公开(公告)号：US20180265731A1

公开(公告)日：2018-09-20

申请号：US15761348

申请日：2016-09-23

申请人： TEIJIN LIMITED ,  TSUKISHIMA KIKAI CO., LTD.

发明人： Tatsuya EKINAKA ,  Tatsuichirou KON ,  Takehiro SUGA ,  Hiroshi KISHIMOTO ,  Yume MORITA ,  Satoshi OGATA ,  Masato NAKAGOMI

IPC分类号： C09D133/12 ,  C23C16/56 ,  C23C16/42 ,  C23C16/50 ,  C09D133/10 ,  C09D7/62

CPC分类号： C09D133/12 ,  B32B7/02 ,  B32B9/00 ,  C08J7/04 ,  C08J7/047 ,  C08J2369/00 ,  C08J2433/00 ,  C09D7/40 ,  C09D7/62 ,  C09D133/10 ,  C23C16/0218 ,  C23C16/0272 ,  C23C16/401 ,  C23C16/402 ,  C23C16/42 ,  C23C16/50 ,  C23C16/5096 ,  C23C16/56 ,  C23C28/00

摘要： The present invention provides a polymer substrate with a hardcoat layer exhibiting excellent environmental resistance and wear resistance. A polymer substrate (60) is 1-20 mm thick and a hardcoat layer (70, 80) on the surface thereof comprises: an underlayer cured layer (70) with a thickness of 1-20 μm, and including 10-90 parts by weight of a multifunctional acrylate, and 90-10 parts by weight of inorganic oxide fine particles and/or a silicon compound hydrolytic condensate; and a silicon oxide layer (80) which is in direct contract with the underlayer cured layer, is formed by PE-CVD with an organosilicon compound as the starter material, and satisfies all of the following conditions (a)-(c): (a) the film thickness of the silicon oxide layer is 3.5-9.0 μm; (b) the maximum indentation depth of the surface of the silicon oxide layer by nanoindentation measurement at a maximum load of 1 mN is 150 nm or less; and (c) the limit compression ratio K of the silicon oxide layer is at most 0.975 in a 3-point bending test of the polymer substrate with a hardcoat layer having been subjected to indentation deformation that causes the surface on which the silicon oxide layer is layered to be indented.

公开(公告)号：US20200377682A1

公开(公告)日：2020-12-03

申请号：US16497157

申请日：2018-03-28

申请人： TEIJIN LIMITED ,  TSUKISHIMA KIKAI CO., LTD.

发明人： Tatsuya EKINAKA ,  Tatsuichirou KON ,  Hiroshi KISHIMOTO ,  Yume TAKEDA ,  Takehiro SUGA ,  Satoshi OGATA ,  Masato NAKAGOMI

IPC分类号： C08J7/046 ,  C23C16/40 ,  C08J7/04 ,  C23C16/50

摘要： The present invention is a polymer substrate with a hard coat layer, which is obtained by directly laminating a polymer substrate, a base cured layer and a silicon oxide layer, wherein the base cured layer has a thickness of 1-20 μm and contains 10-90 parts by weight of a polyfunctional acrylate and 90-10 parts by weight of inorganic oxide fine particles and/or a hydrolytic condensation product of a silicon compound or contains a hydrolytic condensation product of an organic silicon compound as a primary component, and the silicon oxide layer satisfies requirement (a1) below at a position 0.04 μm in the thickness direction from the interface between the base cured layer and the silicon oxide layer and satisfies requirement (a3) below at the surface of the silicon oxide layer on the opposite side from the interface, Requirement (a1): when the chemical composition is represented by SiOxCyHz, x falls within the range 1.93-1.98, y falls within the range 0.04-0.15 and z falls within the range 0.10-0.50. Requirement (a3): when the chemical composition is represented by SiOxCyHz, x falls within the range 1.94-2.02, y falls within the range 0.05-0.16 and z falls within the range 0.20-0.50.

公开(公告)号：US20170107345A1

公开(公告)日：2017-04-20

申请号：US15127035

申请日：2015-03-27

申请人： TEIJIN LIMITED ,  TSUKISHIMA KIKAI CO., LTD.

发明人： Tatsuichirou KON ,  Tatsuya EKINAKA ,  Hiroshi KISHIMOTO ,  Yume MORITA ,  Takehiro SUGA ,  Satoshi OGATA ,  Masato NAKAGOMI

IPC分类号： C08J7/04 ,  C23C16/02 ,  C23C16/40 ,  C23C16/50 ,  C08J7/12 ,  B05D3/02

CPC分类号： C08J7/045 ,  B05D3/0254 ,  B05D7/02 ,  C08J7/047 ,  C08J7/123 ,  C08J2369/00 ,  C08J2433/08 ,  C08J2483/04 ,  C09D183/04 ,  C23C16/02 ,  C23C16/0254 ,  C23C16/0272 ,  C23C16/401 ,  C23C16/402 ,  C23C16/45565 ,  C23C16/45572 ,  C23C16/50 ,  C23C16/5096 ,  C23C16/56 ,  C23C18/122 ,  C23C18/1233 ,  C23C18/1254 ,  H01J37/32091 ,  C08K3/36

摘要： The present invention realizes a polymer substrate with hard coating layer comprising a high level of environmental resistance and a high level of abrasion resistance.A polymer substrate with hard coating layer is provided that comprises a polymer substrate (60) having a thickness of 1 mm to 20 mm and a hard coating layer (70,80) on the surface thereof. Here, in this polymer substrate with hard coating layer, the hard coating layer (70,80) is laminated on the surface of the polymer substrate, contains as a main component thereof a hydrolysis-condensation product of an organic silicon compound, has a thickness of 0.1 μm to 20 μm, makes direct contact with a cured underlayer on the opposite side of the polymer substrate, is formed from an organic silicon compound by PE-CVD, and satisfies all of the following requirements (a) to (c): (a) film thickness of the silicon oxide layer is within the range of 3.5 μm to 9.0 μm, (b) maximum indentation depth of the surface of the silicon oxide layer as determined by measuring nanoindentation under conditions of a maximum load of 1 mN is 150 nm or less, and (c) the value of critical compression ratio K of the silicon oxide layer, as defined by formula (1) in a 3-point bending test of the polymer substrate with hard coating layer that imparts indentation displacement in which the surface laminated with the silicon oxide layer becomes concave, is 0.975 or less.