NOVEL COMPOUND
    2.
    发明申请
    NOVEL COMPOUND 审中-公开
    新型化合物

    公开(公告)号:US20160170302A1

    公开(公告)日:2016-06-16

    申请号:US15053246

    申请日:2016-02-25

    IPC分类号: G03F7/085 G03F7/004

    摘要: A novel compound suitable for obtaining a negative-type photosensitive resin composition capable of forming a pattern having favorable adhesiveness at a low light exposure. The compound is represented by the following formula (1). In the formula, R1 and R2 each independently represents a hydrogen atom or an organic group, but at least one represents an organic group. R1 and R2 may be bonded to form a ring structure and may contain a hetero atom bond. R3 represents a single bond or an organic group. R4 to R9 each independently represents a hydrogen atom, an organic group, etc., but R6 and R7 are not hydroxyl groups. R10 represents a hydrogen atom or an organic group.

    摘要翻译: 一种适用于获得能够在低光照下形成具有良好粘合性的图案的负型感光性树脂组合物的新型化合物。 该化合物由下式(1)表示。 在该式中,R 1和R 2各自独立地表示氢原子或有机基团,但至少1个表示有机基团。 R 1和R 2可以键合形成环结构并且可以含有杂原子键。 R3表示单键或有机基团。 R 4〜R 9各自独立地表示氢原子,有机基团等,但R 6和R 7不是羟基。 R 10表示氢原子或有机基团。

    PHOTOSENSITIVE COMPOSITION, CURED PRODUCT, AND METHOD FOR PRODUCING CURED PRODUCT

    公开(公告)号:US20230038195A1

    公开(公告)日:2023-02-09

    申请号:US17756434

    申请日:2020-11-20

    IPC分类号: G03F7/031 G03F7/00

    摘要: A photosensitive composition capable of forming a cured product with high transparency, a cured product of the photosensitive composition, and a method for producing the cured product using the photosensitive composition. In a photosensitive composition including a base component having photopolymerizability and a photopolymerization initiator, a phosphine oxide compound and an oxime ester compound as a photopolymerization initiator are used in combination such that the ratio of the mass W2 of the oxime ester compound is 35% by mass or more relative to sum of a mass W1 of the phosphine oxide compound and the mass W2 of the oxime ester compound.

    WAVELENGTH CONVERSION FILM, WAVELENGTH CONVERSION FILM FORMING COMPOSITION, AND CLUSTER-CONTAINING QUANTUM DOT PRODUCTION METHOD

    公开(公告)号:US20220389308A1

    公开(公告)日:2022-12-08

    申请号:US17627374

    申请日:2020-07-10

    IPC分类号: C09K11/02 C09K11/70 C09K11/08

    摘要: The objective of the invention is to provide a wavelength conversion film demonstrating a high optical density, a wavelength conversion film forming composition used suitably for forming the wavelength conversion film, and a production method for a cluster-containing quantum dot that may be applied suitably to the wavelength conversion film and the wavelength conversion film forming composition. In this invention, for a wavelength conversion film containing a quantum dot converting blue light into red light or green light, the light beam transmittance of the wavelength conversion film at 450 nm wavelength is set to 40% or lower, the light beam transmittance of the wavelength conversion film at 650 nm wavelength is set to 90% or higher if the hue of the light beam after the wavelength conversion is red, and the light beam transmittance of the wavelength conversion film at 550 nm wavelength is set to 90% or higher if the hue of the light beam after the wavelength conversion is green.

    ENERGY-SENSITIVE RESIN COMPOSITION
    9.
    发明申请

    公开(公告)号:US20190225804A1

    公开(公告)日:2019-07-25

    申请号:US15558434

    申请日:2016-03-24

    摘要: An energy-sensitive resin composition with which it is possible, even if the precursor polymer is heat-treated at low temperatures, to produce a film or molded article comprising an imide ring-containing polymer having excellent heat resistance, tensile elongation and chemical resistance with a low dielectric constant, or a film or molded article comprising an oxazole ring-containing polymer having excellent heat resistance, tensile elongation and chemical resistance. A method of manufacturing the film or molded article; a method of forming a pattern using the energy-sensitive resin composition; and a permanent film having excellent heat resistance, tensile elongation and chemical resistance. The energy-sensitive resin composition includes an imidazole compound, a resin precursor component, and a solvent, the resin precursor component being at least one of a monomer component including a diamine compound, a dicarbonyl compound and/or a tetracarboxylic acid dianhydride; and a precursor polymer having a repeating unit.