告)日：2023-07-20

申请号：US18126861

申请日：2023-03-27

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chun-Jung HUANG ,  Li-Hsin CHU ,  Po-Feng TSAI ,  Henry PENG ,  Kuang Huan HSU ,  Tsung Wei CHEN ,  Yung-Lin HSU

IPC分类号： H01L21/265 ,  C23C14/54 ,  C23C14/48 ,  H01L21/66

CPC分类号： H01L21/26586 ,  C23C14/54 ,  C23C14/48 ,  H01L22/14

摘要： The present disclosure describes a system and a method for an ion implantation (IMP) process. The system includes an ion implanter configured to scan an ion beam over a target for a range of angles, a tilting mechanism configured to support and tilt the target, an ion-collecting device configured to collect a distribution and a number of ejected ions from the ion beam scan over the target, and a control unit configured to adjust a tilt angle based on a correction angle determined based on the distribution and number of ejected ions.